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NV24C08UVLT2G

Onsemi

NV24C08UVLT2G by Onsemi

NV24C08UVLT2G by Onsemi is an AEC-Q100 EEPROM with 1KX8 organization, 8192 bit memory density, and 1 MHz clock frequency. Ideal for automotive applications due to its small size, low power consumption (0.5 mA), and high endurance (1M cycles).

Median Price

$0.370

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 1,883 parts In-Stock

1+ parts

$0.370

100+ parts

$0.329

1k+ parts

$0.305

10k+ parts

$0.226

1,883

$0.370

$0.329

$0.305

$0.226

Flip Electronics (Authorized)

USA . 129,000 parts In-Stock

1+ parts

-

100+ parts

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129,000

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-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,094 parts In-Stock

1+ parts

$0.323

100+ parts

-

1k+ parts

-

10k+ parts

-

2,094

$0.323

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-

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Vyrian

USA . 1,155 parts In-Stock

1+ parts

$0.340

100+ parts

-

1k+ parts

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10k+ parts

-

1,155

$0.340

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Flip Electronics

USA . 84,000 parts In-Stock

1+ parts

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1k+ parts

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84,000

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 870 parts In-Stock

1+ parts

$0.140

100+ parts

-

1k+ parts

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10k+ parts

-

870

$0.140

-

-

-

Corphita

USA . 2,271 parts In-Stock

1+ parts

$0.306

100+ parts

-

1k+ parts

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10k+ parts

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2,271

$0.306

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Corohmni

South Africa . 76 parts In-Stock

1+ parts

$0.340

100+ parts

-

1k+ parts

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76

$0.340

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Kulean Microsystems

USA . 7,189 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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7,189

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TANS Electronics

Latvia . 6,856 parts In-Stock

1+ parts

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6,856

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SupplyDigital Components

Austria . 5,242 parts In-Stock

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5,242

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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3,000

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Problanco Electronics

Mexico . 1,500 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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1,500

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UHIMA Technologies

Türkiye . 263 parts In-Stock

1+ parts

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100+ parts

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263

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Overview

Unlock the power of reliable data storage with the NV24C08UVLT2G by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality EEPROM products for various applications. This small outline, very thin profile memory chip offers a wide temperature range and endurance up to 1,000,000 write/erase cycles. With a maximum clock frequency of 1 MHz and I2C serial bus type, this EEPROM provides fast and efficient data storage solutions. Trust Onsemi to provide cutting-edge technology that meets automotive standards, ensuring your data is safe and secure. Experience the value and benefits of the NV24C08UVLT2G for all your memory needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and resistant to environmental factors, ensuring longevity and reliability.

Surface Mount: YES

Easy to install and saves space on the circuit board.

Screening Level: AEC-Q100

Automotive quality standard ensures high performance and reliability in harsh environments.

Nominal Supply Voltage / Vsup (V): 3.3

Compatible with common supply voltages, making it versatile for various applications.

Operating Mode: SYNCHRONOUS

Efficient data transfer with synchronous operation.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, suitable for automotive and industrial applications.

Memory IC Type: EEPROM

Non-volatile memory technology for storing data even when power is removed.

Technical Specifications

EEPROM NV24C08UVLT2G attributes and parameters. Explore more EEPROM devices from Onsemi

Specs

Maximum Clock Frequency (fCLK):

1 MHz

Minimum Data Retention Time:

100

Endurance:

1000000 Write/Erase Cycles

I2C Control Byte:

1010DMMR

JESD-30 Code:

R-PDSO-G8

Length:

2.3 mm

Memory Density:

8192 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Ports:

1

No. of Terminals:

8

No. of Words:

1024 words

No. of Words Code:

1K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

1KX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.12,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

260

Screening Level:

AEC-Q100

Maximum Seated Height:

.9 mm

Serial Bus Type:

I2C

Maximum Standby Current:

.000002 Amp

Maximum Supply Current:

.5 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.7 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

2 mm

Maximum Write Cycle Time (tWC):

4 ms

Write Protection:

HARDWARE

Trade Compliance

NV24C08UVLT2G Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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