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NTD85N02R

Onsemi

NTD85N02R by Onsemi

NTD85N02R by Onsemi is a Power FET with N-CHANNEL polarity, suitable for SWITCHING applications. It features a 24V DS Breakdown Voltage, 192A IDM, and 0.0052 ohm Drain-Source Resistance. This MOSFET operates in ENHANCEMENT MODE and has a max power dissipation of 78.1W, making it ideal for high-power switching circuits.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 8,916 parts In-Stock

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Digiode

USA . 346 parts In-Stock

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Prism Electronics

USA . 75 parts In-Stock

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AZTECH Wire

Italy . 124 parts In-Stock

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$9.830

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Kepictronics

USA . 64,000 parts In-Stock

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Problanco Electronics

Mexico . 7,605 parts In-Stock

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Kulean Microsystems

USA . 6,997 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,128 parts In-Stock

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SupplyDigital Components

Austria . 3,024 parts In-Stock

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TANS Electronics

Latvia . 2,490 parts In-Stock

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Corphita

USA . 1,813 parts In-Stock

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UHIMA Technologies

Türkiye . 429 parts In-Stock

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Corohmni

South Africa . 278 parts In-Stock

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Perfect Parts

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Overview

Unlock the power of innovation with the NTD85N02R by Onsemi. Designed with precision and quality in mind, this N-channel Power FET offers unmatched performance in switching applications. With a maximum drain current of 85A and a low on-resistance of 0.0052 ohm, this transistor provides efficient power management solutions for a wide range of electronic devices. Trust in Onsemi's expertise in semiconductor technology and elevate your products to new heights of performance and reliability. Experience the difference with the NTD85N02R - where quality meets innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and resistant to heat and moisture, making the product reliable in various operating conditions.

Polarity or Channel Type: N-CHANNEL

N-Channel FETs typically have lower ON-resistance and higher current carrying capabilities, making them suitable for high-power applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for easier circuit designs and can protect the transistor from reverse voltage spikes, improving reliability.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring efficient and fast operation in turning on and off.

Maximum Drain Current (ID): 85 A

With a high maximum drain current rating, this FET can handle high current loads without overheating or failing.

Maximum Power Dissipation (Abs): 78.1 W

The high power dissipation capability allows the FET to handle significant power levels without getting damaged, making it suitable for demanding applications.

Maximum Operating Temperature: 150 °C

The high operating temperature range ensures the FET can operate reliably in various environments without risk of overheating.

Technical Specifications

Power Field Effect Transistors (FET) NTD85N02R attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

85 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

24 V

Maximum Drain Current (Abs) (ID):

12 A

Maximum Drain Current (ID):

85 A

Maximum Drain-Source On Resistance:

.0052 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e0

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

235

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

192 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTD85N02R Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.95

SB

8541.29.00.80

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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