Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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NV24C02SNVLT3G by Onsemi is an AEC-Q100 EEPROM with 2Kx1 organization, operating at 3.3V. It features I2C control byte 1010XXXR and offers 2048-bit memory density. Ideal for automotive applications due to its high endurance of 1M write/erase cycles and wide temperature range from -40 to 125 °C.
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This material provides durability and protection to the EEPROM, making it suitable for various environments and applications.
Allows for easy and convenient installation on PCBs, saving space and facilitating automated assembly processes.
Ensures that the EEPROM meets automotive industry standards for reliability and quality, making it suitable for automotive applications.
Allows for synchronized data transfer which can improve performance and efficiency in data communication.
Operates at a commonly used voltage level, ensuring compatibility with a wide range of systems.
Provides necessary connections for interfacing with other components or devices in a simple and efficient manner.
The compact size and thin profile make it suitable for applications where space is limited, without compromising performance.
Can withstand high temperatures, making it suitable for use in automotive and industrial environments where temperature fluctuations are common.
Provides reliable operation even in extremely cold conditions, expanding the range of applications where the EEPROM can be used.
CMOS technology offers low power consumption and high noise immunity, contributing to the efficiency and reliability of the EEPROM.
EEPROM NV24C02SNVLT3G attributes and parameters. Explore more EEPROM devices from Onsemi
Maximum Clock Frequency (fCLK):
Minimum Data Retention Time:
Endurance:
I2C Control Byte:
JESD-30 Code:
Length:
Memory Density:
Memory IC Type:
Memory Width:
No. of Functions:
No. of Terminals:
No. of Words:
No. of Words Code:
Operating Mode:
Maximum Operating Temperature:
Minimum Operating Temperature:
Organization:
Package Body Material:
Package Code:
Package Equivalence Code:
Package Shape:
Package Style (Meter):
Parallel or Serial:
Peak Reflow Temperature (C):
Screening Level:
Maximum Seated Height:
Serial Bus Type:
Maximum Standby Current:
Maximum Supply Current:
Maximum Supply Voltage (Vsup):
Minimum Supply Voltage (Vsup):
Nominal Supply Voltage / Vsup (V):
Surface Mount:
Technology:
Temperature Grade:
Terminal Form:
Terminal Pitch:
Terminal Position:
Maximum Time At Peak Reflow Temperature (s):
Width:
Maximum Write Cycle Time (tWC):
Write Protection:
NV24C02SNVLT3G Memory ICs trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.32.00.51
SB
8542.32.00.50
Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).
President, CEO
Hassane El-Khoury
Executive VP, CFO, Treasurer
Thad Trent
Senior VP
Ross F. Jatou
Aizu Fab
Fabrication
Fab Initiation
1995
Japan
Aizu Wakamatsu
Wafer Capacity
52,000
Si/EPI Fab
2018
Czech Republic
Rožnov pod Radhoštěm
10,000
Expansion Phase 1 for SiC / EPI
2019
14,500
Expansion Phase 2 for SiC / EPI
2024
SiC Fab
2022
USA
Hudson
Bucheon
2013
South Korea
61,000
ISMF - Malaysia
1990
Malaysia
Seremban
95,000
Roznov Device Fab
1987
80,000
Fab 10
2002
East Fishkill
15,000
Burlington
1986
Canada
Gresham
1998
45,000
Bucheon 150mm
2000
50,000
Rochester
1983
Nampa
Pennsylvania
1997
Mountain Top
36,000
SS14
Changzhou Galaxy Century Microelectronics
RECTIFIER DIODE; Surface Mount: YES; No. of Phases: 1; Maximum Non Repetitive Peak Forward Current: 40 A; Technology: SCHOTTKY; No. of Elements: 1;
1552200253
Molex
WIRE AND CABLE;
BAV99
Shanghai Lunsure Electronic Technology
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148
Transys Electronics
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
CRG0805F10R
TE Connectivity
TE Connectivity's CRG0805F10R is a 10 ohm fixed resistor with 1% tolerance and 0.125 W power dissipation. It features thick film technology, SMT package style, and matte tin over nickel terminal finish. Ideal for surface mount applications in electronics, offering a temperature coefficient of 200 ppm/°C and operating voltage of 150 V.
BAV99-7-F
Diodes Incorporated
Diodes Inc. BAV99-7-F is a series-connected, center tap diode with 2 elements in a small outline package. It has a max reverse recovery time of 0.004 us and can handle up to 0.3A output current. Ideal for rectification applications requiring fast switching and low reverse current requirements.
LM555CN
Fairchild Semiconductor
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Surface Mount: NO;
Onsemi
Microsemi
BSS138K-13
BSS138K-13 by Diodes Inc. is a N-channel FET with 50V DS breakdown voltage, ideal for switching applications. It features single configuration with built-in diode, operating in enhancement mode. With 3 terminals and 0.31A max drain current, it offers high performance in small outline package style.
Sensitron Semiconductor
2N7002
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Maximum Time At Peak Reflow Temperature (s): 30; Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR;
LL4148
General Semiconductor
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
2N2222A
Bytesonic Electronics
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Maximum Collector Current (IC): .6 A; No. of Elements: 1;
Rugao Dachang Electronic
B340A-13-F
SPC TECHNOLOGY/ MULTICOMP
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148W-7-F
Multicomp Pro
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Hitano Enterprise
Plessey Semiconductors Discrete Components Div
Other Transistors;
Semicoa
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
XCF02SVOG20C0936
Xilinx
Xilinx XCF02SVOG20C0936 is a 2MX1 EEPROM with 2097152-bit memory density. Operating at 3.3V, it offers industrial-grade performance with -40 to 85°C temperature range. Ideal for configuration memory applications, this serial CMOS device comes in a small outline package with dual terminals and gull wing form factor.
AT28C256E-15JU
Microchip Technology
AT28C256E-15JU by Microchip Technology is a 32Kx8 EEPROM with a memory density of 262144 bits. It operates at an asynchronous mode and has a max access time of 150 ns. This chip is commonly used in industrial applications for its endurance of 100000 write/erase cycles.
25AA256T-I/SN
25AA256T-I/SN by Microchip Technology is a serial EEPROM with 32KX8 organization, SPI interface, and 10 MHz clock frequency. It operates at -40 to 85 °C, has 1.8-5.5 V supply voltage, and offers 1000000 write/erase cycles endurance. Ideal for industrial applications requiring reliable non-volatile memory storage in a compact small outline package.
24AA01T-I/OTG
24AA01T-I/OTG by Microchip Tech is a 1024-bit EEPROM with 128x8 organization, operating at 5V. It features I2C serial bus, hardware write protection, and endurance of 1M cycles. Ideal for industrial applications requiring reliable non-volatile memory storage in compact form factor.
AT24CM02-SSHD-B
The Microchip AT24CM02-SSHD-B is a 256Kx8 EEPROM with I2C control byte for synchronous operation. It operates at 3V, has 1000000 write/erase cycles, and supports a max clock frequency of 1MHz. Ideal for industrial applications requiring reliable non-volatile memory storage in a compact small outline package.
M95M02-DRMN6TP
STMicroelectronics
M95M02-DRMN6TP by STMicroelectronics is an EEPROM with 256KX8 organization, SPI serial bus type, and 4000000 write/erase cycles endurance. It operates at a max clock frequency of 5 MHz and has a memory density of 2097152 bit. Ideal for industrial applications requiring reliable non-volatile memory storage.
CAT24C256YI-GT3
CAT24C256YI-GT3 by Onsemi is an EEPROM with 32KX8 organization, operating at 5V. It features I2C control byte 1010DDDR and offers 262144 bit memory density. Ideal for industrial applications requiring reliable data storage with a max clock frequency of 0.4 MHz.
DS2430A+
Maxim Integrated
EEPROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 3; Package Code: TO-92; Package Shape: ROUND; Terminal Pitch: 1.27 mm;
M24C02-FDW6TP
M24C02-FDW6TP by STMicroelectronics is an EEPROM with 256x8 organization, operating at 1.8/5V. It features a serial I2C bus type, hardware write protection, and 4000000 write/erase cycles endurance. Ideal for applications requiring low power consumption and reliable data storage in compact electronic devices.
CAT24C128HU4IGT3
CAT24C128HU4IGT3 by Onsemi is an EEPROM with 16KX8 organization, 131072 bit memory density, and 1000000 Write/Erase Cycles endurance. It operates in synchronous mode at a clock frequency of 1 MHz via I2C serial bus. Ideal for industrial applications requiring reliable non-volatile memory storage.
X28HC256JI-12
Intersil
EEPROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Maximum Write Cycle Time (tWC): 5 ms;
AT25080B-SSHL-T
AT25080B-SSHL-T by Microchip Tech is a 1KX8 EEPROM with SPI interface, 5 MHz clock frequency, and 1000000 write/erase cycles. Ideal for industrial applications requiring small outline package, 3-state output, and hardware/software write protection. Operating range from -40 to 85 °C with low standby current of 0.000006 Amp.
25LC1024-E/MF
25LC1024-E/MF by Microchip is an AEC-Q100 EEPROM with 128KX8 organization, SPI serial bus type, and 10 MHz clock frequency. Ideal for automotive applications due to its -40 to 125 °C operating temperature range, it offers 1 million write/erase cycles and hardware/software write protection.
CAT25640VI-GT3
Catalyst Semiconductor
EEPROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Minimum Supply Voltage (Vsup): 1.8 V;
24LC16B-I/SNG
24LC16B-I/SNG by Microchip Technology is an 8-terminal EEPROM with 2Kx8 organization, operating at a max clock frequency of 0.4 MHz. It features hardware write protection and offers endurance up to 1M write/erase cycles. Ideal for industrial applications requiring reliable non-volatile memory storage in a compact small outline package.
DS2431P
Dallas Semiconductor
EEPROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 6; Package Code: SOC; Package Shape: RECTANGULAR; Maximum Supply Voltage (Vsup): 5.25 V;
DS1990A-F5
DS1990A-F5 by Maxim Integrated is a 64-bit EEPROM with 1-WIRE serial bus. Operating at 3.3V, it has an industrial temperature grade and asynchronous mode. Ideal for applications requiring secure data storage in harsh environments.
BR24G04NUX-3TTR
ROHM
ROHM's BR24G04NUX-3TTR is an 8-terminal EEPROM with 512x8 organization, operating at 2.5V. It features I2C control byte for synchronous operation up to 0.4 MHz clock frequency. Ideal for industrial applications requiring reliable memory storage with 1000000 write/erase cycles and -40 to 85 °C temperature range.
M95M01-DFCS6TP/K
M95M01-DFCS6TP/K by STMicroelectronics is a 128KX8 EEPROM with SPI serial bus, 1.8V nominal voltage, and 16MHz clock frequency. It features 4000000 write/erase cycles endurance, suitable for industrial applications requiring reliable non-volatile memory storage in a compact 0.58mm height grid array package.
BR93H56RF-2CE2
BR93H56RF-2CE2 by ROHM is an AEC-Q100 EEPROM with 128x16 organization, operating at 4V. It offers 2048-bit memory density, MICROWIRE serial bus type, and 1000000 write/erase cycles. Ideal for automotive applications requiring reliable data storage in harsh environments.
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
NV24C128MUW3VTBG
EEPROM; Temperature Grade: AUTOMOTIVE; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; Serial Bus Type: I2C;
NV24C04SNVLT3G
EEPROM; Temperature Grade: AUTOMOTIVE; No. of Terminals: 5; Package Code: TSOP; Package Shape: RECTANGULAR; Package Equivalence Code: TSOP5/6,.11,37;
NV24C08SNVLT3G
EEPROM; Temperature Grade: AUTOMOTIVE; No. of Terminals: 5; Package Code: TSOP; Package Shape: RECTANGULAR; Terminal Form: GULL WING;
NV24C08DTVLT3G
EEPROM; Temperature Grade: AUTOMOTIVE; No. of Terminals: 8; Package Code: TSSOP; Package Shape: RECTANGULAR; JESD-609 Code: e4;
NV24C04MUW3VLTBG
EEPROM; Temperature Grade: AUTOMOTIVE; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; Maximum Seated Height: .55 mm;
NV24C128WFMUW3VTBG
EEPROM; Temperature Grade: AUTOMOTIVE; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; No. of Functions: 1;
NV24C02DWVLT3G
EEPROM; Temperature Grade: AUTOMOTIVE; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Terminal Position: DUAL;
NV24C04UVLT2G
EEPROM; Temperature Grade: AUTOMOTIVE; No. of Terminals: 8; Package Code: VSSOP; Package Shape: RECTANGULAR; Parallel or Serial: SERIAL;
NV24C02UVLT2G
EEPROM; Temperature Grade: AUTOMOTIVE; No. of Terminals: 8; Package Code: VSSOP; Package Shape: RECTANGULAR; Terminal Pitch: .5 mm;
NV24C08MUW3VTBG
EEPROM; Temperature Grade: AUTOMOTIVE; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; Terminal Finish: NICKEL PALLADIUM GOLD;
NV24C08DWVLT3G
EEPROM; Temperature Grade: AUTOMOTIVE; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Minimum Supply Voltage (Vsup): 1.7 V;
NV24C04DWVLT3G
EEPROM; Temperature Grade: AUTOMOTIVE; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Parallel or Serial: SERIAL;
NV24C08UVLT2G
NV24C02MUW3VTBG
EEPROM; Temperature Grade: AUTOMOTIVE; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; Maximum Supply Current: 2 mA;
NV24C04MUW3VTBG
EEPROM; Temperature Grade: AUTOMOTIVE; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; Terminal Position: DUAL;
NV24C02DTVLT3G
EEPROM; Temperature Grade: AUTOMOTIVE; No. of Terminals: 8; Package Code: TSSOP; Package Shape: RECTANGULAR; Terminal Form: GULL WING;
NV24C02MUW3VLTBG
NV24C04DTVLT3G
EEPROM; Temperature Grade: AUTOMOTIVE; No. of Terminals: 8; Package Code: TSSOP; Package Shape: RECTANGULAR; Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH;
NV24C08MUW3VLTBG
EEPROM; Temperature Grade: AUTOMOTIVE; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; Maximum Supply Current: .5 mA;
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