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NVH4L020N120SC1

Onsemi

NVH4L020N120SC1 by Onsemi

NVH4L020N120SC1 by Onsemi is a N-CHANNEL FET with 1200V DS Breakdown Voltage. Ideal for SWITCHING applications, it features 408A IDM and 264mJ EAS. Operating in ENHANCEMENT MODE, it has a max power dissipation of 510W and can handle up to 175°C.

Median Price

$48.720

Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

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Arrow

USA . 60 parts In-Stock

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$9.748

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60

$9.748

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Chip1Stop

Japan . 60 parts In-Stock

1+ parts

$42.100

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60

$42.100

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Mouser Electronics

USA . 282 parts In-Stock

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$44.060

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282

$44.060

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DigiKey

USA . 1,211 parts In-Stock

1+ parts

$49.690

100+ parts

$35.385

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1,211

$49.690

$35.385

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Element14

Singapore . 190 parts In-Stock

1+ parts

$55.150

100+ parts

$50.520

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190

$55.150

$50.520

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Farnell

UK . 358 parts In-Stock

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$66.717

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$66.717

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Newark

USA . 190 parts In-Stock

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$67.690

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$55.340

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190

$67.690

$55.340

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Verical

USA . 450 parts In-Stock

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$35.608

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450

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$35.608

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RS (Exports)

UK . 438 parts In-Stock

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$48.720

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$47.499

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438

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$48.720

$47.499

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Distributors (In-Stock)

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Digiode

USA . 1,775 parts In-Stock

1+ parts

$37.800

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$37.800

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Nova Conductors

Japan . 500 parts In-Stock

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$47.260

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$47.260

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Flip Electronics

USA . 450 parts In-Stock

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450

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NAC Semi

USA . 150 parts In-Stock

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$88.580

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$81.760

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$81.760

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Vyrian

USA . 77 parts In-Stock

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 2,865 parts In-Stock

1+ parts

$1.550

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2,865

$1.550

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Ampacity Inc.

Singapore . 361 parts In-Stock

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$30.540

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361

$30.540

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Semicontronic

India . 280 parts In-Stock

1+ parts

$30.540

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$29.776

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$29.624

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280

$30.540

$29.776

$29.624

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Corphita

USA . 798 parts In-Stock

1+ parts

$35.811

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798

$35.811

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Corohmni

South Africa . 52 parts In-Stock

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$35.930

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52

$35.930

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Advanced Electronics

New Zealand . 550 parts In-Stock

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$43.381

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$43.381

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$43.381

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$43.381

$43.381

$43.381

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Aranea Global

USA . 50 parts In-Stock

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$46.315

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$44.462

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50

$46.315

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$44.462

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Continental Prestige Electronics

USA . 388 parts In-Stock

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$51.900

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$51.900

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Microchip USA

USA . 4,845 parts In-Stock

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$120.773

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$120.773

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Robosynatics

Brazil . 17,504 parts In-Stock

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Lucentia Tech

USA . 17,504 parts In-Stock

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$1.857

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$1.819

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$1.819

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$1.819

$1.819

Lixinc

USA . 12,350 parts In-Stock

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Problanco Electronics

Mexico . 7,997 parts In-Stock

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TANS Electronics

Latvia . 6,562 parts In-Stock

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Kulean Microsystems

USA . 5,043 parts In-Stock

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SupplyDigital Components

Austria . 3,075 parts In-Stock

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Argo Parts USA

USA . 2,713 parts In-Stock

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Eastek

USA . 570 parts In-Stock

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UHIMA Technologies

Türkiye . 71 parts In-Stock

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Overview

Unleash the power of innovation with the NVH4L020N120SC1 by Onsemi! As a leading manufacturer in the industry, Onsemi ensures top-notch quality and reliability in their products. This Power Field Effect Transistor (FET) is perfect for switching applications, offering customers enhanced performance and efficiency. With a minimum DS Breakdown Voltage of 1200V and maximum Drain Current of 102A, this transistor delivers exceptional power dissipation capabilities. Whether you're looking to optimize your power management system or enhance your electronic devices, the NVH4L020N120SC1 is the ideal solution for all your needs. Experience the difference with Onsemi's cutting-edge technology and elevate your projects to new heights of success.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material makes the product lightweight and durable, ideal for portable or long-term use.

Polarity or Channel Type: N-CHANNEL

N-channel FETs offer better performance and higher speed, making this product suitable for high-frequency applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for efficient energy transfer, reducing the need for external components and simplifying the circuit design.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET offers fast switching speeds and low on-resistance for improved efficiency.

Minimum DS Breakdown Voltage: 1200 V

With a high breakdown voltage, this FET can handle high voltage loads reliably and safely.

Package Shape: RECTANGULAR

The rectangular shape provides easy mounting and soldering, making installation convenient and ensuring a secure connection.

Terminal Form: THROUGH-HOLE

Through-hole terminals offer a sturdy connection, reducing the risk of disconnection and ensuring consistent performance.

Operating Mode: ENHANCEMENT MODE

The enhancement mode operation allows for easy control and optimization of the FET's performance in various applications.

Maximum Pulsed Drain Current (IDM): 408 A

With a high pulsed current rating, this FET can handle short-duration surges effectively, ensuring reliable operation under peak loads.

Avalanche Energy Rating (EAS): 264 mJ

The high avalanche energy rating makes this FET suitable for applications where high-energy transients may occur.

Maximum Power Dissipation (Abs): 510 W

With a high power dissipation capability, this FET can handle high-power applications without overheating.

Package Style (Meter): FLANGE MOUNT

The flange mount style allows for easy mounting and thermal management, ensuring efficient heat dissipation for optimal performance.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

This technology offers high efficiency and low power consumption, making the FET suitable for energy-efficient applications.

Maximum Operating Temperature: 175 °C

With a high operating temperature range, this FET can withstand extreme conditions, making it suitable for a wide range of environments.

Transistor Element Material: SILICON CARBIDE

Silicon carbide provides high thermal conductivity and superior performance, making this FET suitable for demanding applications.

Maximum Turn On Time (ton): 69 ns

The fast turn-on time ensures quick response in switching applications, improving overall system efficiency.

Minimum Operating Temperature: -55 °C

With a low minimum operating temperature, this FET is suitable for use in cold environments without sacrificing performance.

Maximum Turn Off Time (toff): 86 ns

The fast turn-off time minimizes switching losses and improves efficiency in high-frequency applications.

Terminal Finish: Matte Tin (Sn) - annealed

The matte tin finish provides excellent solderability and corrosion resistance, ensuring a reliable connection over time.

Maximum Drain-Source On Resistance: 0.028 ohm

With a low on-resistance, this FET minimizes power losses and improves efficiency in high-power applications.

Terminal Position: SINGLE

The single terminal position simplifies installation and reduces the risk of error, ensuring a reliable connection.

Maximum Feedback Capacitance (Crss): 24 pF

The low feedback capacitance minimizes signal distortion and ensures stable operation in high-frequency applications.

Reference Standard: AEC-Q101

Compliant with the AEC-Q101 standard, this FET meets strict quality and reliability requirements, making it suitable for automotive applications.

Technical Specifications

Power Field Effect Transistors (FET) NVH4L020N120SC1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

264 mJ

Minimum DS Breakdown Voltage:

1200 V

Maximum Drain Current (Abs) (ID):

102 A

Maximum Drain Current (ID):

102 A

Maximum Drain-Source On Resistance:

.028 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

24 pF

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T4

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

408 A

Reference Standard:

AEC-Q101

Surface Mount:

NO

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON CARBIDE

Maximum Turn Off Time (toff):

86 ns

Maximum Turn On Time (ton):

69 ns

Trade Compliance

NVH4L020N120SC1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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