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NV24C128MUW3VTBG

Onsemi

NV24C128MUW3VTBG by Onsemi

NV24C128MUW3VTBG by Onsemi is a 16KX8 EEPROM with 131072 bit memory density. Operating at 1 MHz, it supports I2C serial bus type and has a clock frequency of 1 MHz. Ideal for automotive applications due to its -40 to 125 °C operating temperature range.

Median Price

$0.578

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 1,620 parts In-Stock

1+ parts

$0.770

100+ parts

$0.675

1k+ parts

$0.625

10k+ parts

$0.462

1,620

$0.770

$0.675

$0.625

$0.462

Verical

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.385

3,000

-

-

-

$0.385

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,303 parts In-Stock

1+ parts

$0.674

100+ parts

-

1k+ parts

-

10k+ parts

-

1,303

$0.674

-

-

-

Vyrian

USA . 85 parts In-Stock

1+ parts

$0.710

100+ parts

-

1k+ parts

-

10k+ parts

-

85

$0.710

-

-

-

Flip Electronics

USA . 24,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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24,000

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-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 152 parts In-Stock

1+ parts

$0.639

100+ parts

-

1k+ parts

-

10k+ parts

-

152

$0.639

-

-

-

Corohmni

South Africa . 272 parts In-Stock

1+ parts

$0.710

100+ parts

-

1k+ parts

-

10k+ parts

-

272

$0.710

-

-

-

Kulean Microsystems

USA . 6,495 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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6,495

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-

-

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TANS Electronics

Latvia . 5,043 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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5,043

-

-

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-

Problanco Electronics

Mexico . 4,366 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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4,366

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-

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SupplyDigital Components

Austria . 3,419 parts In-Stock

1+ parts

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100+ parts

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3,419

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-

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

-

10k+ parts

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3,000

-

-

-

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UHIMA Technologies

Türkiye . 900 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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900

-

-

-

-

Overview

Discover the NV24C128MUW3VTBG by Onsemi, a top-quality EEPROM that offers reliability and outstanding performance. Manufactured by Onsemi, a reputable company known for its innovative solutions, this EEPROM is perfect for various applications in automotive and industrial settings. With a compact package design and advanced features like synchronous operation and high memory density, this product provides exceptional value to customers. Trust Onsemi's expertise and invest in the NV24C128MUW3VTBG for seamless integration and superior functionality in your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and reliable material for the package body, ensuring the longevity of the product.

Surface Mount: YES

Ease of installation and integration into circuit boards.

Operating Mode: SYNCHRONOUS

Efficient data communication and synchronization with other components.

Nominal Supply Voltage / Vsup (V): 3.3

Optimal voltage level for stable and efficient operation.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, suitable for various operating conditions.

Memory Density: 131072 bit

High memory density for storing a large amount of data.

Serial Bus Type: I2C

Efficient serial communication protocol for data transfer.

Technical Specifications

EEPROM NV24C128MUW3VTBG attributes and parameters. Explore more EEPROM devices from Onsemi

Specs

Maximum Clock Frequency (fCLK):

1 MHz

JESD-30 Code:

R-PDSO-N8

JESD-609 Code:

e4

Length:

3 mm

Memory Density:

131072 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

No. of Words:

16384 words

No. of Words Code:

16K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

16KX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.55 mm

Serial Bus Type:

I2C

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.5 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

2 mm

Maximum Write Cycle Time (tWC):

5 ms

Trade Compliance

NV24C128MUW3VTBG Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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