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NV24C04MUW3VLTBG

Onsemi

NV24C04MUW3VLTBG by Onsemi

NV24C04MUW3VLTBG by Onsemi is an AEC-Q100 EEPROM with 512x8 organization, operating at 3.3V. It features I2C control byte 1010DDMR, hardware write protection, and endurance of 1M cycles. Ideal for automotive applications due to its small size, low power consumption (0.5mA), and wide temperature range (-40 to 125 °C).

Median Price

$0.468

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 8,211 parts In-Stock

1+ parts

$0.500

100+ parts

$0.437

1k+ parts

$0.405

10k+ parts

$0.300

8,211

$0.500

$0.437

$0.405

$0.300

Mouser Electronics

USA . 4,233 parts In-Stock

1+ parts

$0.500

100+ parts

$0.438

1k+ parts

$0.405

10k+ parts

$0.311

4,233

$0.500

$0.438

$0.405

$0.311

Chip1Stop

Japan . 2,920 parts In-Stock

1+ parts

-

100+ parts

$0.437

1k+ parts

$0.400

10k+ parts

$0.295

2,920

-

$0.437

$0.400

$0.295

Verical

USA . 2,920 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.289

10k+ parts

-

2,920

-

-

$0.289

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 955 parts In-Stock

1+ parts

$0.252

100+ parts

-

1k+ parts

-

10k+ parts

-

955

$0.252

-

-

-

Digiode

USA . 1,454 parts In-Stock

1+ parts

$0.428

100+ parts

-

1k+ parts

-

10k+ parts

-

1,454

$0.428

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 434 parts In-Stock

1+ parts

$0.249

100+ parts

-

1k+ parts

-

10k+ parts

-

434

$0.249

-

-

-

Corphita

USA . 2,102 parts In-Stock

1+ parts

$0.405

100+ parts

-

1k+ parts

-

10k+ parts

-

2,102

$0.405

-

-

-

Microchip USA

USA . 3,992 parts In-Stock

1+ parts

$1.663

100+ parts

-

1k+ parts

-

10k+ parts

-

3,992

$1.663

-

-

-

Perfect Parts

USA . 15,870 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

15,870

-

-

-

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SupplyDigital Components

Austria . 7,273 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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7,273

-

-

-

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Kulean Microsystems

USA . 6,386 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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6,386

-

-

-

-

Problanco Electronics

Mexico . 5,323 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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5,323

-

-

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Eastek

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.540

10k+ parts

-

3,000

-

-

$0.540

-

GreenTree Electronics

Israel . 2,778 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,778

-

-

-

-

Authorized Procurement Solutions

USA . 2,678 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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2,678

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iodParts Technologies Inc.

India . 2,413 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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2,413

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-

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TANS Electronics

Latvia . 323 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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323

-

-

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UHIMA Technologies

Türkiye . 215 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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215

-

-

-

-

Overview

Upgrade your automotive electronics with the NV24C04MUW3VLTBG by Onsemi. This top-quality EEPROM offers unparalleled reliability and endurance, making it perfect for a wide range of applications in the automotive industry. With a compact design and advanced features like hardware write protection, this product provides exceptional value and performance. Trust Onsemi's reputation for excellence and take your projects to the next level with the NV24C04MUW3VLTBG.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the EEPROM chip, ensuring longevity and reliability.

Surface Mount: YES

Allows for easy and secure installation on circuit boards, saving space and simplifying assembly.

Screening Level: AEC-Q100

Meets automotive industry standards for quality and reliability, making it suitable for automotive applications.

Operating Mode: SYNCHRONOUS

Enables synchronous communication with other devices, improving performance and efficiency.

Nominal Supply Voltage / Vsup (V): 3.3

Operates at a standard voltage level, ensuring compatibility with many systems and devices.

No. of Terminals: 8

Provides multiple connection points for efficient data transfer and communication.

Minimum Operating Temperature: -40 °C

Capable of functioning in extreme cold conditions, making it suitable for a wide range of environments.

I2C Control Byte: 1010DDMR

Uses I2C protocol for control and communication, offering a reliable and standardized interface.

Write Protection: HARDWARE

Ensures data integrity and security by allowing for hardware-based write protection.

Maximum Supply Voltage (Vsup): 5.5 V

Can handle higher voltage levels, providing flexibility in power supply options.

Technical Specifications

EEPROM NV24C04MUW3VLTBG attributes and parameters. Explore more EEPROM devices from Onsemi

Specs

Maximum Clock Frequency (fCLK):

1 MHz

Minimum Data Retention Time:

100

Endurance:

1000000 Write/Erase Cycles

I2C Control Byte:

1010DDMR

JESD-30 Code:

R-PDSO-N8

JESD-609 Code:

e4

Length:

3 mm

Memory Density:

4096 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Ports:

1

No. of Terminals:

8

No. of Words:

512 words

No. of Words Code:

512

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

512X8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC8,.11,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

260

Screening Level:

AEC-Q100

Maximum Seated Height:

.55 mm

Serial Bus Type:

I2C

Maximum Standby Current:

.000002 Amp

Maximum Supply Current:

.5 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.7 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

2 mm

Maximum Write Cycle Time (tWC):

4 ms

Write Protection:

HARDWARE

Trade Compliance

NV24C04MUW3VLTBG Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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