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NVH4L060N065SC1

Onsemi

NVH4L060N065SC1 by Onsemi

NVH4L060N065SC1 by Onsemi is a N-CHANNEL Power FET with 650V DS Breakdown Voltage. It features 232A Max Pulsed Drain Current and 269W Max Power Dissipation, suitable for high-power applications in industrial electronics and power supplies.

Median Price

$10.320

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

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Arrow

USA . 30 parts In-Stock

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$2.336

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Newark

USA . 29 parts In-Stock

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$7.230

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Verical

USA . 94 parts In-Stock

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$9.283

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Chip1Stop

Japan . 30 parts In-Stock

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$9.710

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Future Electronics

Canada . 40 parts In-Stock

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$10.930

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$10.560

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$10.410

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DigiKey

USA . 438 parts In-Stock

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$13.600

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$8.480

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Mouser Electronics

USA . 36 parts In-Stock

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Element14

Singapore . 36 parts In-Stock

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$32.920

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$27.150

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EBV Elektronik

Germany . 2,250 parts In-Stock

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Digiode

USA . 2,176 parts In-Stock

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$6.868

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Vyrian

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NAC Semi

USA . 1,800 parts In-Stock

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$47.700

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Flip Electronics

USA . 900 parts In-Stock

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Corohmni

South Africa . 467 parts In-Stock

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$3.816

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Corphita

USA . 1,321 parts In-Stock

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Microchip USA

USA . 2,368 parts In-Stock

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Problanco Electronics

Mexico . 8,289 parts In-Stock

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TANS Electronics

Latvia . 3,380 parts In-Stock

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Kulean Microsystems

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SupplyDigital Components

Austria . 1,361 parts In-Stock

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UHIMA Technologies

Türkiye . 860 parts In-Stock

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GreenTree Electronics

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Authorized Procurement Solutions

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Eastek

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Overview

Unleash the power of innovation with the NVH4L060N065SC1 by Onsemi. Crafted with precision and expertise, this Power Field Effect Transistor offers unrivaled quality and reliability for a wide range of applications. With its single configuration and built-in diode, this N-CHANNEL transistor delivers exceptional performance and efficiency. Experience maximum power dissipation of 269 W and operating temperatures up to 175 °C, making it the ideal choice for demanding environments. Elevate your projects with the NVH4L060N065SC1 and unlock endless possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good insulation and protection for the transistor, making it durable and reliable for long-term use.

Minimum DS Breakdown Voltage: 650 V

With a high breakdown voltage, this transistor can handle high voltage operation without damage, ensuring robust performance in demanding applications.

Operating Mode: ENHANCEMENT MODE

Enhancement mode transistors offer high input impedance and excellent gain characteristics, allowing for efficient control and amplification of signals.

Maximum Pulsed Drain Current (IDM): 232 A

The high pulsed drain current rating allows for handling of short-duration high current spikes, making this transistor suitable for applications with varying load requirements.

Maximum Power Dissipation (Abs): 269 W

With a high power dissipation rating, this transistor can dissipate heat effectively and operate at high power levels without overheating, ensuring reliability in demanding conditions.

Maximum Operating Temperature: 175 °C

The high maximum operating temperature tolerance allows this transistor to operate in high-temperature environments without degradation, making it suitable for a wide range of applications.

Technical Specifications

Power Field Effect Transistors (FET) NVH4L060N065SC1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Minimum DS Breakdown Voltage:

650 V

Maximum Drain Current (Abs) (ID):

50.3 A

Maximum Drain Current (ID):

50.3 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

10.17 pF

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T4

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

232 A

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Element Material:

SILICON CARBIDE

Trade Compliance

NVH4L060N065SC1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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