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NTLJF3118NTAG

Onsemi

NTLJF3118NTAG by Onsemi

NTLJF3118NTAG by Onsemi is a Power FET with N-CHANNEL polarity, suitable for SWITCHING applications. It features a 20V DS Breakdown Voltage, 18A IDM, and 0.065 ohm RDS(on). This SMALL OUTLINE transistor has a SQUARE package shape and C BEND terminals.

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Digiode

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AZTECH Wire

Italy . 780 parts In-Stock

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Kepictronics

USA . 15,996 parts In-Stock

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SupplyDigital Components

Austria . 1,005 parts In-Stock

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Corphita

USA . 959 parts In-Stock

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UHIMA Technologies

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Overview

Looking for a reliable and high-quality Power Field Effect Transistor (FET)? Look no further than the NTLJF3118NTAG by Onsemi. With its N-CHANNEL configuration, built-in diode, and enhancement mode operation, this transistor is perfect for switching applications. Offering a maximum pulsed drain current of 18A and a low on-resistance of just 0.065 ohm, this transistor provides exceptional performance and efficiency. Trust in Onsemi's reputation for excellence and innovation, and experience the benefits of the NTLJF3118NTAG for all your power management needs.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL FETs are known for their low ON resistance and high switching speeds, making them suitable for high efficiency applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for protection against reverse voltage spikes, increasing the reliability of the FET in switching applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET can quickly turn on and off, making it ideal for controlling power flow efficiently.

Surface Mount: YES

Surface mount FETs are compact and easy to install, perfect for applications where space is limited.

Minimum DS Breakdown Voltage: 20 V

With a minimum breakdown voltage of 20 V, this FET can handle higher voltages, making it suitable for a wide range of applications.

Package Shape: SQUARE

The square package shape can help optimize space utilization on a PCB, making it easier to design compact circuits.

Terminal Form: C BEND

C-bend terminals provide a strong mechanical connection, ensuring a reliable electrical connection for the FET.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs require a voltage at the gate terminal to turn on, providing better control over the switching process.

Maximum Pulsed Drain Current (IDM): 18 A

The high pulsed drain current rating of 18 A allows for handling short, high-current pulses without overheating, making it suitable for demanding applications.

No. of Terminals: 6

With 6 terminals, this FET offers flexibility in circuit design, enabling various connection configurations for different applications.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on a PCB and is easy to assemble, making it ideal for compact electronic devices.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high performance and reliability, ensuring stable operation of the FET over its lifespan.

Transistor Element Material: SILICON

Silicon FETs are known for their low ON resistance, high switching speeds, and good thermal characteristics, making them a popular choice for power applications.

Terminal Finish: TIN

Tin terminal finish provides good solderability, ensuring a secure and reliable connection between the FET and the PCB.

Maximum Drain Current (ID): 2.6 A

With a maximum drain current of 2.6 A, this FET can handle moderate current loads, making it suitable for a wide range of power control applications.

Maximum Drain-Source On Resistance: 0.065 ohm

The low drain-source on resistance of 0.065 ohm minimizes power loss and heat generation, improving the efficiency of the FET in power switching applications.

Terminal Position: DUAL

Dual terminal position offers flexibility in PCB layout and connection options, allowing for easy integration into various circuit designs.

Technical Specifications

Power Field Effect Transistors (FET) NTLJF3118NTAG attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Minimum DS Breakdown Voltage:

20 V

Maximum Drain Current (ID):

2.6 A

Maximum Drain-Source On Resistance:

.065 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

S-XDSO-C6

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

6

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

UNSPECIFIED

Package Shape:

SQUARE

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

18 A

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

C BEND

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTLJF3118NTAG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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