Loading...

NTLJF3117PT1G

Onsemi

NTLJF3117PT1G by Onsemi

NTLJF3117PT1G by Onsemi is a P-CHANNEL FET with 20V DS Breakdown Voltage and 3.3A Drain Current. Ideal for SWITCHING applications, it operates in ENHANCEMENT MODE with a 0.135 ohm On Resistance. Suitable for surface mount, this transistor has a max operating temperature of 150°C.

Median Price

$0.270

Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Newark

USA . 75 parts In-Stock

1+ parts

$0.056

100+ parts

$0.056

1k+ parts

$0.056

10k+ parts

-

75

$0.056

$0.056

$0.056

-

Rochester

USA . 2,447 parts In-Stock

1+ parts

$0.270

100+ parts

$0.260

1k+ parts

$0.260

10k+ parts

-

2,447

$0.270

$0.260

$0.260

-

Mouser Electronics

USA . 9,375 parts In-Stock

1+ parts

$0.770

100+ parts

$0.308

1k+ parts

$0.212

10k+ parts

$0.181

9,375

$0.770

$0.308

$0.212

$0.181

DigiKey

USA . 8,942 parts In-Stock

1+ parts

$0.770

100+ parts

$0.308

1k+ parts

$0.211

10k+ parts

$0.158

8,942

$0.770

$0.308

$0.211

$0.158

Chip1Stop

Japan . 205 parts In-Stock

1+ parts

$1.640

100+ parts

$0.479

1k+ parts

-

10k+ parts

-

205

$1.640

$0.479

-

-

Verical

USA . 12,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.159

12,000

-

-

-

$0.159

Arrow

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.140

3,000

-

-

-

$0.140

Farnell

UK . 1,675 parts In-Stock

1+ parts

-

100+ parts

$0.265

1k+ parts

$0.182

10k+ parts

$0.156

1,675

-

$0.265

$0.182

$0.156

Element14

Singapore . 1,675 parts In-Stock

1+ parts

-

100+ parts

$0.439

1k+ parts

$0.248

10k+ parts

$0.244

1,675

-

$0.439

$0.248

$0.244

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,125 parts In-Stock

1+ parts

$0.100

100+ parts

-

1k+ parts

-

10k+ parts

-

1,125

$0.100

-

-

-

Digiode

USA . 1,981 parts In-Stock

1+ parts

$0.117

100+ parts

-

1k+ parts

-

10k+ parts

-

1,981

$0.117

-

-

-

Flip Electronics

USA . 9,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

9,000

-

-

-

-

Cyclops Electronics Ltd

UK . 6,052 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,052

-

-

-

-

Nova Conductors

Japan . 23 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

23

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 3,417 parts In-Stock

1+ parts

$0.105

100+ parts

-

1k+ parts

-

10k+ parts

-

3,417

$0.105

-

-

-

Corphita

USA . 2,095 parts In-Stock

1+ parts

$0.111

100+ parts

-

1k+ parts

-

10k+ parts

-

2,095

$0.111

-

-

-

Corohmni

South Africa . 365 parts In-Stock

1+ parts

$0.123

100+ parts

-

1k+ parts

-

10k+ parts

-

365

$0.123

-

-

-

RC Electronics

USA . 92,947 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

92,947

-

-

-

-

Perfect Parts

USA . 38,218 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

38,218

-

-

-

-

Kepictronics

USA . 33,606 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

33,606

-

-

-

-

TANS Electronics

Latvia . 7,737 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,737

-

-

-

-

Problanco Electronics

Mexico . 7,518 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,518

-

-

-

-

A-Z Elektronik GmbH

Germany . 4,625 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,625

-

-

-

-

Assy Fe

Spain . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,000

-

-

-

-

iodParts Technologies Inc.

India . 2,950 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,950

-

-

-

-

Kulean Microsystems

USA . 2,396 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,396

-

-

-

-

Lixinc

USA . 2,239 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,239

-

-

-

-

SupplyDigital Components

Austria . 1,816 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,816

-

-

-

-

Infinite Electronics LLP (Excess)

. 1,295 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,295

-

-

-

-

Formix International (Excess)

India . 1,285 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,285

-

-

-

-

Continental Prestige Electronics

USA . 1,265 parts In-Stock

1+ parts

-

100+ parts

$0.255

1k+ parts

$0.163

10k+ parts

$0.129

1,265

-

$0.255

$0.163

$0.129

Futuretech Components

Singapore . 507 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

507

-

-

-

-

UHIMA Technologies

Türkiye . 499 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

499

-

-

-

-

Netroflash

USA . 50 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

50

-

-

-

-

Overview

Experience the superior quality and high performance of the NTLJF3117PT1G by Onsemi, a top-tier manufacturer in the industry. This Power Field Effect Transistor (FET) offers unmatched reliability and efficiency, making it ideal for switching applications. With a maximum pulsed drain current of 20A and a minimum DS breakdown voltage of 20V, this P-Channel FET is designed to deliver optimal results. The single configuration with a built-in diode ensures seamless operation, while the small outline package shape allows for easy installation. Trust Onsemi for cutting-edge technology and trust the NTLJF3117PT1G for exceptional value and benefits.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring long-lasting performance.

Polarity or Channel Type: P-CHANNEL

Allows for efficient current flow and control in switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Simplifies circuit design and offers additional functionality with the built-in diode.

Transistor Application: SWITCHING

Specifically designed for switching applications, ensuring reliable and efficient performance.

Surface Mount: YES

Facilitates easy and secure mounting on PCBs, saving space and reducing assembly time.

Minimum DS Breakdown Voltage: 20 V

Suitable for applications requiring a minimum breakdown voltage of 20V.

Package Shape: RECTANGULAR

Optimizes space utilization and allows for easy integration into existing circuit layouts.

Operating Mode: ENHANCEMENT MODE

Enhances control and efficiency during operation, improving overall performance.

Maximum Pulsed Drain Current (IDM): 20 A

Handles high current pulses effectively, making it suitable for demanding applications.

Maximum Drain Current (Abs) (ID): 3.3 A

Capable of handling continuous drain current of up to 3.3A, ensuring reliable operation.

No. of Terminals: 6

Provides multiple connection points for easy integration into circuitry.

Package Style (Meter): SMALL OUTLINE

Compact design saves space and allows for densely populated PCB layouts.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Ensures high-performance characteristics with low power consumption.

Maximum Operating Temperature: 150 °C

Operates efficiently at high temperatures, suitable for industrial applications.

Transistor Element Material: SILICON

Provides high reliability and performance for the transistor element.

Minimum Operating Temperature: -55 °C

Capable of operating in harsh environmental conditions, offering versatility in application.

Terminal Finish: TIN

Ensures good conductivity for reliable connections.

Maximum Drain Current (ID): 2.3 A

Handles high current loads with ease, suitable for various applications.

Maximum Drain-Source On Resistance: 0.135 ohm

Low on-resistance ensures efficient power transfer and minimal voltage drop.

Terminal Position: DUAL

Offers flexibility in circuit design with dual terminal positions.

Case Connection: DRAIN

Provides secure and reliable connection for efficient current flow.

Maximum Time At Peak Reflow Temperature (s): 30

Withstands peak reflow temperatures for soldering without compromising performance.

Peak Reflow Temperature °C: 260

Can withstand high-temperature soldering processes, ensuring robust assembly.

Technical Specifications

Power Field Effect Transistors (FET) NTLJF3117PT1G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

20 V

Maximum Drain Current (Abs) (ID):

3.3 A

Maximum Drain Current (ID):

2.3 A

Maximum Drain-Source On Resistance:

.135 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

S-PDSO-N6

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

6

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

20 A

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

NO LEAD

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTLJF3117PT1G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 19