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NTD80N02032G

Onsemi

NTD80N02032G by Onsemi

NTD80N02032G by Onsemi is a Power FET with N-CHANNEL polarity, suitable for SWITCHING applications. It features a 24V DS Breakdown Voltage, 200A IDM, and 0.0058 ohm RDS(on). With an EAS of 733mJ and max temp of 150 °C, it's ideal for high-power switching circuits.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 2,001 parts In-Stock

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Digiode

USA . 648 parts In-Stock

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648

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TANS Electronics

Latvia . 8,380 parts In-Stock

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Problanco Electronics

Mexico . 5,130 parts In-Stock

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Kulean Microsystems

USA . 3,707 parts In-Stock

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SupplyDigital Components

Austria . 2,369 parts In-Stock

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Corphita

USA . 1,506 parts In-Stock

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UHIMA Technologies

Türkiye . 524 parts In-Stock

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Corohmni

South Africa . 209 parts In-Stock

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Overview

Unleash the power of the NTD80N02032G by Onsemi, a top-tier manufacturer known for their superior quality and reliability. As a member of the Power Field Effect Transistor category, this N-CHANNEL transistor offers unmatched performance in switching applications. With a built-in diode and an impressive 80A maximum drain current, this transistor provides exceptional value and efficiency. Whether you're looking to optimize your power management system or enhance your electronic projects, the NTD80N02032G delivers on both performance and durability. Elevate your designs with this innovative solution from Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the transistor, ensuring long-term reliability.

Polarity or Channel Type: N-CHANNEL

N-channel FETs are often more efficient and have better performance than P-channel FETs.

Configuration: SINGLE WITH BUILT-IN DIODE

Built-in diode helps in preventing reverse current flow and protects the circuit from damage.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring optimal performance in those scenarios.

Minimum DS Breakdown Voltage: 24 V

Can handle high voltages, making it suitable for a wide range of applications.

Package Shape: RECTANGULAR

Allows for easy mounting and installation in various electronic devices.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide strong mechanical connections, ideal for high-power applications.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs are easy to control and offer high efficiency in switching operations.

Maximum Pulsed Drain Current (IDM): 200 A

Capable of handling high current pulses, suitable for demanding applications.

Avalanche Energy Rating (EAS): 733 mJ

High avalanche energy rating ensures reliability under extreme operating conditions.

Maximum Drain Current (Abs) (ID): 80 A

Allows for high current carrying capacity, suitable for power applications.

No. of Terminals: 3

Simplifies the connection process, making installation easier.

Maximum Power Dissipation (Abs): 75 W

Can handle high power dissipation, ensuring stable operation under load.

Package Style (Meter): IN-LINE

Compact in-line package style saves space and allows for efficient PCB layout.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology ensures high performance and low power consumption.

Maximum Operating Temperature: 150 °C

Can operate at high temperatures without degradation, suitable for harsh environments.

Transistor Element Material: SILICON

Silicon-based transistors offer high performance and reliability.

Maximum Drain-Source On Resistance: 0.0058 ohm

Low on-resistance minimizes power loss and improves efficiency.

Terminal Position: SINGLE

Single terminal connection simplifies circuit design and installation.

Case Connection: DRAIN

Drain connection for easy interfacing with external circuits.

Technical Specifications

Power Field Effect Transistors (FET) NTD80N02032G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

733 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

24 V

Maximum Drain Current (Abs) (ID):

80 A

Maximum Drain Current (ID):

80 A

Maximum Drain-Source On Resistance:

.0058 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSIP-T3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

IN-LINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

200 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTD80N02032G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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