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NTD85N02RT4G

Onsemi

NTD85N02RT4G by Onsemi

NTD85N02RT4G by Onsemi is a Power FET with N-CHANNEL polarity, suitable for SWITCHING applications. It features a 24V DS Breakdown Voltage, 192A Max Pulsed Drain Current, and 0.0052 ohm Max Drain-Source Resistance. Ideal for high-power switching circuits in various electronic devices.

Median Price

$0.203

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 9,472 parts In-Stock

1+ parts

-

100+ parts

$0.211

1k+ parts

$0.175

10k+ parts

$0.156

9,472

-

$0.211

$0.175

$0.156

Verical

USA . 9,472 parts In-Stock

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$0.195

9,472

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$0.195

Distributors (In-Stock)

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Digiode

USA . 793 parts In-Stock

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$0.164

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793

$0.164

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DF Sales Co.

USA . 485 parts In-Stock

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$0.480

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485

$0.480

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DF Sales Co.

USA . 485 parts In-Stock

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$0.480

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485

$0.480

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J2 Sourcing AB

Sweden . 9,990 parts In-Stock

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9,990

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Vyrian

USA . 7,037 parts In-Stock

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M&R Communications

USA . 1,407 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 1,611 parts In-Stock

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$0.156

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1,611

$0.156

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Corohmni

South Africa . 298 parts In-Stock

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$0.173

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298

$0.173

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Component Stockers USA

USA . 9,788 parts In-Stock

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$0.180

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$0.170

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$0.150

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9,788

$0.180

$0.170

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AZTECH Wire

Italy . 507 parts In-Stock

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$12.540

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507

$12.540

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Kepictronics

USA . 38,800 parts In-Stock

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38,800

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Metaverse IC Inc.

Canada . 38,652 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 16,047 parts In-Stock

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Continental Prestige Electronics

USA . 9,472 parts In-Stock

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$0.159

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Kulean Microsystems

USA . 7,030 parts In-Stock

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SupplyDigital Components

Austria . 5,967 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,753 parts In-Stock

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TANS Electronics

Latvia . 5,511 parts In-Stock

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Problanco Electronics

Mexico . 4,328 parts In-Stock

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Perfect Parts

USA . 1,680 parts In-Stock

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1,680

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UHIMA Technologies

Türkiye . 962 parts In-Stock

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962

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GreenTree Electronics

Israel . 650 parts In-Stock

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650

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Overview

Power up your applications with the NTD85N02RT4G by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality power field effect transistors that provide reliable performance and efficiency. Ideal for switching applications, this N-channel transistor offers enhanced mode operation and a built-in diode for added convenience. With a maximum drain current of 85A and low on-resistance, this transistor ensures optimal power distribution and control. Trust Onsemi to deliver exceptional products that meet your power needs seamlessly.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, making the product reliable and long-lasting.

Polarity or Channel Type: N-CHANNEL

N-CHANNEL transistors typically have higher efficiency and better performance compared to P-CHANNEL transistors for switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Built-in diode allows for easier circuit design and offers added convenience for certain applications.

Transistor Application: SWITCHING

Specifically designed for switching applications, ensuring efficient and reliable operation in various circuits.

Surface Mount: YES

Allows for easy and convenient installation on circuit boards, saving space and simplifying assembly processes.

Minimum DS Breakdown Voltage: 24 V

Ensures the transistor can handle a minimum of 24 volts before breakdown, providing reliable performance in high voltage applications.

Maximum Pulsed Drain Current (IDM): 192 A

High pulsed drain current rating allows for handling of sudden high current surges, making it suitable for power switching applications.

Maximum Power Dissipation (Abs): 78.1 W

High power dissipation capability ensures the transistor can handle high power levels without overheating, maintaining stability in operation.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high efficiency and reliability, making the transistor suitable for demanding applications.

Maximum Operating Temperature: 150 °C

Can operate effectively at high temperatures, providing reliability in harsh environmental conditions.

Maximum Drain Current (ID): 85 A

High drain current rating allows for handling of high current loads, making it suitable for power applications.

Maximum Drain-Source On Resistance: 0.0052 ohm

Low on resistance ensures minimal power loss and efficient operation in power switching applications.

Technical Specifications

Power Field Effect Transistors (FET) NTD85N02RT4G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

85 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

24 V

Maximum Drain Current (Abs) (ID):

12 A

Maximum Drain Current (ID):

85 A

Maximum Drain-Source On Resistance:

.0052 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

192 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTD85N02RT4G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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