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NTD85N02R1

Onsemi

NTD85N02R1 by Onsemi

NTD85N02R1 by Onsemi is a Power FET with N-CHANNEL polarity, suitable for SWITCHING applications. It features a 24V DS Breakdown Voltage, 96A IDM, and 0.0052 ohm RDS(ON). This METAL-OXIDE SEMICONDUCTOR device has a max operating temperature of 150 °C and comes in an IN-LINE package style.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 2,026 parts In-Stock

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Digiode

USA . 1,345 parts In-Stock

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Kepictronics

USA . 33,000 parts In-Stock

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Metaverse IC Inc.

Canada . 33,000 parts In-Stock

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TANS Electronics

Latvia . 7,557 parts In-Stock

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SupplyDigital Components

Austria . 6,066 parts In-Stock

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Kulean Microsystems

USA . 6,008 parts In-Stock

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Problanco Electronics

Mexico . 1,229 parts In-Stock

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Corphita

USA . 890 parts In-Stock

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UHIMA Technologies

Türkiye . 598 parts In-Stock

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Corohmni

South Africa . 482 parts In-Stock

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Overview

Discover the NTD85N02R1 by Onsemi, a high-quality Power Field Effect Transistor designed for switching applications. With a single configuration and built-in diode, this transistor offers enhanced performance and reliability. Manufactured by Onsemi, a trusted industry leader, this N-CHANNEL FET provides a maximum Drain Current of 32A and a low on-resistance of 0.0052 ohm. Ideal for a wide range of applications, this transistor guarantees efficient power management and superior performance. Upgrade your electronics with the NTD85N02R1 and experience the value and benefits it brings to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and reliability, making the product suitable for various applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Built-in diode simplifies circuit design and reduces the need for additional components, making the product more efficient.

Transistor Application: SWITCHING

Designed for switching applications, this product offers fast switching speeds and low power consumption.

Minimum DS Breakdown Voltage: 24 V

The minimum breakdown voltage of 24 V ensures reliable operation and protection against voltage spikes.

Maximum Pulsed Drain Current (IDM): 96 A

High pulsed drain current rating allows the product to handle sudden surge currents, making it suitable for power applications.

Maximum Power Dissipation (Abs): 78.1 W

High power dissipation rating ensures the product can handle high power levels without overheating, making it reliable in demanding conditions.

Maximum Operating Temperature: 150 °C

With a maximum operating temperature of 150 °C, this product can operate in high-temperature environments without performance degradation.

Technical Specifications

Power Field Effect Transistors (FET) NTD85N02R1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

85 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

24 V

Maximum Drain Current (Abs) (ID):

12 A

Maximum Drain Current (ID):

32 A

Maximum Drain-Source On Resistance:

.0052 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSIP-T3

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

IN-LINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

96 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTD85N02R1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.95

SB

8541.29.00.80

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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