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NSVBC858CLT1G

Onsemi

NSVBC858CLT1G by Onsemi

NSVBC858CLT1G by Onsemi is a PNP BJT with hFE of 420, VCE of 30V, and fT of 100MHz. Ideal for automotive applications due to AEC-Q101 standard compliance. Features GULL WING terminals in a SMALL OUTLINE package.

Median Price

$0.024

Lifecycle Status

Suppliers In-Stock

18

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 2,940 parts In-Stock

1+ parts

$0.024

100+ parts

-

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-

10k+ parts

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2,940

$0.024

-

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Mouser Electronics

USA . 9,137 parts In-Stock

1+ parts

$0.150

100+ parts

$0.058

1k+ parts

$0.044

10k+ parts

$0.036

9,137

$0.150

$0.058

$0.044

$0.036

DigiKey

USA . 3,895 parts In-Stock

1+ parts

$0.180

100+ parts

$0.068

1k+ parts

$0.044

10k+ parts

$0.030

3,895

$0.180

$0.068

$0.044

$0.030

Rochester

USA . 16,470 parts In-Stock

1+ parts

-

100+ parts

$0.023

1k+ parts

$0.019

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$0.017

16,470

-

$0.023

$0.019

$0.017

Future Electronics

Canada . 6,000 parts In-Stock

1+ parts

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$0.022

6,000

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$0.022

Verical

USA . 2,940 parts In-Stock

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$0.016

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2,940

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$0.016

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Chip1Stop

Japan . 2,940 parts In-Stock

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-

100+ parts

$0.029

1k+ parts

$0.025

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2,940

-

$0.029

$0.025

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,261 parts In-Stock

1+ parts

$0.024

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1,261

$0.024

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Nova Conductors

Japan . 29 parts In-Stock

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$0.077

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29

$0.077

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Bristol Electronics

USA . 3,500 parts In-Stock

1+ parts

$0.300

100+ parts

$0.150

1k+ parts

$0.060

10k+ parts

$0.045

3,500

$0.300

$0.150

$0.060

$0.045

Component Electronics Inc.

Canada . 1,350 parts In-Stock

1+ parts

$0.310

100+ parts

$0.230

1k+ parts

$0.200

10k+ parts

-

1,350

$0.310

$0.230

$0.200

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Flip Electronics

USA . 120,000 parts In-Stock

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NAC Semi

USA . 108,000 parts In-Stock

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$0.047

108,000

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$0.047

Vyrian

USA . 6,400 parts In-Stock

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6,400

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ACDS - Activité Composants Distribution Service

France . 3,000 parts In-Stock

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3,000

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Cyclops Electronics Ltd

UK . 3,000 parts In-Stock

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Dan-Mar Components

USA . 3,000 parts In-Stock

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Microfarads

USA . 473 parts In-Stock

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473

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Distributors (Availability)

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Semicontronic

India . 5,847 parts In-Stock

1+ parts

$0.019

100+ parts

$0.019

1k+ parts

$0.018

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5,847

$0.019

$0.019

$0.018

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Corohmni

South Africa . 375 parts In-Stock

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$0.022

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375

$0.022

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Corphita

USA . 592 parts In-Stock

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$0.022

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592

$0.022

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Ampacity Inc.

Singapore . 5,943 parts In-Stock

1+ parts

$0.041

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5,943

$0.041

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Continental Prestige Electronics

USA . 5,918 parts In-Stock

1+ parts

$0.077

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$0.075

5,918

$0.077

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$0.075

Argo Parts USA

USA . 4,674 parts In-Stock

1+ parts

$0.077

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$0.074

4,674

$0.077

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$0.074

Aztec Data Supply Inc.

USA . 1,174 parts In-Stock

1+ parts

$1.505

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1,174

$1.505

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Kepictronics

USA . 306,000 parts In-Stock

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Perfect Parts

USA . 50,400 parts In-Stock

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GreenTree Electronics

Israel . 15,000 parts In-Stock

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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SupplyDigital Components

Austria . 7,387 parts In-Stock

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TANS Electronics

Latvia . 6,697 parts In-Stock

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Kulean Microsystems

USA . 2,337 parts In-Stock

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Problanco Electronics

Mexico . 1,770 parts In-Stock

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1,770

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UHIMA Technologies

Türkiye . 305 parts In-Stock

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305

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Overview

Unleash the power of innovation with the NSVBC858CLT1G by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality Small Signal Bipolar Junction Transistors that guarantee optimal performance and reliability. Whether you're in automotive, industrial, or consumer electronics, this PNP transistor offers unparalleled value and benefits. With a high DC current gain, low collector-emitter voltage, and a compact design for easy surface mounting, this transistor is a game-changer for your electronic projects. Experience efficiency and excellence with the NSVBC858CLT1G.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body makes the transistor lightweight and durable, ensuring long-term reliability.

Polarity or Channel Type: PNP

The PNP configuration allows for easy integration with other PNP transistors and complements certain circuit designs.

Configuration: SINGLE

The single configuration simplifies circuit connections and makes it easier to troubleshoot any issues that may arise.

Surface Mount: YES

Being surface mountable, this transistor is suitable for automated assembly processes, saving time and effort in production.

Package Shape: RECTANGULAR

The rectangular shape of the package allows for efficient use of space on circuit boards, enabling compact designs.

No. of Terminals: 3

Having only 3 terminals simplifies the circuit layout and reduces the chances of errors in connecting the transistor.

Minimum DC Current Gain (hFE): 420

With a high minimum DC current gain, this transistor provides stable amplification in a circuit, enhancing its overall performance.

Maximum Collector-Emitter Voltage: 30 V

The high maximum collector-emitter voltage rating allows for use in various applications without the risk of voltage breakdown.

Transistor Element Material: SILICON

Silicon material for the transistor element ensures high reliability, low leakage current, and excellent thermal stability.

Minimum Operating Temperature: -55 °C

The wide minimum operating temperature range makes this transistor suitable for use in extreme cold environments.

Maximum Collector Current (IC): 0.1 A

With a maximum collector current of 0.1 A, this transistor can handle moderate power levels in various circuit applications.

Terminal Finish: MATTE TIN

The matte tin finish on the terminals provides good solderability and ensures a reliable electrical connection in the circuit.

Terminal Position: DUAL

The dual terminal position allows for flexibility in circuit design and enables easy connection to external components.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time allowed at peak reflow temperature of 260°C ensures proper soldering of the transistor without damaging it.

Peak Reflow Temperature °C: 260

The high peak reflow temperature rating makes the transistor suitable for lead-free soldering processes and high-temperature applications.

Reference Standard: AEC-Q101

Compliance with the AEC-Q101 standard ensures that the transistor meets automotive-grade requirements for reliability and durability.

Nominal Transition Frequency (fT): 100 MHz

The high nominal transition frequency allows for fast switching speeds and high-frequency performance in signal amplification applications.

Technical Specifications

Small Signal Bipolar Junction Transistors (BJT) NSVBC858CLT1G attributes and parameters. Explore more Small Signal Bipolar Junction Transistors (BJT) devices from Onsemi

Specs

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

30 V

Configuration:

Minimum DC Current Gain (hFE):

420

JEDEC-95 Code:

TO-236AB

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

PNP

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Element Material:

SILICON

Nominal Transition Frequency (fT):

Trade Compliance

NSVBC858CLT1G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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