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NTD85N02R-001G

Onsemi

NTD85N02R-001G by Onsemi

NTD85N02R-001G by Onsemi is a Power FET with N-CHANNEL polarity, suitable for SWITCHING applications. It features a 24V DS Breakdown Voltage, 192A IDM, and 0.0052 ohm Drain-Source Resistance. This METAL-OXIDE SEMICONDUCTOR device operates in ENHANCEMENT MODE at up to 150 °C, making it ideal for high-power switching circuits.

Median Price

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USA . 677 parts In-Stock

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Vyrian

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Problanco Electronics

Mexico . 5,749 parts In-Stock

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SupplyDigital Components

Austria . 2,876 parts In-Stock

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TANS Electronics

Latvia . 2,557 parts In-Stock

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Kulean Microsystems

USA . 2,518 parts In-Stock

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Corphita

USA . 1,941 parts In-Stock

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UHIMA Technologies

Türkiye . 955 parts In-Stock

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Corohmni

South Africa . 382 parts In-Stock

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Overview

Power up your applications with the NTD85N02R-001G by Onsemi! Crafted with precision and reliability, this N-channel Power FET is designed for superior switching performance. With a maximum drain current of 85A and a low on-resistance of 0.0052 ohm, this transistor ensures efficient power management. Whether you're in need of enhanced mode operation or high pulsed drain current capabilities, this transistor has got you covered. Say goodbye to power inefficiencies and hello to seamless performance with the NTD85N02R-001G from Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides a durable and lightweight housing for the transistor, making it suitable for a variety of applications.

Polarity or Channel Type: N-CHANNEL

Allows for efficient control of current flow in the circuit, enhancing overall performance.

Configuration: SINGLE WITH BUILT-IN DIODE

Simplifies circuit design by incorporating a diode within the transistor, saving space and reducing component count.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring reliable performance in on/off operations.

Minimum DS Breakdown Voltage: 24 V

Provides a high voltage tolerance, making the transistor suitable for use in various voltage applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Utilizes advanced MOSFET technology for efficient power handling and low on-resistance.

Maximum Operating Temperature: 150 °C

Can operate at high temperatures without performance degradation, suitable for demanding environments.

Technical Specifications

Power Field Effect Transistors (FET) NTD85N02R-001G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

85 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

24 V

Maximum Drain Current (ID):

85 A

Maximum Drain-Source On Resistance:

.0052 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSIP-T3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

192 A

Qualification:

Not Qualified

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTD85N02R-001G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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