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NTLJD3115PTAG

Onsemi

NTLJD3115PTAG by Onsemi

NTLJD3115PTAG by Onsemi is a P-CHANNEL FET with 20V DS Breakdown Voltage, ideal for SWITCHING applications. It features 2 ELEMENTS WITH BUILT-IN DIODE in a SMALL OUTLINE package, operating from -55 to 150 °C. With 0.135 ohm Drain-Source On Resistance and 2.3A Drain Current, it offers efficient power management in various electronic devices.

Median Price

$0.190

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 4,077 parts In-Stock

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-

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$0.179

4,077

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$0.179

DigiKey

USA . 4,073 parts In-Stock

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$0.190

4,073

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$0.190

Rochester

USA . 4,058 parts In-Stock

1+ parts

-

100+ parts

$0.225

1k+ parts

$0.186

10k+ parts

$0.166

4,058

-

$0.225

$0.186

$0.166

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 659 parts In-Stock

1+ parts

$0.175

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659

$0.175

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Vyrian

USA . 180 parts In-Stock

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$0.179

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180

$0.179

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Distributors (Availability)

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Corphita

USA . 575 parts In-Stock

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$0.166

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575

$0.166

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Corohmni

South Africa . 206 parts In-Stock

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$0.179

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206

$0.179

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A-Z Elektronik GmbH

Germany . 6,755 parts In-Stock

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6,755

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Problanco Electronics

Mexico . 6,393 parts In-Stock

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6,393

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SupplyDigital Components

Austria . 5,345 parts In-Stock

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5,345

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Continental Prestige Electronics

USA . 4,077 parts In-Stock

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$0.179

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4,077

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$0.179

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Kulean Microsystems

USA . 3,639 parts In-Stock

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3,639

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TANS Electronics

Latvia . 2,829 parts In-Stock

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2,829

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UHIMA Technologies

Türkiye . 682 parts In-Stock

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682

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Overview

Unleash the power of innovation with the NTLJD3115PTAG by Onsemi. Crafted with precision and excellence, this P-CHANNEL Power Field Effect Transistor (FET) offers unparalleled performance and reliability for your switching applications. With a maximum drain current of 3.3A and a low on-resistance of 0.135 ohm, this transistor is designed to deliver exceptional efficiency and power handling capabilities. Say goodbye to limitations and embrace endless possibilities with the NTLJD3115PTAG - where quality meets value, and innovation knows no bounds.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body provides good insulation and protection for the transistor, ensuring reliable performance.

Polarity or Channel Type: P-CHANNEL

P-channel FETs are known for their high efficiency and low power consumption, making this transistor a good choice for power-saving applications.

Transistor Application: SWITCHING

Designed for switching applications, this FET can handle rapid on/off transitions efficiently, making it suitable for use in power control circuits.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs offer better control over the current flow, allowing for precise power management in various electronic devices.

Maximum Power Dissipation (Abs): 1.5 W

With a maximum power dissipation of 1.5 W, this FET can handle moderate power levels without overheating, ensuring long-term reliability.

Technical Specifications

Power Field Effect Transistors (FET) NTLJD3115PTAG attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Additional Features:

LOGIC LEVEL COMPATIBLE

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

20 V

Maximum Drain Current (Abs) (ID):

3.3 A

Maximum Drain Current (ID):

2.3 A

Maximum Drain-Source On Resistance:

.135 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

S-PDSO-N6

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

6

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

20 A

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Finish:

Tin (Sn)

Terminal Form:

NO LEAD

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTLJD3115PTAG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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