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NSVBCW32LT1G

Onsemi

NSVBCW32LT1G by Onsemi

NSVBCW32LT1G by Onsemi is a NPN BJT with 32V VCEO, 0.1A IC, and hFE of 200. Ideal for small signal applications in automotive electronics due to AEC-Q101 compliance and 150 °C max operating temp.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Chip Stock

USA . 43,000 parts In-Stock

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Vyrian

USA . 9,476 parts In-Stock

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Digiode

USA . 2,457 parts In-Stock

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AZTECH Wire

Italy . 703 parts In-Stock

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$15.860

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Kepictronics

USA . 306,000 parts In-Stock

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TANS Electronics

Latvia . 7,882 parts In-Stock

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Problanco Electronics

Mexico . 6,776 parts In-Stock

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Kulean Microsystems

USA . 6,613 parts In-Stock

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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SupplyDigital Components

Austria . 3,399 parts In-Stock

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Corphita

USA . 2,115 parts In-Stock

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Corohmni

South Africa . 217 parts In-Stock

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UHIMA Technologies

Türkiye . 120 parts In-Stock

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Overview

Discover the NSVBCW32LT1G by Onsemi, a top-of-the-line Small Signal Bipolar Junction Transistor that offers unparalleled quality and reliability. Manufactured by Onsemi, a trusted name in the industry, this NPN transistor is perfect for a variety of applications. From amplifiers to signal processing, this transistor delivers exceptional performance. With a maximum power dissipation of 0.3W and a minimum DC current gain of 200, this transistor provides value and efficiency for your projects. Upgrade your designs with the NSVBCW32LT1G and experience the benefits of superior technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the transistor, ensuring long-term reliability in various applications.

Polarity or Channel Type: NPN

NPN transistors are commonly used in amplification and switching circuits, making this product versatile for different electronic designs.

Configuration: SINGLE

Simplifies circuit design and integration, making it easier to use in various electronic applications.

Surface Mount: YES

Enables easy and efficient PCB assembly, saving time and effort during manufacturing processes.

Maximum Power Dissipation (Abs): 0.3 W

With a high maximum power dissipation, this transistor can handle heat efficiently, ensuring stable performance under varying load conditions.

Terminal Finish: MATTE TIN

The matte tin finish provides a reliable electrical connection and corrosion resistance, enhancing the overall performance and longevity of the transistor.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature, this transistor can function in a wide range of environments without overheating or performance degradation.

Reference Standard: AEC-Q101

Compliance with AEC-Q101 ensures high reliability and quality standards, making this transistor suitable for automotive applications and other demanding environments.

Technical Specifications

Small Signal Bipolar Junction Transistors (BJT) NSVBCW32LT1G attributes and parameters. Explore more Small Signal Bipolar Junction Transistors (BJT) devices from Onsemi

Specs

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

32 V

Configuration:

Minimum DC Current Gain (hFE):

200

JEDEC-95 Code:

TO-236

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

NPN

Maximum Power Dissipation (Abs):

Reference Standard:

AEC-Q101

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Element Material:

SILICON

Trade Compliance

NSVBCW32LT1G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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