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NVH4L015N065SC1

Onsemi

NVH4L015N065SC1 by Onsemi

NVH4L015N065SC1 by Onsemi is a N-CHANNEL FET with 650V DS Breakdown Voltage. It has a max IDM of 859A and ID of 164A, making it suitable for high-power applications. With a package style of FLANGE MOUNT, it operates in temperatures ranging from -55 to 175 °C, ideal for power electronics.

Median Price

$34.010

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

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Mouser Electronics

USA . 380 parts In-Stock

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$34.010

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$34.010

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DigiKey

USA . 1,121 parts In-Stock

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$37.090

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$24.638

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$37.090

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Verical

USA . 450 parts In-Stock

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$31.098

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$31.098

450

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$31.098

$31.098

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Digiode

USA . 1,107 parts In-Stock

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$36.499

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Vyrian

USA . 5,503 parts In-Stock

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Flip Electronics

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NAC Semi

USA . 900 parts In-Stock

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$45.620

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$45.620

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IBS Electronics

USA . 450 parts In-Stock

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$36.128

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450

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$36.128

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Distributors (Availability)

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Corohmni

South Africa . 466 parts In-Stock

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$25.510

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Corphita

USA . 2,405 parts In-Stock

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$34.578

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Microchip USA

USA . 8,090 parts In-Stock

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$114.862

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TANS Electronics

Latvia . 4,391 parts In-Stock

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Problanco Electronics

Mexico . 3,513 parts In-Stock

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Authorized Procurement Solutions

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Perfect Parts

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SupplyDigital Components

Austria . 1,058 parts In-Stock

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GreenTree Electronics

Israel . 966 parts In-Stock

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UHIMA Technologies

Türkiye . 553 parts In-Stock

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Kulean Microsystems

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Overview

Unleash the power of innovation with the NVH4L015N065SC1 by Onsemi. Crafted with precision and expertise, this Power Field Effect Transistor (FET) offers unparalleled performance and reliability. From enhancing power efficiency to optimizing circuit design, this N-CHANNEL transistor is a game-changer in the industry. Whether you're looking to revolutionize your electronics or streamline your operations, the NVH4L015N065SC1 is the solution you've been searching for. Dive into a world of endless possibilities and experience the quality and value that only Onsemi can deliver.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and durable, ensuring easier handling and longer lifespan.

Minimum DS Breakdown Voltage: 650 V

The high minimum breakdown voltage of 650 V makes this FET suitable for high-voltage applications, providing reliable performance under demanding conditions.

Maximum Pulsed Drain Current (IDM): 859 A

The high maximum pulsed drain current of 859 A allows the FET to handle high current spikes effectively, making it ideal for applications requiring high power and efficiency.

Maximum Power Dissipation (Abs): 753 W

With a maximum power dissipation of 753 W, this FET can effectively dissipate heat generated during operation, ensuring stable performance and preventing overheating.

Maximum Operating Temperature: 175 °C

The high maximum operating temperature of 175 °C ensures that the FET can operate reliably in high-temperature environments, expanding its range of applications.

Technical Specifications

Power Field Effect Transistors (FET) NVH4L015N065SC1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Minimum DS Breakdown Voltage:

650 V

Maximum Drain Current (Abs) (ID):

164 A

Maximum Drain Current (ID):

164 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

39.33 pF

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T4

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

859 A

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Element Material:

SILICON CARBIDE

Trade Compliance

NVH4L015N065SC1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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