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FDS3601

Onsemi

FDS3601 by Onsemi

FDS3601 by Onsemi is a N-CHANNEL FET for SWITCHING applications. It features 100V DS Breakdown Voltage, 6A IDM, and 0.53 ohm RDS(on). With a small outline package and matte tin finish, it operates at up to 175 °C making it suitable for high-power switching applications.

Median Price

$0.475

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 49,698 parts In-Stock

1+ parts

-

100+ parts

$0.475

1k+ parts

$0.395

10k+ parts

$0.352

49,698

-

$0.475

$0.395

$0.352

DigiKey

USA . 49,698 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.410

10k+ parts

-

49,698

-

-

$0.410

-

Verical

USA . 49,698 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.493

10k+ parts

$0.440

49,698

-

-

$0.493

$0.440

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 950 parts In-Stock

1+ parts

$0.328

100+ parts

-

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-

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950

$0.328

-

-

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Digiode

USA . 3,024 parts In-Stock

1+ parts

$0.370

100+ parts

-

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3,024

$0.370

-

-

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DigiKey Marketplace

USA . 49,698 parts In-Stock

1+ parts

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100+ parts

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49,698

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Chip Stock

USA . 4,000 parts In-Stock

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4,000

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 376 parts In-Stock

1+ parts

$0.328

100+ parts

-

1k+ parts

-

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376

$0.328

-

-

-

Corphita

USA . 489 parts In-Stock

1+ parts

$0.351

100+ parts

-

1k+ parts

-

10k+ parts

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489

$0.351

-

-

-

Andel Nordic

Denmark . 3,544 parts In-Stock

1+ parts

$6.023

100+ parts

-

1k+ parts

$5.782

10k+ parts

$5.782

3,544

$6.023

-

$5.782

$5.782

Native Components

USA . 188 parts In-Stock

1+ parts

$38.625

100+ parts

-

1k+ parts

-

10k+ parts

$37.080

188

$38.625

-

-

$37.080

Northwest PG Solutions

USA . 1,406 parts In-Stock

1+ parts

$42.488

100+ parts

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1,406

$42.488

-

-

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Continental Prestige Electronics

USA . 49,698 parts In-Stock

1+ parts

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100+ parts

$0.470

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49,698

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$0.470

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Kulean Microsystems

USA . 5,436 parts In-Stock

1+ parts

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5,436

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TANS Electronics

Latvia . 4,173 parts In-Stock

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4,173

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

1+ parts

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100+ parts

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4,000

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UHIMA Technologies

Türkiye . 815 parts In-Stock

1+ parts

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815

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Supply Digital

USA . 426 parts In-Stock

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426

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Kepictronics

USA . 100 parts In-Stock

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100

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SupplyDigital Components

Austria . 88 parts In-Stock

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88

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Problanco Electronics

Mexico . 31 parts In-Stock

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31

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Overview

Enhance your electronic projects with the FDS3601 by Onsemi, a high-quality Power Field Effect Transistor designed for switching applications. With its N-channel configuration and built-in diode, this transistor offers seamless performance and reliability. Featuring a maximum drain current of 1.3A and a breakdown voltage of 100V, the FDS3601 is perfect for various power management tasks. Its small outline package and matte tin finish make it easy to integrate into any design. Trust Onsemi's expertise in semiconductor technology and elevate your projects with the FDS3601 today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material is durable and provides good protection for the internal components of the FET, ensuring its longevity.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower on-resistance compared to P-channel FETs, making them more efficient for switching applications.

Configuration: SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

Having separate elements with a built-in diode allows for more flexibility in circuit design and can help protect against reverse current flow.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET is optimized for fast and efficient switching operation.

Surface Mount: YES

Surface mount capability makes installation easier and helps reduce overall PCB footprint, ideal for space-constrained applications.

Minimum DS Breakdown Voltage: 100 V

With a minimum breakdown voltage of 100V, this FET can handle high voltage applications safely and reliably.

Maximum Pulsed Drain Current (IDM): 6 A

The high pulsed drain current rating of 6A allows for handling short-duration peak currents, important for robust performance in demanding applications.

Maximum Drain-Source On Resistance: 0.53 ohm

Low on-resistance helps reduce power losses in the FET, resulting in higher efficiency and lower heat generation.

Maximum Operating Temperature: 175 °C

The high operating temperature rating of 175 °C ensures reliable performance even in high-temperature environments.

Technical Specifications

Power Field Effect Transistors (FET) FDS3601 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

26 mJ

Minimum DS Breakdown Voltage:

100 V

Maximum Drain Current (Abs) (ID):

1.3 A

Maximum Drain Current (ID):

1.3 A

Maximum Drain-Source On Resistance:

.53 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

2 W

Maximum Pulsed Drain Current (IDM):

6 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FDS3601 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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