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24AA08T-I/OTG

Microchip Technology

24AA08T-I/OTG by Microchip Technology

24AA08T-I/OTG by Microchip Technology is a small outline EEPROM with 1KX8 organization, operating at 2.5V and featuring I2C control byte for synchronous operation. It has a memory density of 8192 bit, endurance of 1M cycles, and is ideal for industrial applications requiring low-profile memory solutions.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

VNN

France . 8,800 parts In-Stock

1+ parts

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8,800

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Vyrian

USA . 1,412 parts In-Stock

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1,412

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Nova Conductors

Japan . 500 parts In-Stock

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500

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 978 parts In-Stock

1+ parts

$2.000

100+ parts

$1.950

1k+ parts

$1.940

10k+ parts

-

978

$2.000

$1.950

$1.940

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Advanced Electronics

New Zealand . 5,000 parts In-Stock

1+ parts

$2.116

100+ parts

$2.010

1k+ parts

$2.010

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-

5,000

$2.116

$2.010

$2.010

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Aztec Data Supply Inc.

USA . 2,507 parts In-Stock

1+ parts

$3.126

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2,507

$3.126

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AZTECH Wire

Italy . 785 parts In-Stock

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$5.295

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785

$5.295

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Corohmni

South Africa . 1,223 parts In-Stock

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$5.458

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$5.458

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Ampacity Inc.

Singapore . 361 parts In-Stock

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$7.000

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361

$7.000

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Montano Global Distributors

Canada . 5,847 parts In-Stock

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5,847

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LOOK Integrated Logistics

Peru . 5,273 parts In-Stock

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5,273

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LMD Electronica

Estonia . 5,263 parts In-Stock

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5,263

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Argo Parts USA

USA . 4,905 parts In-Stock

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4,905

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NIA Electronics

USA . 3,403 parts In-Stock

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Continental Prestige Electronics

USA . 2,313 parts In-Stock

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2,313

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Bastille Electronics

Australia . 450 parts In-Stock

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450

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Ledger Components

France . 419 parts In-Stock

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419

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Overview

Experience the next level of data storage with the 24AA08T-I/OTG by Microchip Technology. As a leading manufacturer in the industry, Microchip offers top-quality EEPROM products that deliver reliable performance and durability. Ideal for a wide range of applications, this EEPROM provides customers with a cost-effective solution for storing and retrieving data efficiently. With a high endurance of 1,000,000 write/erase cycles, this product ensures long-term reliability, making it a valuable asset for any project. Unlock the potential of your designs with the 24AA08T-I/OTG and experience superior quality and performance like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material makes the EEPROM durable and resistant to external elements, ensuring a longer lifespan.

Surface Mount: YES

The ability to be surface mounted makes the EEPROM easy to integrate into electronic devices, saving space and improving efficiency.

Operating Mode: SYNCHRONOUS

Synchronous operation allows for precise timing and coordination with other components in a system, enhancing overall performance.

Nominal Supply Voltage / Vsup (V): 2.5

The 2.5V supply voltage is a common standard in many electronic systems, making this EEPROM compatible with a wide range of devices.

Write Protection: HARDWARE

Having hardware-based write protection adds an extra layer of security to the EEPROM, preventing unauthorized data alterations.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this EEPROM can function reliably in various environmental conditions without overheating.

Memory Density: 8192 bit

The high memory density allows for storing a large amount of data in a compact space, making it ideal for applications with limited storage capacity.

Technical Specifications

EEPROM 24AA08T-I/OTG attributes and parameters. Explore more EEPROM devices from Microchip Technology

Specs

Maximum Clock Frequency (fCLK):

.1 MHz

Minimum Data Retention Time:

200

Endurance:

1000000 Write/Erase Cycles

I2C Control Byte:

1010XMMR

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

2.95 mm

Memory Density:

8192 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

5

No. of Words:

1024 words

No. of Words Code:

1K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

1KX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5/6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/5

Qualification:

Not Qualified

Maximum Seated Height:

1.45 mm

Serial Bus Type:

I2C

Maximum Standby Current:

.000001 Amp

Sub-Category:

EEPROMs

Maximum Supply Current:

3 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.7 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Width:

1.55 mm

Maximum Write Cycle Time (tWC):

5 ms

Write Protection:

HARDWARE

Trade Compliance

24AA08T-I/OTG Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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