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25AA1024T-I/SM16KVAO

Microchip Technology

25AA1024T-I/SM16KVAO by Microchip Technology

Microchip Technology's 25AA1024T-I/SM16KVAO is a 1MX1 EEPROM with SPI serial bus, 20 MHz clock frequency, and 1000000 write/erase cycles. Ideal for industrial applications requiring reliable non-volatile memory storage in a compact small outline package.

Median Price

$3.270

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 97 parts In-Stock

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$3.270

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VNN

France . 22,326 parts In-Stock

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Vyrian

USA . 945 parts In-Stock

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945

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Advanced Electronics

New Zealand . 1,000 parts In-Stock

1+ parts

$2.961

100+ parts

$2.813

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$2.813

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$2.813

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Argo Parts USA

USA . 3,890 parts In-Stock

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$3.270

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Continental Prestige Electronics

USA . 2,014 parts In-Stock

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$3.270

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$3.205

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Netroflash

USA . 2,000 parts In-Stock

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$3.270

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Aztec Data Supply Inc.

USA . 3,201 parts In-Stock

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$4.360

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Corohmni

South Africa . 111 parts In-Stock

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$4.687

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AZTECH Wire

Italy . 242 parts In-Stock

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$16.686

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Ampacity Inc.

Singapore . 550 parts In-Stock

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$22.000

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Semicontronic

India . 411 parts In-Stock

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$22.000

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$21.450

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$21.340

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West Coast Incorporated

USA . 1,782 parts In-Stock

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Overview

Unlock endless possibilities with the 25AA1024T-I/SM16KVAO by Microchip Technology. This top-quality EEPROM offers a reliable solution for a wide range of applications. Its AEC-Q100 screening level ensures durability, while its compact design and high endurance make it perfect for industrial settings. Experience seamless performance with synchronous operation and fast write cycle times. Trust in Microchip's reputation for excellence and innovation. Upgrade your systems today with the 25AA1024T-I/SM16KVAO and discover the difference quality makes.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable material that can withstand various environmental conditions.

Surface Mount: YES

Easy to integrate into circuit boards, saving space and facilitating automated assembly.

Screening Level: AEC-Q100

Meets automotive industry quality standards, ensuring reliability in automotive applications.

Operating Mode: SYNCHRONOUS

Allows for faster data transfer and more efficient operation.

Nominal Supply Voltage (Vsup): 5V

Common voltage level that is widely compatible with other components.

No. of Terminals: 8

Simple and straightforward interface for connecting to other devices.

Write Protection: HARDWARE/SOFTWARE

Ensures data integrity and security by allowing for protection mechanisms.

Maximum Clock Frequency (fCLK): 20 MHz

High clock frequency for faster data access and transfer speeds.

Temperature Grade: INDUSTRIAL

Designed to operate reliably in industrial temperature ranges.

Endurance: 1000000 Write/Erase Cycles

High endurance for frequent read/write operations without degradation.

Technical Specifications

EEPROM 25AA1024T-I/SM16KVAO attributes and parameters. Explore more EEPROM devices from Microchip Technology

Specs

Additional Features:

OPERTAES WITH 2.5VMIN @ 10MHZ

Maximum Clock Frequency (fCLK):

20 MHz

Minimum Data Retention Time:

200

Endurance:

1000000 Write/Erase Cycles

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

5.26 mm

Memory Density:

1048576 bit

Memory IC Type:

Memory Width:

1

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Ports:

1

No. of Terminals:

8

No. of Words:

1048576 words

No. of Words Code:

1M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

1MX1

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

260

Programming Voltage (V):

5

Screening Level:

AEC-Q100

Maximum Seated Height:

2.03 mm

Serial Bus Type:

SPI

Maximum Standby Current:

.000012 Amp

Maximum Supply Current:

10 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

5.25 mm

Maximum Write Cycle Time (tWC):

6 ms

Write Protection:

HARDWARE/SOFTWARE

Trade Compliance

25AA1024T-I/SM16KVAO Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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