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NTD80N02T4G

Onsemi

NTD80N02T4G by Onsemi

NTD80N02T4G by Onsemi is a Power FET with N-CHANNEL polarity, suitable for SWITCHING applications. It features a 24V DS Breakdown Voltage, 200A Max Pulsed Drain Current, and 0.0058 ohm Max RDS(on). The transistor operates in ENHANCEMENT MODE and has a max power dissipation of 75W.

Median Price

$0.185

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 300 parts In-Stock

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-

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$0.185

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$0.153

10k+ parts

$0.137

300

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$0.185

$0.153

$0.137

Distributors (In-Stock)

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Digiode

USA . 795 parts In-Stock

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$0.144

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$0.144

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DF Sales Co.

USA . 200 parts In-Stock

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$3.200

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200

$3.200

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DF Sales Co.

USA . 200 parts In-Stock

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$3.200

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200

$3.200

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Bristol Electronics

USA . 55,141 parts In-Stock

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Vyrian

USA . 4,988 parts In-Stock

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Velocity Electronics

USA . 94 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 121 parts In-Stock

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$0.137

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Corohmni

South Africa . 294 parts In-Stock

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$0.152

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$0.152

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Component Stockers USA

USA . 227 parts In-Stock

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$0.160

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$0.150

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227

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Benley Electronics

USA . 40 parts In-Stock

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$0.400

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$0.400

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AZTECH Wire

Italy . 362 parts In-Stock

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$20.220

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Perfect Parts

USA . 42,231 parts In-Stock

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Kepictronics

USA . 24,500 parts In-Stock

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A-Z Elektronik GmbH

Germany . 2,144 parts In-Stock

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Kulean Microsystems

USA . 1,931 parts In-Stock

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SupplyDigital Components

Austria . 946 parts In-Stock

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TANS Electronics

Latvia . 344 parts In-Stock

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Authorized Procurement Solutions

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GreenTree Electronics

Israel . 294 parts In-Stock

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Problanco Electronics

Mexico . 191 parts In-Stock

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UHIMA Technologies

Türkiye . 27 parts In-Stock

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Overview

Power up your devices with the NTD80N02T4G by Onsemi! This high-quality Power Field Effect Transistor offers enhanced performance and reliability for all your switching applications. With a maximum drain current of 80A and a low on-resistance of 0.0058 ohm, this N-channel transistor ensures efficient power management. Whether you're in need of a single transistor with a built-in diode or require a surface-mount solution, the NTD80N02T4G delivers superior functionality and value. Trust Onsemi's expertise in semiconductor technology to elevate your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good insulation and protection for the internal components of the FET, ensuring reliable performance.

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally have better conductivity and higher efficiency compared to P-channel FETs.

Transistor Application: SWITCHING

Ideal for applications where fast switching speeds are required, making it suitable for power management and control.

Surface Mount: YES

Allows for easy and convenient mounting on circuit boards, saving space and simplifying assembly.

Minimum DS Breakdown Voltage: 24 V

Can handle higher voltage levels without breakdown, providing enhanced reliability.

Maximum Power Dissipation (Abs): 75 W

Capable of dissipating high power levels, making it suitable for demanding applications.

Maximum Operating Temperature: 150 °C

Can operate at high temperatures without performance degradation, ensuring reliability in harsh environments.

Technical Specifications

Power Field Effect Transistors (FET) NTD80N02T4G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

733 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

24 V

Maximum Drain Current (Abs) (ID):

80 A

Maximum Drain Current (ID):

80 A

Maximum Drain-Source On Resistance:

.0058 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

200 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTD80N02T4G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.95

SB

8541.29.00.80

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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