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MJF13007

Onsemi

MJF13007 by Onsemi

MJF13007 by Onsemi is a NPN BJT transistor with 400V VCEO, 8A IC, and 50W Ptot. Ideal for switching applications, it has a hFE of min. 5 and operates up to 150 °C. The package style is flange mount with through-hole terminals, making it suitable for various power electronics designs.

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Lifecycle Status

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LittleDiode

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Electronic Expediters

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Kepictronics

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SupplyDigital Components

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Kulean Microsystems

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Problanco Electronics

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TANS Electronics

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Corphita

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Corohmni

South Africa . 494 parts In-Stock

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UHIMA Technologies

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A-Plus Industry Inc.

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Overview

Unleash the power of innovation with the MJF13007 from Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality Power Bipolar Junction Transistors tailored for SWITCHING applications. The MJF13007's NPN configuration and high operating temperature make it perfect for a wide range of projects. With a maximum Collector-Emitter Voltage of 400V and Maximum Collector Current of 8A, this transistor is designed for optimal performance and reliability. Trust Onsemi to provide cutting-edge solutions that meet your needs and exceed your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides good insulation and protection for the transistor, making it durable and reliable for long-term use.

Polarity or Channel Type: NPN

NPN transistors are commonly used in switching applications due to their high efficiency and fast response times.

Configuration: SINGLE

Single configuration makes it easy to integrate into circuits and simplifies the design process.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring high performance and efficiency in such operations.

Package Shape: RECTANGULAR

Rectangular shape allows for easy mounting and placement on PCBs, optimizing space usage.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide secure and reliable connections, making installation and maintenance easier.

No. of Terminals: 3

Having 3 terminals allows for easy connection and suitable for basic circuit designs.

Maximum Power Dissipation (Abs): 50 W

High power dissipation capability ensures the transistor can handle demanding applications without overheating.

Package Style (Meter): FLANGE MOUNT

Flange mount package style offers stability and secure mounting for industrial applications.

Minimum DC Current Gain (hFE): 5

Having a minimum hFE of 5 ensures reliable amplification of current in various circuit configurations.

Maximum Operating Temperature: 150 °C

High maximum operating temperature allows the transistor to withstand harsh environmental conditions.

Maximum Collector-Emitter Voltage: 400 V

High collector-emitter voltage rating ensures the transistor can handle high voltage applications safely.

Transistor Element Material: SILICON

Silicon material provides high reliability, efficiency, and performance for the transistor.

Maximum Collector Current (IC): 8 A

High collector current rating allows the transistor to handle large currents without damage.

Terminal Finish: TIN LEAD

Tin lead finish ensures good solderability and reliability for terminal connections.

Terminal Position: SINGLE

Single terminal position simplifies installation and connections in circuit designs.

Case Connection: ISOLATED

Isolated case connection helps prevent short circuits and ensures safe operation in circuits.

Peak Reflow Temperature °C: 235

High peak reflow temperature allows for reliable soldering and reworking processes during assembly.

Reference Standard: UL RECOGNIZED

UL recognized standard ensures the transistor meets safety and quality requirements for reliable performance.

Nominal Transition Frequency (fT): 14 MHz

High nominal transition frequency indicates fast switching speeds and high-frequency operation capability.

Technical Specifications

Power Bipolar Junction Transistors (BJT) MJF13007 attributes and parameters. Explore more Power Bipolar Junction Transistors (BJT) devices from Onsemi

Specs

Case Connection:

ISOLATED

Maximum Collector Current (IC):

8 A

Maximum Collector-Emitter Voltage:

400 V

Configuration:

Minimum DC Current Gain (hFE):

5

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

235

Polarity or Channel Type:

NPN

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Reference Standard:

UL RECOGNIZED

Sub-Category:

Other Transistors

Surface Mount:

NO

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Nominal Transition Frequency (fT):

Trade Compliance

MJF13007 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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