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NTLJS14D0P03P8ZTAG

Onsemi

NTLJS14D0P03P8ZTAG by Onsemi

NTLJS14D0P03P8ZTAG by Onsemi is a P-CHANNEL FET with 30V DS Breakdown Voltage, ideal for SWITCHING applications. It features 165A IDM, 0.0135 ohm Drain-Source Resistance, and operates in ENHANCEMENT MODE. With a max power dissipation of 2.4W and peak reflow temperature of 260C, it offers reliable performance in various electronic devices.

Median Price

$0.155

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

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Rochester

USA . 61,489 parts In-Stock

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-

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$0.161

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$0.134

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$0.119

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$0.161

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$0.119

Verical

USA . 54,526 parts In-Stock

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$0.149

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$0.149

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Flip Electronics

USA . 317,038 parts In-Stock

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Vyrian

USA . 8,086 parts In-Stock

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NAC Semi

USA . 3,000 parts In-Stock

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$0.404

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$0.404

Digiode

USA . 1,861 parts In-Stock

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Nova Conductors

Japan . 10 parts In-Stock

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AZTECH Wire

Italy . 573 parts In-Stock

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$18.521

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Ampacity Inc.

Singapore . 1,427 parts In-Stock

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$53.050

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SupplyDigital Components

Austria . 7,222 parts In-Stock

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TANS Electronics

Latvia . 4,393 parts In-Stock

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Problanco Electronics

Mexico . 2,222 parts In-Stock

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Kulean Microsystems

USA . 2,214 parts In-Stock

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Corphita

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UHIMA Technologies

Türkiye . 958 parts In-Stock

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Corohmni

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Overview

Discover the NTLJS14D0P03P8ZTAG by Onsemi, a high-quality P-CHANNEL Power Field Effect Transistor designed for switching applications. With a maximum drain current of 11A and a low on-resistance of 0.0135 ohm, this FET offers exceptional performance in a compact small outline package. Manufactured by Onsemi, known for their reliability and innovation in semiconductor technology, this transistor provides customers with efficient power management solutions. Whether you're designing industrial equipment or consumer electronics, the NTLJS14D0P03P8ZTAG offers value, benefits, and advantages that will enhance your products.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the FET, making it suitable for various applications and environments.

Polarity or Channel Type: P-CHANNEL

P-channel FETs are efficient in low-voltage applications and can help in reducing power consumption.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for more efficient switching and protection against reverse currents.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring smooth and reliable operation.

Surface Mount: YES

Surface mount technology allows for easy and compact integration onto PCBs, saving space and facilitating automated assembly.

Minimum DS Breakdown Voltage: 30 V

With a breakdown voltage of 30V, this FET can handle moderate power requirements.

Maximum Pulsed Drain Current (IDM): 165 A

Capable of handling high peak currents, making it ideal for devices that require short bursts of power.

Maximum Power Dissipation (Abs): 2.4 W

With a maximum power dissipation of 2.4W, this FET can efficiently handle heat dissipation under various load conditions.

Maximum Operating Temperature: 150 °C

Can operate in high-temperature environments without compromising performance or reliability.

Maximum Drain Current (ID): 11 A

Capable of handling continuous drain currents up to 11A, suitable for medium power applications.

Maximum Drain-Source On Resistance: 0.0135 ohm

Low on-resistance helps to minimize power loss and improve efficiency in conduction mode.

Technical Specifications

Power Field Effect Transistors (FET) NTLJS14D0P03P8ZTAG attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (ID):

11 A

Maximum Drain-Source On Resistance:

.0135 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

690 pF

JESD-30 Code:

S-PDSO-N6

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

6

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

SQUARE

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

165 A

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

NO LEAD

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Maximum Turn Off Time (toff):

254 ns

Maximum Turn On Time (ton):

52 ns

Trade Compliance

NTLJS14D0P03P8ZTAG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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