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NVH4L040N120SC1

Onsemi

NVH4L040N120SC1 by Onsemi

NVH4L040N120SC1 by Onsemi is a N-CHANNEL FET with 1200V DS Breakdown Voltage. It has 232A IDM and 319W Power Dissipation, suitable for SWITCHING applications. Operating from -55 to 175 °C, it features 0.056 ohm Drain-Source Resistance and METAL-OXIDE SEMICONDUCTOR technology.

Median Price

$19.520

Lifecycle Status

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16

In-Stock Inventory

1k+

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Farnell

UK . 665 parts In-Stock

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$12.490

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$11.030

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665

$12.490

$11.030

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Arrow

USA . 390 parts In-Stock

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$16.470

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$16.430

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390

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$16.430

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Chip1Stop

Japan . 390 parts In-Stock

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$17.300

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$17.300

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Element14

Singapore . 885 parts In-Stock

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$18.814

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$17.635

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$17.339

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885

$18.814

$17.635

$17.339

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Mouser Electronics

USA . 224 parts In-Stock

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$20.700

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$20.700

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DigiKey

USA . 221 parts In-Stock

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$22.550

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$16.178

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$22.550

$16.178

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Newark

USA . 860 parts In-Stock

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$26.970

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$24.320

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$24.320

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$26.970

$24.320

$24.320

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RS (Exports)

UK . 410 parts In-Stock

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$21.423

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$21.423

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Rochester

USA . 333 parts In-Stock

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$16.180

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$14.480

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$13.620

333

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$16.180

$14.480

$13.620

Verical

USA . 295 parts In-Stock

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$20.225

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$18.100

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$17.025

295

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$18.100

$17.025

Distributors (In-Stock)

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Digiode

USA . 557 parts In-Stock

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$10.127

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Vyrian

USA . 1,454 parts In-Stock

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$10.660

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Flip Electronics

USA . 184,950 parts In-Stock

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NAC Semi

USA . 900 parts In-Stock

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$25.350

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$25.350

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IBS Electronics

USA . 450 parts In-Stock

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$23.730

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$23.730

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Nova Conductors

Japan . 10 parts In-Stock

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Corphita

USA . 2,383 parts In-Stock

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$9.594

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$9.594

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Corohmni

South Africa . 325 parts In-Stock

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$16.570

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$16.570

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Continental Prestige Electronics

USA . 885 parts In-Stock

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$25.660

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$21.410

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885

$25.660

$21.410

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Microchip USA

USA . 3,774 parts In-Stock

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$92.000

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SupplyDigital Components

Austria . 7,027 parts In-Stock

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TANS Electronics

Latvia . 6,441 parts In-Stock

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Kulean Microsystems

USA . 5,743 parts In-Stock

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Problanco Electronics

Mexico . 2,666 parts In-Stock

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Aranea Global

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Argo Parts USA

USA . 1,565 parts In-Stock

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ChipstoGo Electronic ltd

UK . 440 parts In-Stock

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GreenTree Electronics

Israel . 404 parts In-Stock

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Authorized Procurement Solutions

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UHIMA Technologies

Türkiye . 136 parts In-Stock

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Overview

Experience the unparalleled quality and reliability of Onsemi with the NVH4L040N120SC1 Power Field Effect Transistor. This N-CHANNEL single transistor with built-in diode is ideal for switching applications, offering a maximum pulsed drain current of 232 A and an impressive avalanche energy rating of 578 mJ. With a maximum operating temperature of 175°C and a minimum operating temperature of -55°C, this transistor ensures optimal performance in a wide range of conditions. Trust Onsemi to deliver cutting-edge technology and superior products that meet your power management needs with ease.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, making the transistor reliable in various operating conditions.

Polarity or Channel Type: N-CHANNEL

Enhances the efficiency of the transistor in switching applications, offering better performance and control.

Configuration: SINGLE WITH BUILT-IN DIODE

Simplifies the circuit design and reduces component count, saving space and reducing overall cost.

Transistor Application: SWITCHING

Optimized for fast switching operations, making it suitable for applications where quick response times are essential.

Minimum DS Breakdown Voltage: 1200 V

Provides high voltage tolerance, making the transistor suitable for high-power applications.

Maximum Drain Current (ID): 58 A

Offers high current-handling capability, making it suitable for demanding applications.

Maximum Power Dissipation (Abs): 319 W

Can handle high power levels effectively, ensuring reliable performance under heavy loads.

Maximum Operating Temperature: 175 °C

Can operate in high-temperature environments, increasing the versatility of the transistor.

Technical Specifications

Power Field Effect Transistors (FET) NVH4L040N120SC1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

578 mJ

Minimum DS Breakdown Voltage:

1200 V

Maximum Drain Current (Abs) (ID):

58 A

Maximum Drain Current (ID):

58 A

Maximum Drain-Source On Resistance:

.056 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

11 pF

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T4

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

232 A

Reference Standard:

AEC-Q101

Surface Mount:

NO

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON CARBIDE

Maximum Turn Off Time (toff):

71 ns

Maximum Turn On Time (ton):

66 ns

Trade Compliance

NVH4L040N120SC1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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