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NVH4L018N075SC1

Onsemi

NVH4L018N075SC1 by Onsemi

NVH4L018N075SC1 by Onsemi is a N-CHANNEL FET with 750V DS Breakdown Voltage, ideal for SWITCHING applications. It features a max IDM of 483A and EAS of 162mJ, suitable for high-power operations. With an RDS(on) of 0.018 ohm and operating temperature range from -55 to 175 °C, it offers reliable performance in various environments.

Median Price

$35.632

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

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DigiKey

USA . 436 parts In-Stock

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$38.740

100+ parts

$26.009

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436

$38.740

$26.009

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Chip1Stop

Japan . 291 parts In-Stock

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$137.000

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$67.700

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Rochester

USA . 534 parts In-Stock

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$26.020

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$23.280

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$21.910

534

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$26.020

$23.280

$21.910

Verical

USA . 450 parts In-Stock

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$32.525

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$29.100

10k+ parts

$27.387

450

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$32.525

$29.100

$27.387

Distributors (In-Stock)

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Digiode

USA . 963 parts In-Stock

1+ parts

$27.455

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$27.455

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Vyrian

USA . 8,814 parts In-Stock

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Flip Electronics

USA . 1,800 parts In-Stock

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Corphita

USA . 2,393 parts In-Stock

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$26.010

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2,393

$26.010

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Corohmni

South Africa . 261 parts In-Stock

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$28.900

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261

$28.900

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Microchip USA

USA . 2,405 parts In-Stock

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$114.954

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2,405

$114.954

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TANS Electronics

Latvia . 6,966 parts In-Stock

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Kulean Microsystems

USA . 5,642 parts In-Stock

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Perfect Parts

USA . 1,864 parts In-Stock

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SupplyDigital Components

Austria . 1,492 parts In-Stock

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Problanco Electronics

Mexico . 868 parts In-Stock

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UHIMA Technologies

Türkiye . 480 parts In-Stock

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Authorized Procurement Solutions

USA . 345 parts In-Stock

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345

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Overview

Upgrade your power systems with the NVH4L018N075SC1 by Onsemi, a top-quality Power Field Effect Transistor that guarantees optimal performance and reliability. Manufactured by industry leader Onsemi, this N-CHANNEL FET is perfect for switching applications, offering a built-in diode for added convenience. With a high DS Breakdown Voltage of 750V and maximum Drain Current of 140A, this transistor excels in enhancement mode operation. Trust the NVH4L018N075SC1 to deliver superior power dissipation of 500W and a low on-resistance of 0.018 ohm, making it the ideal choice for your power management needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the transistor lightweight and durable.

Polarity or Channel Type: N-CHANNEL

N-channel transistors typically have lower on-resistance and higher current carrying capability compared to P-channel transistors, making them suitable for high power applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and protects the transistor from voltage spikes.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring efficient and reliable performance.

Minimum DS Breakdown Voltage: 750 V

The high breakdown voltage allows the transistor to handle high voltage applications safely.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide strong mechanical connections, making it suitable for rugged environments.

Operating Mode: ENHANCEMENT MODE

Enhancement mode transistors offer better control over the switching operation and consume less power when in the off state.

Maximum Pulsed Drain Current (IDM): 483 A

The high pulsed drain current rating allows the transistor to handle large current surges without damage.

Avalanche Energy Rating (EAS): 162 mJ

The high avalanche energy rating makes the transistor robust and reliable in high-energy transient conditions.

Maximum Power Dissipation (Abs): 500 W

The high power dissipation rating ensures the transistor can handle high power levels without overheating.

Maximum Operating Temperature: 175 °C

With a high maximum operating temperature, the transistor can operate reliably in elevated temperature environments.

Transistor Element Material: SILICON CARBIDE

Silicon carbide provides high thermal conductivity and superior performance in high temperature and high-frequency applications.

Maximum Feedback Capacitance (Crss): 31 pF

The low feedback capacitance minimizes the risk of oscillations and improves the stability of the circuit.

Reference Standard: AEC-Q101

Compliance with AEC-Q101 standard ensures the transistor meets automotive-grade reliability and quality requirements.

Technical Specifications

Power Field Effect Transistors (FET) NVH4L018N075SC1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

162 mJ

Minimum DS Breakdown Voltage:

750 V

Maximum Drain Current (ID):

140 A

Maximum Drain-Source On Resistance:

.018 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

31 pF

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T4

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

483 A

Reference Standard:

AEC-Q101

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON CARBIDE

Trade Compliance

NVH4L018N075SC1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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