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NTD80N02-032

Onsemi

NTD80N02-032 by Onsemi

NTD80N02-032 by Onsemi is a Power FET with N-CHANNEL polarity, suitable for SWITCHING applications. It features a 24V DS Breakdown Voltage, 200A IDM, and 0.0058 ohm RDS(on). With a max power dissipation of 75W and operating temperature of 150 °C, it is ideal for high-power switching circuits.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

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SupplyDigital Components

Austria . 7,631 parts In-Stock

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Corphita

USA . 1,842 parts In-Stock

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Problanco Electronics

Mexico . 1,247 parts In-Stock

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UHIMA Technologies

Türkiye . 557 parts In-Stock

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Corohmni

South Africa . 499 parts In-Stock

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Kulean Microsystems

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TANS Electronics

Latvia . 235 parts In-Stock

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Overview

Unleash the power of innovation with the NTD80N02-032 by Onsemi, a top-quality Power Field Effect Transistor that delivers unmatched performance and reliability. Designed for switching applications, this N-CHANNEL transistor boasts a maximum drain current of 80A and a low on-resistance of just 0.0058 ohm. With a built-in diode and an operating mode in enhancement mode, this transistor ensures seamless operation in various electrical systems. Trust in Onsemi's expertise and choose the NTD80N02-032 for your next project to experience unparalleled efficiency and precision.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material suitable for various applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Convenient setup with integrated diode for easier circuit design.

Minimum DS Breakdown Voltage: 24 V

Can handle higher voltages for robust performance.

Transistor Application: SWITCHING

Designed for efficient switching applications.

Maximum Pulsed Drain Current (IDM): 200 A

Capable of handling high current pulses.

Avalanche Energy Rating (EAS): 733 mJ

Good for applications where energy spikes are a concern.

Maximum Power Dissipation (Abs): 75 W

Effective heat dissipation capabilities for sustained use.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Advanced technology for efficient performance.

Maximum Operating Temperature: 150 °C

Can operate in high-temperature environments.

Maximum Drain-Source On Resistance: 0.0058 ohm

Low resistance for efficient power flow.

Technical Specifications

Power Field Effect Transistors (FET) NTD80N02-032 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

733 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

24 V

Maximum Drain Current (Abs) (ID):

80 A

Maximum Drain Current (ID):

80 A

Maximum Drain-Source On Resistance:

.0058 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSIP-T3

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

IN-LINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

200 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTD80N02-032 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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