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NV24C08DWVLT3G

Onsemi

NV24C08DWVLT3G by Onsemi

NV24C08DWVLT3G by Onsemi is an AEC-Q100 EEPROM with 1KX8 organization, 8192 bit memory density, and 1 MHz clock frequency. Ideal for automotive applications due to its -40 to 125 °C operating temperature range and I2C serial bus interface.

Median Price

$0.390

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 4,204 parts In-Stock

1+ parts

$0.390

100+ parts

$0.341

1k+ parts

$0.317

10k+ parts

$0.243

4,204

$0.390

$0.341

$0.317

$0.243

DigiKey

USA . 3,346 parts In-Stock

1+ parts

$0.390

100+ parts

$0.341

1k+ parts

$0.316

10k+ parts

$0.234

3,346

$0.390

$0.341

$0.316

$0.234

Chip1Stop

Japan . 230 parts In-Stock

1+ parts

$2.210

100+ parts

$0.643

1k+ parts

-

10k+ parts

-

230

$2.210

$0.643

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,192 parts In-Stock

1+ parts

$0.332

100+ parts

-

1k+ parts

-

10k+ parts

-

2,192

$0.332

-

-

-

Vyrian

USA . 857 parts In-Stock

1+ parts

$0.350

100+ parts

-

1k+ parts

-

10k+ parts

-

857

$0.350

-

-

-

Flip Electronics

USA . 51,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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51,000

-

-

-

-

NAC Semi

USA . 6,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.285

6,000

-

-

-

$0.285

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Component Stockers USA

USA . 11,306 parts In-Stock

1+ parts

$0.270

100+ parts

$0.210

1k+ parts

$0.200

10k+ parts

-

11,306

$0.270

$0.210

$0.200

-

Corphita

USA . 1,133 parts In-Stock

1+ parts

$0.315

100+ parts

-

1k+ parts

-

10k+ parts

-

1,133

$0.315

-

-

-

Corohmni

South Africa . 251 parts In-Stock

1+ parts

$0.350

100+ parts

-

1k+ parts

-

10k+ parts

-

251

$0.350

-

-

-

Advanced Electronics

New Zealand . 350 parts In-Stock

1+ parts

$5.319

100+ parts

$4.840

1k+ parts

$4.362

10k+ parts

-

350

$5.319

$4.840

$4.362

-

QUARKTWIN TECHNOLOGY LTD

USA . 14,879 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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14,879

-

-

-

-

Perfect Parts

USA . 11,715 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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11,715

-

-

-

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Kulean Microsystems

USA . 8,052 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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8,052

-

-

-

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GreenTree Electronics

Israel . 6,727 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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6,727

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-

-

-

Problanco Electronics

Mexico . 6,287 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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6,287

-

-

-

-

TANS Electronics

Latvia . 3,068 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

-

3,068

-

-

-

-

Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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3,000

-

-

-

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SupplyDigital Components

Austria . 1,176 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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1,176

-

-

-

-

UHIMA Technologies

Türkiye . 847 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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847

-

-

-

-

Overview

Unlock the power of reliable data storage with the NV24C08DWVLT3G by Onsemi. As a leading manufacturer in the industry, Onsemi ensures top-quality products that meet the highest standards. This EEPROM device offers exceptional value and benefits for a wide range of applications, from automotive to industrial settings. With its durable construction and efficient operation, customers can trust in the performance and longevity of this product. Experience peace of mind knowing your data is secure with the NV24C08DWVLT3G by Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the EEPROM chip, ensuring a longer lifespan.

Surface Mount: YES

Allows for easy and convenient installation on circuit boards, saving time and effort during assembly.

Screening Level: AEC-Q100

This automotive-grade screening level ensures reliability and performance in demanding automotive applications.

Operating Mode: SYNCHRONOUS

Synchronous operation allows for faster data transfer and more efficient communication within the system.

Nominal Supply Voltage / Vsup (V): 3.3

Operates at a standard voltage level, making it compatible with a wide range of systems and applications.

Maximum Operating Temperature: 125 °C

Capable of operating in high-temperature environments, ideal for automotive and industrial applications.

Endurance: 1000000 Write/Erase Cycles

With a high endurance rating, this EEPROM chip can withstand frequent read/write operations, ensuring long-term data retention.

Serial Bus Type: I2C

Uses the I2C serial bus protocol for communication, providing a simple and efficient way to interface with other devices.

Technical Specifications

EEPROM NV24C08DWVLT3G attributes and parameters. Explore more EEPROM devices from Onsemi

Specs

Maximum Clock Frequency (fCLK):

1 MHz

Minimum Data Retention Time:

100

Endurance:

1000000 Write/Erase Cycles

I2C Control Byte:

1010DMMR

JESD-30 Code:

R-PDSO-G8

Length:

4.9 mm

Memory Density:

8192 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Ports:

1

No. of Terminals:

8

No. of Words:

1024 words

No. of Words Code:

1K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

1KX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

260

Screening Level:

AEC-Q100

Maximum Seated Height:

1.75 mm

Serial Bus Type:

I2C

Maximum Standby Current:

.000002 Amp

Maximum Supply Current:

.5 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.7 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.9 mm

Maximum Write Cycle Time (tWC):

4 ms

Write Protection:

HARDWARE

Trade Compliance

NV24C08DWVLT3G Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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