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NTLJS3113PT1G

Onsemi

NTLJS3113PT1G by Onsemi

NTLJS3113PT1G by Onsemi is a P-CHANNEL FET with 20V DS Breakdown Voltage, ideal for SWITCHING applications. It features a max IDM of 23A and ID of 7.7A, with an operating temperature range from -55 to 150°C. This SINGLE configuration transistor has a small outline package style and matte tin terminal finish for surface mount assembly.

Median Price

$0.226

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 255,768 parts In-Stock

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-

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$0.251

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$0.208

10k+ parts

$0.185

255,768

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$0.251

$0.208

$0.185

Verical

USA . 254,645 parts In-Stock

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$0.232

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$0.232

DigiKey

USA . 18,000 parts In-Stock

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$0.180

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$0.180

Flip Electronics (Authorized)

USA . 18,000 parts In-Stock

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Mouser Electronics

USA . 395 parts In-Stock

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$0.221

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$0.221

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Vyrian

USA . 1,317 parts In-Stock

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$0.180

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Digiode

USA . 2,425 parts In-Stock

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$0.196

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Sensible Micro Corp

USA . 18,100 parts In-Stock

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Flip Electronics

USA . 18,000 parts In-Stock

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Distributors (Availability)

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Corohmni

South Africa . 275 parts In-Stock

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$0.180

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275

$0.180

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Corphita

USA . 993 parts In-Stock

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$0.185

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$0.185

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Component Stockers USA

USA . 290,671 parts In-Stock

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$0.210

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$0.200

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$0.180

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$0.180

290,671

$0.210

$0.200

$0.180

$0.180

Continental Prestige Electronics

USA . 298,123 parts In-Stock

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$0.260

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RC Electronics

USA . 84,056 parts In-Stock

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$0.430

1k+ parts

$0.390

10k+ parts

$0.380

84,056

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$0.430

$0.390

$0.380

Perfect Parts

USA . 57,350 parts In-Stock

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Component Connect

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Authorized Procurement Solutions

USA . 15,000 parts In-Stock

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TANS Electronics

Latvia . 7,283 parts In-Stock

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Kepictronics

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SupplyDigital Components

Austria . 3,717 parts In-Stock

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S.R.D Solutions

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Lixinc

USA . 2,969 parts In-Stock

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Problanco Electronics

Mexico . 2,863 parts In-Stock

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A-Z Elektronik GmbH

Germany . 2,607 parts In-Stock

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Assy Fe

Spain . 1,654 parts In-Stock

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Kulean Microsystems

USA . 1,341 parts In-Stock

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Futuretech Components

Singapore . 507 parts In-Stock

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UHIMA Technologies

Türkiye . 92 parts In-Stock

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Overview

Elevate your power management game with the NTLJS3113PT1G by Onsemi. Crafted with precision and expertise, this P-CHANNEL Power FET offers seamless switching capabilities in a compact package. Ideal for a variety of applications, from consumer electronics to automotive systems, this transistor brings unparalleled efficiency and reliability to your projects. Say goodbye to power interruptions and hello to seamless performance with the NTLJS3113PT1G. Upgrade your technology today with Onsemi's quality components.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Polarity or Channel Type: P-CHANNEL

Allows for efficient control and operation of the transistor for switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Simplified setup with a built-in diode for reverse voltage protection, enhancing overall functionality.

Transistor Application: SWITCHING

Designed specifically for switching applications, providing optimal performance in such scenarios.

Surface Mount: YES

Enables easy and convenient installation on circuit boards, saving time and effort during assembly.

Minimum DS Breakdown Voltage: 20 V

Suitable for applications requiring a minimum breakdown voltage of 20V, ensuring compatibility in various scenarios.

Package Shape: RECTANGULAR

Space-efficient design that allows for compact integration into circuits or systems.

Terminal Form: NO LEAD

Eliminates traditional lead connections, reducing potential points of failure and improving reliability.

Operating Mode: ENHANCEMENT MODE

Enhances control and performance of the transistor in switching operations, optimizing efficiency.

Maximum Pulsed Drain Current (IDM): 23 A

Capable of handling high peak currents, making it suitable for demanding applications.

Maximum Drain Current (Abs) (ID): 7.7 A

Provides sufficient continuous current capacity for reliable operation in various scenarios.

No. of Terminals: 6

Offers multiple connection points for versatile integration into circuit layouts.

Maximum Power Dissipation (Abs): 1.9 W

Efficiently manages power dissipation, preventing overheating and ensuring stable operation.

Package Style (Meter): SMALL OUTLINE

Compact form factor that facilitates space-saving installation on circuit boards.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Utilizes advanced semiconductor technology for improved performance and reliability.

Maximum Operating Temperature: 150 °C

Capable of operating in high-temperature environments without performance degradation, increasing versatility.

Transistor Element Material: SILICON

Uses silicon material for the transistor element, known for its stability and efficiency in electronic components.

Minimum Operating Temperature: -55 °C

Maintains functionality in low-temperature conditions, ensuring reliable operation in various environments.

Terminal Finish: MATTE TIN

Provides a protective coating for the terminals, improving corrosion resistance and overall durability.

Maximum Drain Current (ID): 3.5 A

Sufficient current handling capacity for typical operating conditions, ensuring stability and performance.

Maximum Drain-Source On Resistance: 0.05 ohm

Low on-resistance for efficient power flow and minimal power loss, enhancing overall efficiency.

Terminal Position: DUAL

Dual terminal design for versatile connection options and compatibility with different circuit configurations.

Case Connection: DRAIN

Specific case connection for easy integration into circuits, simplifying installation.

Maximum Time At Peak Reflow Temperature (s): 30

Withstands peak reflow temperatures for a specified duration, ensuring reliability during soldering processes.

Peak Reflow Temperature °C: 260

Capable of withstanding high reflow temperatures during assembly, ensuring durability and stability.

Technical Specifications

Power Field Effect Transistors (FET) NTLJS3113PT1G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Additional Features:

LOGIC LEVEL COMPATIBLE

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

20 V

Maximum Drain Current (Abs) (ID):

7.7 A

Maximum Drain Current (ID):

3.5 A

Maximum Drain-Source On Resistance:

.05 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

S-PDSO-N6

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

6

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

23 A

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

NO LEAD

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTLJS3113PT1G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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