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NVH4L020N090SC1

Onsemi

NVH4L020N090SC1 by Onsemi

NVH4L020N090SC1 by Onsemi is a N-CHANNEL FET with 900V DS Breakdown Voltage, ideal for SWITCHING applications. It features 504A IDM, 264mJ EAS, and 0.028 ohm RDS(on). With a max power dissipation of 484W and operating temperature range from -55 to 175 °C, it's suitable for high-power environments.

Median Price

$29.610

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

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Mouser Electronics

USA . 450 parts In-Stock

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$30.120

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$30.120

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DigiKey

USA . 449 parts In-Stock

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$30.120

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$30.120

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Chip1Stop

Japan . 330 parts In-Stock

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330

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Rochester

USA . 324 parts In-Stock

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$23.280

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$20.830

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$19.600

324

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$23.280

$20.830

$19.600

Verical

USA . 324 parts In-Stock

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$29.100

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$26.038

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$24.500

324

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$29.100

$26.038

$24.500

Distributors (In-Stock)

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Digiode

USA . 1,027 parts In-Stock

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$33.877

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Vyrian

USA . 5,170 parts In-Stock

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Flip Electronics

USA . 900 parts In-Stock

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900

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NAC Semi

USA . 360 parts In-Stock

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$35.440

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$33.080

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360

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$35.440

$33.080

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Distributors (Availability)

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Corohmni

South Africa . 293 parts In-Stock

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$22.161

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$22.161

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Corphita

USA . 2,303 parts In-Stock

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$32.094

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QUARKTWIN TECHNOLOGY LTD

USA . 19,328 parts In-Stock

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Microchip USA

USA . 9,614 parts In-Stock

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Kulean Microsystems

USA . 6,891 parts In-Stock

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TANS Electronics

Latvia . 6,394 parts In-Stock

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SupplyDigital Components

Austria . 2,414 parts In-Stock

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Perfect Parts

USA . 1,814 parts In-Stock

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Problanco Electronics

Mexico . 1,222 parts In-Stock

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GreenTree Electronics

Israel . 430 parts In-Stock

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Authorized Procurement Solutions

USA . 330 parts In-Stock

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UHIMA Technologies

Türkiye . 210 parts In-Stock

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Overview

Enhance the performance of your electronic devices with the NVH4L020N090SC1 by Onsemi. As a leading manufacturer in the industry, Onsemi ensures top-quality products that meet the highest standards. This Power Field Effect Transistor (FET) is perfect for switching applications, offering a high DS breakdown voltage of 900V. With a single configuration and built-in diode, this transistor provides reliable and efficient operation. Trust Onsemi to deliver cutting-edge technology that guarantees optimal performance and durability. Upgrade your devices with the NVH4L020N090SC1 and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the transistor, ensuring long-lasting performance.

Polarity or Channel Type: N-CHANNEL

Allows for efficient and controlled current flow, making it suitable for various switching applications.

Minimum DS Breakdown Voltage: 900 V

With a high breakdown voltage, this FET can handle high voltages without damage, increasing its reliability.

Maximum Pulsed Drain Current (IDM): 504 A

Capable of handling high current pulses, making it suitable for demanding applications.

Maximum Power Dissipation (Abs): 484 W

Can dissipate a high amount of power, allowing it to operate efficiently even under heavy load conditions.

Maximum Operating Temperature: 175 °C

Can operate at high temperatures, ensuring reliable performance in various environmental conditions.

Maximum Drain-Source On Resistance: 0.028 ohm

Low on-resistance ensures efficient power management and minimal heat dissipation.

Reference Standard: AEC-Q101

Compliance with automotive industry standards, making it suitable for automotive applications.

Technical Specifications

Power Field Effect Transistors (FET) NVH4L020N090SC1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

264 mJ

Minimum DS Breakdown Voltage:

900 V

Maximum Drain Current (ID):

116 A

Maximum Drain-Source On Resistance:

.028 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

24 pF

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T4

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

504 A

Reference Standard:

AEC-Q101

Surface Mount:

NO

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON CARBIDE

Trade Compliance

NVH4L020N090SC1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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