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NVH4L050N65S3F

Onsemi

NVH4L050N65S3F by Onsemi

NVH4L050N65S3F by Onsemi is a N-CHANNEL FET with 650V DS Breakdown Voltage, 145A IDM, and 403W Power Dissipation. Ideal for high-power applications in automotive electronics due to its AEC-Q101 standard compliance and robust design.

Median Price

$12.560

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 445 parts In-Stock

1+ parts

$12.560

100+ parts

$7.090

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-

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445

$12.560

$7.090

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DigiKey

USA . 405 parts In-Stock

1+ parts

$12.560

100+ parts

$7.578

1k+ parts

$6.200

10k+ parts

-

405

$12.560

$7.578

$6.200

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Chip1Stop

Japan . 310 parts In-Stock

1+ parts

$38.800

100+ parts

$16.200

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-

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310

$38.800

$16.200

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Rochester

USA . 4,034 parts In-Stock

1+ parts

-

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$6.200

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$5.550

10k+ parts

$5.220

4,034

-

$6.200

$5.550

$5.220

Verical

USA . 4,034 parts In-Stock

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-

100+ parts

$7.750

1k+ parts

$6.938

10k+ parts

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4,034

-

$7.750

$6.938

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Distributors (In-Stock)

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Digiode

USA . 969 parts In-Stock

1+ parts

$6.546

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969

$6.546

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Vyrian

USA . 7,293 parts In-Stock

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7,293

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Flip Electronics

USA . 450 parts In-Stock

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450

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Corphita

USA . 591 parts In-Stock

1+ parts

$6.201

100+ parts

-

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591

$6.201

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Corohmni

South Africa . 230 parts In-Stock

1+ parts

$6.890

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230

$6.890

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Microchip USA

USA . 3,326 parts In-Stock

1+ parts

$22.819

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3,326

$22.819

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SupplyDigital Components

Austria . 7,319 parts In-Stock

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TANS Electronics

Latvia . 5,604 parts In-Stock

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Kulean Microsystems

USA . 4,418 parts In-Stock

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4,418

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Problanco Electronics

Mexico . 3,121 parts In-Stock

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Perfect Parts

USA . 1,770 parts In-Stock

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1,770

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UHIMA Technologies

Türkiye . 925 parts In-Stock

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925

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GreenTree Electronics

Israel . 410 parts In-Stock

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410

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Authorized Procurement Solutions

USA . 310 parts In-Stock

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310

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iodParts Technologies Inc.

India . 310 parts In-Stock

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310

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Overview

Experience the power of innovation with the NVH4L050N65S3F by Onsemi - a top-tier manufacturer known for its cutting-edge technology and superior quality products. As a Power Field Effect Transistor (FET), this component offers unparalleled performance and reliability for a wide range of applications. From enhancing energy efficiency to improving overall system performance, the NVH4L050N65S3F delivers exceptional value and benefits that customers can trust. Upgrade your projects with this N-CHANNEL FET and experience the difference in quality and efficiency today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material makes the transistor lightweight and durable, providing good protection for the internal components.

Polarity or Channel Type: N-CHANNEL

N-channel transistors typically have higher mobility and faster switching speeds, making them suitable for high-performance applications.

Minimum DS Breakdown Voltage: 650 V

The high breakdown voltage allows the transistor to handle high voltage operation without damage, making it suitable for power applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode helps protect the transistor from voltage spikes and reverse polarity, increasing its reliability in various circuit designs.

Maximum Pulsed Drain Current (IDM): 145 A

The high pulsed drain current rating allows the transistor to handle large current spikes or surges, making it suitable for power applications.

Avalanche Energy Rating (EAS): 830 mJ

The high avalanche energy rating indicates the transistor's ability to handle energy spikes without breaking down, making it reliable in high-power applications.

Maximum Power Dissipation (Abs): 403 W

The high power dissipation rating allows the transistor to handle high power levels without overheating, making it suitable for high-performance applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology provides high efficiency and fast switching speeds, making the transistor suitable for power applications.

Maximum Operating Temperature: 150 °C

The high operating temperature range allows the transistor to operate in harsh environments without performance degradation.

Minimum Operating Temperature: -55 °C

The low operating temperature range allows the transistor to operate in cold environments without performance issues.

Maximum Drain-Source On Resistance: 0.05 ohm

The low on-resistance helps minimize power loss and heat generation, making the transistor efficient in power applications.

Maximum Feedback Capacitance (Crss): 14 pF

The low feedback capacitance helps reduce switching losses and improve overall performance in high-frequency applications.

Reference Standard: AEC-Q101

Conformance to the AEC-Q101 standard ensures the transistor meets automotive-grade quality and reliability requirements, making it suitable for automotive applications.

Technical Specifications

Power Field Effect Transistors (FET) NVH4L050N65S3F attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

830 mJ

Minimum DS Breakdown Voltage:

650 V

Maximum Drain Current (ID):

58 A

Maximum Drain-Source On Resistance:

.05 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

14 pF

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T4

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

145 A

Reference Standard:

AEC-Q101

Surface Mount:

NO

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Element Material:

SILICON

Trade Compliance

NVH4L050N65S3F Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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