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MC10H105MG

Onsemi

MC10H105MG by Onsemi

MC10H105MG by Onsemi is a Logic Gate with 3 functions and inputs. It has a propagation delay of 1.2 ns at -5.2V, suitable for high-speed applications in commercial electronics due to its ECL technology and small outline package style.

Median Price

$2.320

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 8,676 parts In-Stock

1+ parts

-

100+ parts

$2.190

1k+ parts

$1.960

10k+ parts

$1.850

8,676

-

$2.190

$1.960

$1.850

Verical

USA . 5,476 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.450

10k+ parts

$2.313

5,476

-

-

$2.450

$2.313

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,862 parts In-Stock

1+ parts

$2.328

100+ parts

-

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-

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1,862

$2.328

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-

-

DigiKey Marketplace

USA . 8,676 parts In-Stock

1+ parts

-

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8,676

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-

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Vyrian

USA . 7,562 parts In-Stock

1+ parts

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7,562

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Semtec, LLC

USA . 23 parts In-Stock

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23

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ACDS - Activité Composants Distribution Service

France . 3 parts In-Stock

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3

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,138 parts In-Stock

1+ parts

$2.205

100+ parts

-

1k+ parts

-

10k+ parts

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2,138

$2.205

-

-

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Corohmni

South Africa . 486 parts In-Stock

1+ parts

$2.450

100+ parts

-

1k+ parts

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10k+ parts

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486

$2.450

-

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Component Stockers USA

USA . 5,763 parts In-Stock

1+ parts

$2.480

100+ parts

$2.330

1k+ parts

$2.110

10k+ parts

-

5,763

$2.480

$2.330

$2.110

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AZTECH Wire

Italy . 515 parts In-Stock

1+ parts

$14.150

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515

$14.150

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QUARKTWIN TECHNOLOGY LTD

USA . 27,554 parts In-Stock

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27,554

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Continental Prestige Electronics

USA . 8,676 parts In-Stock

1+ parts

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100+ parts

$2.120

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8,676

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$2.120

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Problanco Electronics

Mexico . 6,791 parts In-Stock

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6,791

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TANS Electronics

Latvia . 3,514 parts In-Stock

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3,514

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Microchip USA

USA . 3,055 parts In-Stock

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3,055

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SupplyDigital Components

Austria . 2,680 parts In-Stock

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2,680

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Kulean Microsystems

USA . 1,706 parts In-Stock

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1,706

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UHIMA Technologies

Türkiye . 581 parts In-Stock

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581

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Overview

Discover the MC10H105MG by Onsemi, a high-quality logic gate that offers unmatched performance and reliability. With Onsemi's reputation for excellence in manufacturing, you can trust that this product will meet your expectations. Ideal for a wide range of applications, this logic gate provides fast propagation delay, making it a valuable addition to any project. Experience the benefits of seamless integration, precise functionality, and exceptional value with the MC10H105MG. Choose Onsemi for top-tier quality and performance in every component.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material makes the product lightweight and durable, ideal for portable or long-lasting applications.

Propagation Delay At Nominal Supply: 1.3 ns

Fast propagation delay of 1.3 ns ensures quick response times, making this product suitable for high-speed applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving time and labor costs.

No. of Functions: 3

Having 3 different functions in a single package provides versatility and saves board space in complex circuit designs.

Nominal Supply Voltage / Vsup (V): -5.2

Stable supply voltage of -5.2V ensures consistent and reliable operation of the logic gates.

Minimum Operating Temperature: 0 °C

Wide operating temperature range from 0 to 75 °C makes the product suitable for use in various environmental conditions.

Maximum Power Supply Current (ICC): 23 mA

Low power supply current of 23 mA helps in reducing power consumption and extending battery life in portable devices.

Technical Specifications

Logic Gates MC10H105MG attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

10H

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

10.2 mm

Logic IC Type:

No. of Functions:

3

No. of Inputs:

3

No. of Terminals:

16

Maximum Operating Temperature:

75 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

RAIL

Peak Reflow Temperature (C):

260

Power Supplies (V):

-5.2

Maximum Power Supply Current (ICC):

23 mA

Propagation Delay At Nominal Supply:

1.3 ns

Propagation Delay (tpd):

1.2 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

2.05 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

-5.46 V

Minimum Supply Voltage (Vsup):

-4.94 V

Nominal Supply Voltage / Vsup (V):

-5.2

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

5.275 mm

Trade Compliance

MC10H105MG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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