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FDS3672

Onsemi

FDS3672 by Onsemi

FDS3672 by Onsemi is a N-CHANNEL Power FET with 100V DS Breakdown Voltage and 7.5A Drain Current. Ideal for SWITCHING applications, it features a SINGLE configuration with BUILT-IN DIODE in a PLASTIC/EPOXY package. Operating in ENHANCEMENT MODE, this transistor has an EAS of 416mJ and 0.023 ohm RDS(on).

Median Price

$0.903

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1k+

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Chip1Stop

Japan . 1,083 parts In-Stock

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$1.766

100+ parts

$0.864

1k+ parts

$0.696

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1,083

$1.766

$0.864

$0.696

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Mouser Electronics

USA . 220 parts In-Stock

1+ parts

$2.330

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$0.907

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$0.801

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220

$2.330

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$0.801

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Newark

USA . 3,317 parts In-Stock

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$2.340

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$1.140

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$0.877

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Distrelec

Netherlands . 2,470 parts In-Stock

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$2.395

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$2.145

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$1.755

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$1.614

2,470

$2.395

$2.145

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$1.614

Verical

USA . 70,000 parts In-Stock

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Future Electronics

Canada . 22,500 parts In-Stock

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Arrow

USA . 5,000 parts In-Stock

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RS (Exports)

UK . 5,000 parts In-Stock

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$1.352

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Element14

Singapore . 3,442 parts In-Stock

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DigiKey

USA . 3,220 parts In-Stock

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Farnell

UK . 2,542 parts In-Stock

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Master Electronics

USA . 1,900 parts In-Stock

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Digiode

USA . 874 parts In-Stock

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$0.527

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Mobius Materials

USA . 848 parts In-Stock

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$0.510

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Nova Conductors

Japan . 17 parts In-Stock

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IBS Electronics

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$0.853

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$0.589

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38,742

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$0.589

$0.531

Voyager Components

USA . 50 parts In-Stock

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$1.186

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$1.186

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50

$1.186

$1.186

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$1.186

TME

Poland . 1,792 parts In-Stock

1+ parts

$2.120

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$0.963

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$0.696

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$0.661

1,792

$2.120

$0.963

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$0.661

Maritex

Poland . 4,821 parts In-Stock

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$1.344

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Chip Stock

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Flip Electronics

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NAC Semi

USA . 17,500 parts In-Stock

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Infinite Electronics LLP

India . 9,486 parts In-Stock

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Bristol Electronics

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Dan-Mar Components

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Classic Components Corporation

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RLX Solution Inc.

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Sensible Micro Corp

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ComSIT Distribution GmbH

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Atlantic Semiconductor

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ECAB

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Sunrise Surplus Inc.

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EPE Components Inc.

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Prism Electronics

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Global Solutions Electronics Company

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Connect4Technologies Inc.

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North Shore Components

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LWI Electronics Inc

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Avant Electronics Limited

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Electronics Depot

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Ampacity Inc.

Singapore . 5,005 parts In-Stock

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$0.463

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$0.463

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Semicontronic

India . 4,768 parts In-Stock

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$0.449

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Corphita

USA . 2,137 parts In-Stock

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Corohmni

South Africa . 427 parts In-Stock

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$0.544

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Continental Prestige Electronics

USA . 800 parts In-Stock

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$0.673

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$0.660

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Argo Parts USA

USA . 601 parts In-Stock

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$0.673

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$0.653

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Aztec Data Supply Inc.

USA . 3,211 parts In-Stock

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$1.129

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

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$1.778

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$1.689

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$1.689

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$1.778

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$1.689

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RC Electronics

USA . 95,298 parts In-Stock

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$0.700

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$0.640

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$0.620

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Metaverse IC Inc.

Canada . 90,000 parts In-Stock

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Perfect Parts

USA . 89,600 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 9,855 parts In-Stock

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Microchip USA

USA . 9,093 parts In-Stock

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Robosynatics

Brazil . 6,793 parts In-Stock

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$1.708

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$1.673

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$1.673

6,793

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$1.708

$1.673

$1.673

Lucentia Tech

USA . 6,793 parts In-Stock

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$1.708

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$1.673

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$1.673

6,793

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$1.708

$1.673

$1.673

SupplyDigital Components

Austria . 4,913 parts In-Stock

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Kulean Microsystems

USA . 4,844 parts In-Stock

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TANS Electronics

Latvia . 4,066 parts In-Stock

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Glotronic Ltd.

UK . 3,900 parts In-Stock

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Futuretech Components

Singapore . 3,029 parts In-Stock

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Supply Digital

USA . 2,896 parts In-Stock

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Kepictronics

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Speed Components Ltd (Excess)

Israel . 2,085 parts In-Stock

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Problanco Electronics

Mexico . 1,363 parts In-Stock

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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Assy Fe

Spain . 1,000 parts In-Stock

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GreenTree Electronics

Israel . 848 parts In-Stock

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UHIMA Technologies

Türkiye . 146 parts In-Stock

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Netroflash

USA . 100 parts In-Stock

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$0.722

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$0.700

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$0.686

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$0.686

Overview

Elevate your power management capabilities with the FDS3672 by Onsemi. Crafted with precision and expertise, this N-CHANNEL Power Field Effect Transistor offers unparalleled performance in switching applications. Its single configuration with a built-in diode ensures seamless operation, while its high DS breakdown voltage of 100V guarantees durability. Say goodbye to overheating worries as this transistor boasts a maximum power dissipation of 2.5W, providing exceptional reliability. Trust Onsemi's legacy of excellence and revolutionize your power systems with the FDS3672.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material offers durability and protection, making this FET suitable for various environments.

Polarity or Channel Type: N-CHANNEL

N-CHANNEL FETs are commonly used in power applications due to their high efficiency and performance.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and saves space, making this FET convenient and efficient.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET offers fast turn-on and turn-off times for efficient operation.

Surface Mount: YES

Surface mount technology allows for easy and secure mounting on PCBs, making installation and assembly hassle-free.

Minimum DS Breakdown Voltage: 100 V

The high breakdown voltage ensures reliable performance and protection against voltage spikes, making this FET suitable for high-voltage applications.

Maximum Drain Current (Abs) (ID): 7.5 A

With a high maximum drain current rating, this FET can handle high power loads efficiently and reliably.

Maximum Power Dissipation (Abs): 2.5 W

The low maximum power dissipation ensures efficient operation and minimal heat generation, enhancing the overall reliability of the component.

Maximum Operating Temperature: 150 °C

With a high operating temperature rating, this FET can withstand elevated temperatures, making it suitable for a wide range of applications.

Maximum Drain-Source On Resistance: 0.023 ohm

The low on-resistance results in minimal power loss and efficient operation, making this FET ideal for high-performance applications.

Technical Specifications

Power Field Effect Transistors (FET) FDS3672 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

416 mJ

Minimum DS Breakdown Voltage:

100 V

Maximum Drain Current (Abs) (ID):

7.5 A

Maximum Drain Current (ID):

7.5 A

Maximum Drain-Source On Resistance:

.023 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

MS-012AA

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FDS3672 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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