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24LC256T-I/SNG

Microchip Technology

24LC256T-I/SNG by Microchip Technology

24LC256T-I/SNG by Microchip Tech is a 32Kx8 EEPROM with I2C control byte. Operating at 3/5V, it offers 1000000 write/erase cycles and -40 to 85°C temp range. Ideal for industrial applications requiring reliable non-volatile memory storage.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Sensible Micro Corp

USA . 23,055 parts In-Stock

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23,055

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Vyrian

USA . 3,525 parts In-Stock

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3,525

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VNN

France . 1,838 parts In-Stock

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1,838

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Nova Conductors

Japan . 10 parts In-Stock

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10

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Ampacity Inc.

Singapore . 531 parts In-Stock

1+ parts

$2.000

100+ parts

-

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531

$2.000

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Aztec Data Supply Inc.

USA . 2,580 parts In-Stock

1+ parts

$3.270

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2,580

$3.270

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Semicontronic

India . 1,458 parts In-Stock

1+ parts

$4.000

100+ parts

$3.900

1k+ parts

$3.880

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-

1,458

$4.000

$3.900

$3.880

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Advanced Electronics

New Zealand . 5,000 parts In-Stock

1+ parts

$4.630

100+ parts

$4.398

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$4.398

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5,000

$4.630

$4.398

$4.398

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Corohmni

South Africa . 162 parts In-Stock

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$5.900

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162

$5.900

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AZTECH Wire

Italy . 191 parts In-Stock

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$13.743

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191

$13.743

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Lixinc

USA . 9,080 parts In-Stock

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Microchip USA

USA . 6,641 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,840 parts In-Stock

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5,840

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Fulton Briggs Corp.

USA . 5,617 parts In-Stock

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5,617

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Continental Prestige Electronics

USA . 4,719 parts In-Stock

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Argo Parts USA

USA . 907 parts In-Stock

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907

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Bastille Electronics

Australia . 100 parts In-Stock

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100

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Modulus Dynamics

Lithuania . 28 parts In-Stock

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28

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Robosynatics

Brazil . 20 parts In-Stock

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20

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Lucentia Tech

USA . 20 parts In-Stock

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$70.775

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$70.775

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$70.775

20

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$70.775

$70.775

$70.775

Overview

Unleash the power of reliable data storage with the 24LC256T-I/SNG by Microchip Technology. This high-quality EEPROM offers unparalleled performance and durability, ensuring your valuable information is safe and secure. Ideal for industrial applications, this memory IC provides a seamless user experience with its I2C serial bus type and hardware write protection. Trust in Microchip Technology to deliver cutting-edge technology that meets your needs and exceeds your expectations. Elevate your projects with the 24LC256T-I/SNG and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and reliable material for protecting the internal components of the EEPROM.

Surface Mount: YES

Allows for easy and convenient installation on circuit boards.

Operating Mode: SYNCHRONOUS

Enables fast and efficient data transfer within the EEPROM.

Power Supplies (V): 3/5

Versatile voltage options for compatibility with different systems.

No. of Terminals: 8

Compact design with optimal number of terminals for connectivity.

Maximum Operating Temperature: 85 °C

Can operate in a wide range of temperatures for flexibility in usage.

Memory Density: 262144 bit

High memory density for storing large amounts of data.

Endurance: 1000000 Write/Erase Cycles

Long-lasting durability with a high number of write/erase cycles.

Technical Specifications

EEPROM 24LC256T-I/SNG attributes and parameters. Explore more EEPROM devices from Microchip Technology

Specs

Maximum Clock Frequency (fCLK):

.4 MHz

Minimum Data Retention Time:

200

Endurance:

1000000 Write/Erase Cycles

I2C Control Byte:

1010DDDR

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.9 mm

Memory Density:

262144 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

No. of Words:

32768 words

No. of Words Code:

32K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

32KX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

SERIAL

Power Supplies (V):

3/5

Qualification:

Not Qualified

Reverse Pinout:

NO

Maximum Seated Height:

1.75 mm

Serial Bus Type:

I2C

Maximum Standby Current:

.000001 Amp

Sub-Category:

EEPROMs

Maximum Supply Current:

3 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Maximum Write Cycle Time (tWC):

5 ms

Write Protection:

HARDWARE

Trade Compliance

24LC256T-I/SNG Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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