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NTD80N02T4

Onsemi

NTD80N02T4 by Onsemi

NTD80N02T4 by Onsemi is a Power FET with N-CHANNEL polarity, suitable for SWITCHING applications. It features a Max Drain Current of 80A, Min DS Breakdown Voltage of 24V, and Max Pulsed Drain Current of 200A. This MOSFET operates in ENHANCEMENT MODE and has a max power dissipation of 75W, making it ideal for high-power switching applications.

Median Price

$0.178

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

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Rochester

USA . 25,023 parts In-Stock

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-

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$0.185

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$0.153

10k+ parts

$0.137

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$0.185

$0.153

$0.137

Verical

USA . 18,895 parts In-Stock

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$0.171

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$0.171

Distributors (In-Stock)

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Digiode

USA . 247 parts In-Stock

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$0.144

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Bristol Electronics

USA . 10,308 parts In-Stock

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Atlantic Semiconductor

USA . 10,308 parts In-Stock

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Vyrian

USA . 6,516 parts In-Stock

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Microfarads

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Corphita

USA . 2,015 parts In-Stock

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$0.137

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$0.137

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Corohmni

South Africa . 388 parts In-Stock

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$0.159

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388

$0.159

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AZTECH Wire

Italy . 742 parts In-Stock

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$21.530

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$21.530

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Continental Prestige Electronics

USA . 25,023 parts In-Stock

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$0.139

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Authorized Procurement Solutions

USA . 25,000 parts In-Stock

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Kepictronics

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TANS Electronics

Latvia . 7,894 parts In-Stock

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Kulean Microsystems

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A-Z Elektronik GmbH

Germany . 6,086 parts In-Stock

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SupplyDigital Components

Austria . 4,748 parts In-Stock

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Problanco Electronics

Mexico . 3,790 parts In-Stock

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Perfect Parts

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UHIMA Technologies

Türkiye . 123 parts In-Stock

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Overview

Unleash the power of innovation with the NTD80N02T4 by Onsemi! As a leading manufacturer in the field of Power Field Effect Transistors, Onsemi delivers exceptional quality and reliability. This N-CHANNEL transistor with a built-in diode is perfect for switching applications, offering enhanced performance and efficiency. With a maximum drain current of 80A and a low on-resistance of 0.0058 ohm, this transistor ensures optimal power delivery. Trust Onsemi to provide superior products that make a difference in your projects. Elevate your designs with the NTD80N02T4!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes the transistor lightweight and cost-effective.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower ON-resistance and faster switching speeds, making this transistor suitable for high-performance applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for protection against reverse voltage and inductive kickback, making this transistor versatile and reliable.

Transistor Application: SWITCHING

Designed specifically for switching applications, this transistor can efficiently control current flow and enhance overall system performance.

Surface Mount: YES

Being surface mountable, this transistor is easy to install and saves space on the PCB, making it ideal for compact designs.

Minimum DS Breakdown Voltage: 24 V

The minimum breakdown voltage of 24V ensures reliable operation and protection against voltage spikes, making this transistor suitable for a wide range of applications.

Maximum Pulsed Drain Current (IDM): 200 A

With a high pulsed drain current rating, this transistor can handle short-duration high current pulses without damage, making it suitable for demanding applications.

Maximum Power Dissipation (Abs): 75 W

The high power dissipation rating of 75W ensures efficient heat dissipation, allowing the transistor to handle high power levels reliably.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature of 150 °C, this transistor can operate in high-temperature environments without compromising performance.

Maximum Drain-Source On Resistance: 0.0058 ohm

The low ON-resistance of 0.0058 ohm results in minimal power loss and heat generation, making this transistor highly efficient.

Technical Specifications

Power Field Effect Transistors (FET) NTD80N02T4 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

733 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

24 V

Maximum Drain Current (Abs) (ID):

80 A

Maximum Drain Current (ID):

80 A

Maximum Drain-Source On Resistance:

.0058 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

235

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

200 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTD80N02T4 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.95

SB

8541.29.00.80

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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