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NVH4L022N120M3S

Onsemi

NVH4L022N120M3S by Onsemi

NVH4L022N120M3S by Onsemi is a N-CHANNEL Power FET with 1200V DS Breakdown Voltage. It is used for SWITCHING applications, featuring 246A IDM and 267mJ EAS. With a package style of FLANGE MOUNT and operating temperature range of -55 to 175 °C, it offers 0.03 ohm Drain-Source Resistance for high-power requirements.

Median Price

$27.234

Lifecycle Status

Suppliers In-Stock

16

In-Stock Inventory

1k+

Distributors (Authorized)

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Farnell

UK . 70 parts In-Stock

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$22.900

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70

$22.900

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Newark

USA . 70 parts In-Stock

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$24.840

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$24.830

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$24.040

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70

$24.840

$24.830

$24.040

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Arrow

USA . 695 parts In-Stock

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$29.628

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$22.921

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695

$29.628

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$22.921

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Mouser Electronics

USA . 267 parts In-Stock

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$31.780

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$24.520

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267

$31.780

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$24.520

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Element14

Singapore . 70 parts In-Stock

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$40.180

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$38.910

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70

$40.180

$38.910

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DigiKey

USA . 641 parts In-Stock

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$42.050

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$28.794

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641

$42.050

$28.794

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Chip1Stop

Japan . 1,236 parts In-Stock

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$87.300

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$40.900

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$27.200

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1,236

$87.300

$40.900

$27.200

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Flip Electronics (Authorized)

USA . 240,000 parts In-Stock

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Verical

USA . 13,020 parts In-Stock

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$23.054

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$23.044

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$23.054

$23.044

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EBV Elektronik

Germany . 2,850 parts In-Stock

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2,850

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Future Electronics

Canada . 450 parts In-Stock

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$16.430

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450

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$16.430

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Rochester

USA . 219 parts In-Stock

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$17.190

1k+ parts

$15.380

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$14.470

219

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$17.190

$15.380

$14.470

Distributors (In-Stock)

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Vyrian

USA . 2,228 parts In-Stock

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$4.120

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2,228

$4.120

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Digiode

USA . 2,236 parts In-Stock

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$18.136

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2,236

$18.136

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Flip Electronics

USA . 39,600 parts In-Stock

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NAC Semi

USA . 2,280 parts In-Stock

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$45.400

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$41.270

2,280

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$45.400

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$41.270

Distributors (Availability)

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Corohmni

South Africa . 115 parts In-Stock

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$17.180

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115

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Corphita

USA . 1,553 parts In-Stock

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$17.181

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1,553

$17.181

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Continental Prestige Electronics

USA . 70 parts In-Stock

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$36.940

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$29.930

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70

$36.940

$29.930

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GreenTree Electronics

Israel . 16,397 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 8,685 parts In-Stock

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Microchip USA

USA . 8,077 parts In-Stock

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Kulean Microsystems

USA . 7,419 parts In-Stock

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Problanco Electronics

Mexico . 6,876 parts In-Stock

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SupplyDigital Components

Austria . 4,789 parts In-Stock

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TANS Electronics

Latvia . 2,055 parts In-Stock

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UHIMA Technologies

Türkiye . 342 parts In-Stock

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Authorized Procurement Solutions

USA . 108 parts In-Stock

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Overview

Discover the NVH4L022N120M3S by Onsemi, a top-quality Power Field Effect Transistor designed for switching applications. With a high DS Breakdown Voltage of 1200V and a maximum Drain Current of 68A, this N-CHANNEL FET offers unmatched performance and reliability. The innovative METAL-OXIDE SEMICONDUCTOR technology ensures enhanced efficiency and durability, making it ideal for demanding industrial environments. Trust Onsemi's reputation for excellence and choose the NVH4L022N120M3S for your next project to experience the superior quality and value it brings to your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the FET, ensuring a longer lifespan and reliable performance.

Minimum DS Breakdown Voltage: 1200 V

With a high breakdown voltage, this FET can handle high voltage applications with ease, making it suitable for demanding environments.

Maximum Pulsed Drain Current (IDM): 246 A

The high pulsed drain current rating allows for handling of heavy loads and sudden surges, making it ideal for applications requiring high power capabilities.

Maximum Power Dissipation (Abs): 352 W

The high power dissipation rating ensures efficient heat dissipation, enabling continuous operation without overheating issues.

Maximum Operating Temperature: 175 °C

With a high operating temperature range, this FET can withstand extreme heat conditions, making it suitable for industrial and automotive applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

This technology offers improved performance and reliability compared to other types of FETs, making it a reliable choice for various applications.

Technical Specifications

Power Field Effect Transistors (FET) NVH4L022N120M3S attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

267 mJ

Minimum DS Breakdown Voltage:

1200 V

Maximum Drain Current (ID):

68 A

Maximum Drain-Source On Resistance:

.03 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

12 pF

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T4

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

246 A

Reference Standard:

AEC-Q101

Surface Mount:

NO

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON CARBIDE

Trade Compliance

NVH4L022N120M3S Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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