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24LC256T-I/SNRVE

Microchip Technology

24LC256T-I/SNRVE by Microchip Technology

24LC256T-I/SNRVE by Microchip Tech is a 32KX8 EEPROM with 262144-bit memory density. It operates in synchronous mode at 0.4 MHz clock frequency and has a 3mA max supply current. Ideal for industrial applications, it offers 1000000 write/erase cycles endurance and supports I2C serial bus communication.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

VNN

France . 2,732 parts In-Stock

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Vyrian

USA . 1,470 parts In-Stock

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1,470

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Nova Conductors

Japan . 100 parts In-Stock

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100

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Distributors (Availability)

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Continental Prestige Electronics

USA . 724 parts In-Stock

1+ parts

$0.790

100+ parts

$0.551

1k+ parts

$0.551

10k+ parts

$0.551

724

$0.790

$0.551

$0.551

$0.551

Andel Nordic

Denmark . 724 parts In-Stock

1+ parts

$0.790

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-

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$0.551

10k+ parts

$0.551

724

$0.790

-

$0.551

$0.551

Aztec Data Supply Inc.

USA . 804 parts In-Stock

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$4.070

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804

$4.070

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Corohmni

South Africa . 266 parts In-Stock

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$4.778

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266

$4.778

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Advanced Electronics

New Zealand . 50 parts In-Stock

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$5.158

100+ parts

$5.107

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$4.900

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50

$5.158

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$4.900

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AZTECH Wire

Italy . 512 parts In-Stock

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$12.350

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512

$12.350

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Semicontronic

India . 183 parts In-Stock

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$29.000

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$28.275

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$28.130

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183

$29.000

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$28.130

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RGB Technical Solutions

Ukraine . 3,282 parts In-Stock

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Robosynatics

Brazil . 2,000 parts In-Stock

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Lucentia Tech

USA . 2,000 parts In-Stock

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$72.384

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$72.384

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$72.384

2,000

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$72.384

$72.384

$72.384

Bastille Electronics

Australia . 1,000 parts In-Stock

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Argo Parts USA

USA . 948 parts In-Stock

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Modulus Dynamics

Lithuania . 50 parts In-Stock

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50

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Overview

Unlock endless possibilities with the 24LC256T-I/SNRVE by Microchip Technology—an EEPROM that delivers unparalleled quality and reliability. Ideal for industrial applications, this small outline package offers a high endurance of 1,000,000 write/erase cycles, ensuring long-lasting performance. With a wide operating temperature range and I2C serial bus type, this memory IC provides seamless integration and efficient data storage solutions. Elevate your projects with Microchip's cutting-edge technology and experience superior innovation like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the device lightweight and durable, providing protection to the internal components.

Nominal Supply Voltage / Vsup (V): 3.6

The nominal supply voltage of 3.6V ensures stable and optimal performance of the EEPROM.

Organization: 32KX8

The organization of 32KX8 allows for efficient storage and retrieval of data in a structured manner.

Memory IC Type: EEPROM

Being an EEPROM, this product offers non-volatile memory storage, ensuring data retention even when power is removed.

Endurance: 1000000 Write/Erase Cycles

The high endurance of 1,000,000 write/erase cycles ensures reliability and longevity of the EEPROM for frequent data read/write operations.

Technical Specifications

EEPROM 24LC256T-I/SNRVE attributes and parameters. Explore more EEPROM devices from Microchip Technology

Specs

Additional Features:

ALSO OPERATES AT 1.7V TO 2.5V @ 0.1MHZ

Maximum Clock Frequency (fCLK):

.4 MHz

Minimum Data Retention Time:

200

Endurance:

1000000 Write/Erase Cycles

I2C Control Byte:

1010DDDR

JESD-30 Code:

R-PDSO-G8

Length:

4.9 mm

Memory Density:

262144 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Ports:

1

No. of Terminals:

8

No. of Words:

32768 words

No. of Words Code:

32K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

32KX8

Output Characteristics:

OPEN-DRAIN

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.23

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

SERIAL

Programming Voltage (V):

3.6

Screening Level:

TS 16949

Maximum Seated Height:

1.75 mm

Serial Bus Type:

I2C

Maximum Standby Current:

.0000015 Amp

Maximum Supply Current:

3 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.5 V

Nominal Supply Voltage / Vsup (V):

3.6

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Maximum Write Cycle Time (tWC):

5 ms

Write Protection:

HARDWARE

Trade Compliance

24LC256T-I/SNRVE Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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