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NTLJF3118NTBG

Onsemi

NTLJF3118NTBG by Onsemi

NTLJF3118NTBG by Onsemi is an N-CHANNEL FET with a built-in diode, ideal for SWITCHING applications. It features a 20V DS Breakdown Voltage, 18A IDM, and 0.065 ohm RDS(ON). This SMALL OUTLINE transistor in SQUARE package has DUAL terminals and operates in ENHANCEMENT MODE.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 2,448 parts In-Stock

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Vyrian

USA . 1,749 parts In-Stock

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Problanco Electronics

Mexico . 8,251 parts In-Stock

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SupplyDigital Components

Austria . 6,859 parts In-Stock

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Kulean Microsystems

USA . 6,485 parts In-Stock

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Kepictronics

USA . 3,500 parts In-Stock

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TANS Electronics

Latvia . 3,482 parts In-Stock

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Corphita

USA . 1,111 parts In-Stock

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UHIMA Technologies

Türkiye . 939 parts In-Stock

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Corohmni

South Africa . 397 parts In-Stock

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Overview

Experience the power of innovation with the NTLJF3118NTBG by Onsemi. As a leader in Power Field Effect Transistors, Onsemi delivers top-notch quality and reliability in every product. This N-CHANNEL FET with a built-in diode is perfect for switching applications, offering enhanced performance and efficiency. With a maximum pulsed drain current of 18A and a low on-resistance of 0.065 ohm, this transistor is designed to meet your power needs. Trust Onsemi to provide cutting-edge technology that exceeds expectations. Elevate your projects with the NTLJF3118NTBG today!

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL FETs generally have higher electron mobility and lower on-resistance, making them ideal for high power applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for more efficient switching and protection against reverse voltage.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring fast response times and efficient power handling.

Minimum DS Breakdown Voltage: 20 V

With a minimum breakdown voltage of 20V, this FET can handle high voltage loads reliably.

Surface Mount: YES

Surface mount FETs are easier to install and allow for higher component density on circuit boards.

Maximum Pulsed Drain Current (IDM): 18 A

The high pulsed drain current rating makes this FET suitable for applications requiring short bursts of high power.

Maximum Drain Current (ID): 2.6 A

With a maximum drain current of 2.6A, this FET can handle moderate power loads efficiently.

Maximum Drain-Source On Resistance: 0.065 ohm

The low on-resistance of 0.065 ohm minimizes power loss and improves overall efficiency.

Technical Specifications

Power Field Effect Transistors (FET) NTLJF3118NTBG attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Minimum DS Breakdown Voltage:

20 V

Maximum Drain Current (ID):

2.6 A

Maximum Drain-Source On Resistance:

.065 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

S-XDSO-C6

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

6

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

UNSPECIFIED

Package Shape:

SQUARE

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

18 A

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

C BEND

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTLJF3118NTBG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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