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M24C64-WMN6TPP

STMicroelectronics

M24C64-WMN6TPP by STMicroelectronics

M24C64-WMN6TPP by STMicroelectronics is an EEPROM with a memory density of 65536 bit. It operates in synchronous mode and has a max clock frequency of 0.4 MHz. This IC is commonly used in industrial applications for its endurance of 1,000,000 write/erase cycles.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Prism Electronics

USA . 2,500 parts In-Stock

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2,500

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Anansix

USA . 2,474 parts In-Stock

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2,474

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Digiode

USA . 873 parts In-Stock

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873

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Vyrian

USA . 610 parts In-Stock

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610

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Nova Conductors

Japan . 38 parts In-Stock

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38

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 4,341 parts In-Stock

1+ parts

$4.200

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-

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4,341

$4.200

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IDEA Electronic Components Group

UK . 1,975 parts In-Stock

1+ parts

$4.483

100+ parts

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$4.035

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1,975

$4.483

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$4.035

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Corohmni

South Africa . 46 parts In-Stock

1+ parts

$4.503

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46

$4.503

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AZTECH Wire

Italy . 825 parts In-Stock

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$5.213

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825

$5.213

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MKK Technologies

India . 161 parts In-Stock

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$8.430

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161

$8.430

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DigiPath Technology Company

USA . 161 parts In-Stock

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$8.430

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161

$8.430

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Ampacity Inc.

Singapore . 926 parts In-Stock

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$24.000

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926

$24.000

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Semicontronic

India . 1,063 parts In-Stock

1+ parts

$28.000

100+ parts

$27.300

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$27.160

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1,063

$28.000

$27.300

$27.160

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Continental Prestige Electronics

USA . 6,502 parts In-Stock

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6,502

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Argo Parts USA

USA . 4,544 parts In-Stock

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4,544

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Corphita

USA . 3,828 parts In-Stock

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3,828

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Perfect Parts

USA . 2,800 parts In-Stock

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2,800

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Robosynatics

Brazil . 950 parts In-Stock

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950

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Parana Technologies

USA . 236 parts In-Stock

1+ parts

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$5.360

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236

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$5.360

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Bastille Electronics

Australia . 10 parts In-Stock

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10

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Overview

Experience the power of cutting-edge technology with the M24C64-WMN6TPP by STMicroelectronics. As a leading manufacturer in the industry, STMicroelectronics brings you a high-quality EEPROM that is designed to exceed your expectations. This versatile device offers endless possibilities for applications in various industries. With its compact size and robust packaging, it is perfect for space-constrained environments. Its advanced features, such as synchronous operation and hardware write protection, ensure reliable performance and data integrity. With a long retention time and impressive endurance, this product guarantees years of reliable operation. Trust STMicroelectronics to deliver exceptional value, benefits, and advantages with the M24C64-WMN6TPP. Elevate your projects to new heights with this outstanding EEPROM.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This product's plastic/epoxy package body material ensures durability and resistance to external elements, making it suitable for various environments.

Surface Mount: YES

With surface mount capability, this product can be easily integrated onto printed circuit boards, providing convenience and flexibility in design and assembly.

No. of Functions: 1

The single function of this product simplifies its usage and operation, making it user-friendly and straightforward.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient utilization of space on the circuit board, optimizing the layout and enabling compact designs.

Operating Mode: SYNCHRONOUS

The synchronous operating mode enhances the efficiency and accuracy of data transfer, ensuring reliable performance and synchronization between components.

Nominal Supply Voltage / Vsup (V): 2.7

With a nominal supply voltage of 2.7V, this product offers low power consumption and compatibility with a wide range of systems.

Power Supplies (V): 3/5

Supporting both 3V and 5V power supplies, this product provides versatility and compatibility for various applications and system configurations.

No. of Terminals: 8

The 8 terminals offer a sufficient number of connection points, enabling easy integration and effective communication with other devices.

Package Style (Meter): SMALL OUTLINE

The small outline package style ensures space-saving installation, making this product ideal for compact devices and designs.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this product can withstand high-temperature environments, ensuring reliable performance in demanding conditions.

Organization: 8KX8

The 8KX8 organization provides a memory configuration that is suitable for storing and accessing data in various applications, offering flexibility and storage capacity.

Minimum Operating Temperature: -40 °C

The minimum operating temperature of -40°C allows this product to perform reliably in cold or low-temperature environments, making it suitable for a wide range of applications.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish ensures excellent conductivity, corrosion resistance, and solderability, guaranteeing reliable connections and long-term durability.

I2C Control Byte: 1010DDDR

The I2C control byte allows for flexible and efficient control of data transmission and access, enhancing the overall functionality and performance of this product.

Terminal Position: DUAL

The dual terminal position provides multiple connection options, allowing for flexibility in device integration and ensuring reliable electrical connections.

Write Protection: HARDWARE

The hardware write protection feature adds an additional layer of security to prevent unauthorized modification of data, ensuring data integrity and protection.

Maximum Seated Height: 1.75 mm

With a low maximum seated height of 1.75mm, this product enables slender and compact designs, offering versatility and potential space-saving benefits.

Maximum Clock Frequency (fCLK): 0.4 MHz

The maximum clock frequency of 0.4MHz enables fast and efficient data transfer, facilitating real-time operations and responsiveness.

Width: 3.9 mm

The compact width of 3.9mm makes this product suitable for space-constrained applications, allowing for efficient usage of board real estate.

Minimum Supply Voltage (Vsup): 2.5 V

Supporting a minimum supply voltage of 2.5V, this product ensures compatibility with low-power systems, providing energy-efficient operation.

Length: 4.9 mm

With its compact length of 4.9mm, this product offers flexibility in board layout and integration, enabling efficient use of available space.

Temperature Grade: INDUSTRIAL

The industrial temperature grade rating ensures reliable performance across a wide temperature range, making this product suitable for harsh or demanding environments.

Technology: CMOS

Built with CMOS technology, this product offers low power consumption, high noise immunity, and excellent performance, making it an efficient and reliable choice.

Parallel or Serial: SERIAL

The serial data transfer mode simplifies system design and offers compatibility with various control mechanisms, allowing for seamless integration into different applications.

Terminal Form: GULL WING

The gull wing terminal form provides sturdy and reliable solder joints, ensuring excellent mechanical strength and electrical performance.

Maximum Supply Current: 5 mA

With a maximum supply current of 5mA, this product operates within a low power consumption range, making it energy-efficient and suitable for battery-powered devices.

No. of Words: 8192 words

With 8192 words of memory capacity, this product provides ample storage for data, facilitating various applications and allowing for efficient data handling.

Memory Width: 8

The memory width of 8 bits enables efficient storage and retrieval of data, ensuring compatibility with numerous systems and offering versatility in data handling.

Minimum Data Retention Time: 40

The minimum data retention time of 40 years ensures long-term data integrity and reliability, making this product suitable for critical and long-lasting applications.

Terminal Pitch: 1.27 mm

The terminal pitch of 1.27mm allows for precise and reliable connections, ensuring ease of integration and excellent electrical performance.

No. of Words Code: 8K

The 8K words code provides a standardized coding system for the memory, enhancing compatibility and ease of use for various applications.

Moisture Sensitivity Level (MSL): 1

With a moisture sensitivity level of 1, this product offers enhanced resistance to moisture-related issues, ensuring reliable performance even in humid environments.

Maximum Supply Voltage (Vsup): 5.5 V

Supporting a maximum supply voltage of 5.5V, this product offers compatibility and versatility across a wide range of power supply configurations.

Endurance: 1000000 Write/Erase Cycles

With an endurance rating of 1,000,000 write/erase cycles, this product ensures long-lasting and reliable data storage, making it suitable for frequent data updates and modifications.

Serial Bus Type: I2C

The I2C serial bus type provides a well-established interface for efficient and standardized communication between components, ensuring compatibility and ease of integration.

Maximum Write Cycle Time (tWC): 5 ms

The maximum write cycle time of 5ms ensures quick and efficient data storage, enhancing the usability and responsiveness of this product.

Memory Density: 65536 bit

With a memory density of 65536 bits, this product offers significant data storage capacity, enabling efficient handling of large amounts of information.

Memory IC Type: EEPROM

As an EEPROM memory IC, this product provides non-volatile and rewritable memory capabilities, allowing for flexible data storage and retrieval.

Maximum Standby Current: 0.000002 Amp

With an extremely low maximum standby current of 0.000002 Amp, this product ensures minimal power consumption during inactive states, optimizing energy efficiency.

Technical Specifications

EEPROM M24C64-WMN6TPP attributes and parameters. Explore more EEPROM devices from STMicroelectronics

Specs

Maximum Clock Frequency (fCLK):

.4 MHz

Minimum Data Retention Time:

40

Endurance:

1000000 Write/Erase Cycles

I2C Control Byte:

1010DDDR

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Memory Density:

65536 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

No. of Words:

8192 words

No. of Words Code:

8K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

8KX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

SERIAL

Power Supplies (V):

3/5

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Serial Bus Type:

I2C

Maximum Standby Current:

.000002 Amp

Sub-Category:

EEPROMs

Maximum Supply Current:

5 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.5 V

Nominal Supply Voltage / Vsup (V):

2.7

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Maximum Write Cycle Time (tWC):

5 ms

Write Protection:

HARDWARE

Trade Compliance

M24C64-WMN6TPP Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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