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NVH4L060N090SC1

Onsemi

NVH4L060N090SC1 by Onsemi

NVH4L060N090SC1 by Onsemi is a N-CHANNEL FET with 900V DS Breakdown Voltage, ideal for SWITCHING applications. It features 211A IDM and 162mJ EAS, operating in ENHANCEMENT MODE. With a max power dissipation of 221W and -55 to 175 °C temperature range, it offers reliable performance in various high-power electronic systems.

Median Price

$13.125

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 14 parts In-Stock

1+ parts

$16.050

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14

$16.050

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DigiKey

USA . 1,333 parts In-Stock

1+ parts

$18.890

100+ parts

$11.808

1k+ parts

$10.501

10k+ parts

-

1,333

$18.890

$11.808

$10.501

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Flip Electronics (Authorized)

USA . 19,350 parts In-Stock

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19,350

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Rochester

USA . 775 parts In-Stock

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$10.500

1k+ parts

$9.390

10k+ parts

$8.840

775

-

$10.500

$9.390

$8.840

Verical

USA . 450 parts In-Stock

1+ parts

-

100+ parts

$13.125

1k+ parts

$11.738

10k+ parts

$11.050

450

-

$13.125

$11.738

$11.050

Future Electronics

Canada . 447 parts In-Stock

1+ parts

-

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$10.950

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$10.700

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447

-

$10.950

$10.700

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Distributors (In-Stock)

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IBS Electronics

USA . 447 parts In-Stock

1+ parts

$14.599

100+ parts

$14.118

1k+ parts

$13.910

10k+ parts

-

447

$14.599

$14.118

$13.910

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Vyrian

USA . 1,705 parts In-Stock

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$16.000

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1,705

$16.000

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Digiode

USA . 1,394 parts In-Stock

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$16.929

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1,394

$16.929

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Flip Electronics

USA . 2,250 parts In-Stock

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2,250

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Corohmni

South Africa . 196 parts In-Stock

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$16.000

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196

$16.000

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Corphita

USA . 2,122 parts In-Stock

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$16.038

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2,122

$16.038

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Microchip USA

USA . 6,733 parts In-Stock

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$46.759

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6,733

$46.759

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TANS Electronics

Latvia . 3,672 parts In-Stock

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Kulean Microsystems

USA . 3,334 parts In-Stock

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Problanco Electronics

Mexico . 1,475 parts In-Stock

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UHIMA Technologies

Türkiye . 986 parts In-Stock

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986

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Perfect Parts

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347

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SupplyDigital Components

Austria . 122 parts In-Stock

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Authorized Procurement Solutions

USA . 120 parts In-Stock

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120

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GreenTree Electronics

Israel . 70 parts In-Stock

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70

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Overview

Experience the power of innovation with the NVH4L060N090SC1 by Onsemi. Crafted with precision and reliability, this Power Field Effect Transistor offers unmatched performance in switching applications. With a high DS Breakdown Voltage of 900V and a maximum Drain Current of 46A, this N-CHANNEL transistor delivers superior efficiency and durability. Whether you're in automotive, industrial, or renewable energy sectors, this product's single configuration with built-in diode provides seamless functionality. Trust Onsemi for cutting-edge technology and elevate your projects to new heights with the NVH4L060N090SC1.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good insulation properties and helps in preventing electrical leakage, making the transistor safe to use in various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs are known for their high input impedance and fast switching speed, making them suitable for high-performance applications.

Minimum DS Breakdown Voltage: 900 V

With a high breakdown voltage, this FET can handle high voltages without breakdown, ensuring reliable operation in demanding conditions.

Maximum Power Dissipation (Abs): 221 W

The high power dissipation capability allows the FET to handle large amounts of power without getting damaged, making it suitable for high-power applications.

Maximum Turn Off Time (toff): 67 ns

The fast turn-off time ensures quick switching transitions, reducing power loss and improving overall efficiency of the circuit.

Maximum Drain-Source On Resistance: 0.084 ohm

Low on-resistance results in minimal conduction losses and allows for higher current carrying capacity, making this FET efficient and reliable.

Technical Specifications

Power Field Effect Transistors (FET) NVH4L060N090SC1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

162 mJ

Minimum DS Breakdown Voltage:

900 V

Maximum Drain Current (ID):

46 A

Maximum Drain-Source On Resistance:

.084 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

11 pF

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T4

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

211 A

Reference Standard:

AEC-Q101

Surface Mount:

NO

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON CARBIDE

Maximum Turn Off Time (toff):

67 ns

Maximum Turn On Time (ton):

58 ns

Trade Compliance

NVH4L060N090SC1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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