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NTD85N02RG

Onsemi

NTD85N02RG by Onsemi

NTD85N02RG by Onsemi is a Power FET with N-CHANNEL polarity, suitable for SWITCHING applications. It features a Max Drain Current of 85A, Max Pulsed Drain Current of 192A, and Min DS Breakdown Voltage of 24V. This MOSFET operates in ENHANCEMENT MODE and has a max power dissipation of 78.1W in a SMALL OUTLINE package style.

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4

In-Stock Inventory

1k+

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Vyrian

USA . 4,806 parts In-Stock

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Digiode

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PC Components Company LLC

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Bristol Electronics

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AZTECH Wire

Italy . 1,041 parts In-Stock

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Kepictronics

USA . 13,000 parts In-Stock

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TANS Electronics

Latvia . 6,918 parts In-Stock

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SupplyDigital Components

Austria . 6,461 parts In-Stock

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Problanco Electronics

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Corphita

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Kulean Microsystems

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UHIMA Technologies

Türkiye . 129 parts In-Stock

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Corohmni

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Overview

Discover the power and efficiency of the NTD85N02RG by Onsemi, a top-of-the-line Power Field Effect Transistor perfect for switching applications. With its N-CHANNEL configuration and built-in diode, this transistor offers unparalleled performance and reliability. Made with high-quality materials and advanced technology, Onsemi ensures that this product delivers maximum power dissipation and a low drain-source on resistance. Ideal for various industries, this transistor is a game-changer in enhancing operations and boosting productivity. Experience the difference with Onsemi's NTD85N02RG and elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable or long-lasting applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs have lower ON resistance and higher efficiency compared to P-channel FETs, making them suitable for high-performance applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for protection against reverse voltage spikes, increasing the reliability and safety of the circuit.

Transistor Application: SWITCHING

Designed for switching applications, this FET provides fast switching speeds and low power dissipation, making it efficient for various electronic circuits.

Surface Mount: YES

Being surface mountable, this FET can be easily integrated into compact PCB designs, saving space and facilitating automated assembly.

Minimum DS Breakdown Voltage: 24 V

With a high breakdown voltage, this FET can handle higher voltages without breakdown, ensuring reliable performance in demanding environments.

Maximum Pulsed Drain Current (IDM): 192 A

Capable of handling high currents in pulse applications, this FET is suitable for power-hungry devices or systems that require bursts of energy.

Maximum Power Dissipation (Abs): 78.1 W

The high power dissipation capability ensures the FET can operate under heavy loads without overheating, contributing to the overall reliability of the circuit.

Maximum Operating Temperature: 150 °C

With a high operating temperature range, this FET can withstand elevated temperatures without performance degradation, suitable for applications exposed to heat.

Technical Specifications

Power Field Effect Transistors (FET) NTD85N02RG attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

85 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

24 V

Maximum Drain Current (Abs) (ID):

12 A

Maximum Drain Current (ID):

85 A

Maximum Drain-Source On Resistance:

.0052 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

192 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTD85N02RG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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