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NTLJD2105LTBG

Onsemi

NTLJD2105LTBG by Onsemi

NTLJD2105LTBG by Onsemi is a Power FET with N/P-Channel, 8V DS Breakdown Voltage, and 0.05 ohm RDS(on). Ideal for switching applications, it features a complex configuration in a small outline package with dual terminals. The MOSFET technology and silicon material ensure efficient performance in enhancement mode operation.

Median Price

$0.242

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 44,912 parts In-Stock

1+ parts

-

100+ parts

$0.251

1k+ parts

$0.208

10k+ parts

$0.186

44,912

-

$0.251

$0.208

$0.186

DigiKey

USA . 44,912 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

$0.210

44,912

-

-

-

$0.210

Farnell

UK . 44,912 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.261

44,912

-

-

-

$0.261

Verical

USA . 2,980 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.232

2,980

-

-

-

$0.232

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 825 parts In-Stock

1+ parts

$0.196

100+ parts

-

1k+ parts

-

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825

$0.196

-

-

-

Vyrian

USA . 630 parts In-Stock

1+ parts

$0.206

100+ parts

-

1k+ parts

-

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-

630

$0.206

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 104 parts In-Stock

1+ parts

$0.185

100+ parts

-

1k+ parts

-

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-

104

$0.185

-

-

-

Corohmni

South Africa . 113 parts In-Stock

1+ parts

$0.206

100+ parts

-

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-

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113

$0.206

-

-

-

Component Stockers USA

USA . 34,930 parts In-Stock

1+ parts

$0.210

100+ parts

$0.200

1k+ parts

$0.180

10k+ parts

$0.180

34,930

$0.210

$0.200

$0.180

$0.180

Advanced Electronics

New Zealand . 100 parts In-Stock

1+ parts

$1.176

100+ parts

$1.164

1k+ parts

$1.117

10k+ parts

-

100

$1.176

$1.164

$1.117

-

Continental Prestige Electronics

USA . 44,912 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.200

10k+ parts

-

44,912

-

-

$0.200

-

QUARKTWIN TECHNOLOGY LTD

USA . 18,829 parts In-Stock

1+ parts

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18,829

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A-Z Elektronik GmbH

Germany . 7,289 parts In-Stock

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7,289

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SupplyDigital Components

Austria . 6,753 parts In-Stock

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6,753

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Kulean Microsystems

USA . 6,524 parts In-Stock

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6,524

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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5,000

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Kepictronics

USA . 3,500 parts In-Stock

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3,500

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Assy Fe

Spain . 3,301 parts In-Stock

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3,301

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Metaverse IC Inc.

Canada . 3,000 parts In-Stock

1+ parts

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100+ parts

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3,000

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TANS Electronics

Latvia . 742 parts In-Stock

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742

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UHIMA Technologies

Türkiye . 738 parts In-Stock

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738

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Problanco Electronics

Mexico . 93 parts In-Stock

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93

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Overview

Unleash the power of innovation with the NTLJD2105LTBG by Onsemi. Crafted with precision and expertise, this Power FET offers unparalleled performance and reliability for your switching applications. With a complex configuration and dual-channel design, this transistor is designed to exceed your expectations. Say goodbye to inefficiency and hello to seamless operation with its low on-resistance and high breakdown voltage. Elevate your projects with the NTLJD2105LTBG - where quality meets excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the transistor, ensuring it can withstand various environmental conditions.

Polarity or Channel Type: N-CHANNEL AND P-CHANNEL

Having both N-channel and P-channel types allows for versatility in circuit design, catering to different applications.

Configuration: COMPLEX

The complex configuration indicates that this FET can handle more intricate circuit requirements, making it suitable for advanced applications.

Transistor Application: SWITCHING

Specifically designed for switching applications, ensuring efficient and reliable performance in controlling the flow of current.

Surface Mount: YES

The surface mount feature facilitates easy installation on circuit boards, saving space and enabling automated assembly processes.

Minimum DS Breakdown Voltage: 8 V

The 8V breakdown voltage ensures the safety and stability of the transistor in handling higher voltages.

Package Shape: SQUARE

The square shape makes it easy to mount and position the transistor on the circuit board for optimal performance.

Terminal Form: C BEND

The C bend terminal form provides secure connections and minimizes the risk of disconnection during operation.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for precise control of the transistor's conductivity, enabling efficient switching and power management.

No. of Elements: 2

Having 2 elements adds versatility to the transistor's functionality, providing options for different circuit requirements.

No. of Terminals: 6

The 6 terminals offer multiple connection points, allowing for flexibility in circuit design and integration.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space, making it suitable for compact electronic devices and PCB layouts.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

The metal-oxide semiconductor technology enhances the transistor's performance and reliability in various operating conditions.

Transistor Element Material: SILICON

Silicon is a common and reliable material for transistor elements, ensuring stability and durability in electronic circuits.

Terminal Finish: MATTE TIN

Matte tin finish provides good solderability and corrosion resistance, enhancing the lifespan and performance of the transistor.

Maximum Drain-Source On Resistance: 0.05 ohm

The low on-resistance of 0.05 ohm minimizes power loss and heat generation, leading to efficient operation of the transistor.

Terminal Position: DUAL

Dual terminal position offers flexibility in connecting the transistor in various circuit configurations, accommodating different design requirements.

Case Connection: DRAIN

The drain connection feature allows for effective dissipation of heat, ensuring the transistor's temperature remains within safe operating limits.

Technical Specifications

Power Field Effect Transistors (FET) NTLJD2105LTBG attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Case Connection:

DRAIN

Configuration:

Minimum DS Breakdown Voltage:

8 V

Maximum Drain-Source On Resistance:

.05 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

S-PDSO-C6

JESD-609 Code:

e3

No. of Elements:

2

No. of Terminals:

6

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

SQUARE

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

C BEND

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTLJD2105LTBG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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