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MC10EP139DWG

Onsemi

MC10EP139DWG by Onsemi

MC10EP139DWG clock driver by Onsemi features 1.1 ns propagation delay, operates at -40 to 85 °C, and supports differential input conditioning. Ideal for industrial applications requiring ECL technology with a supply voltage range of 3-5.5 V and small outline package style.

Median Price

$12.088

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 49 parts In-Stock

1+ parts

$12.500

100+ parts

$8.180

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-

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49

$12.500

$8.180

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Rochester

USA . 10,479 parts In-Stock

1+ parts

-

100+ parts

$9.670

1k+ parts

$8.650

10k+ parts

$8.140

10,479

-

$9.670

$8.650

$8.140

Verical

USA . 5,257 parts In-Stock

1+ parts

-

100+ parts

$12.088

1k+ parts

$10.813

10k+ parts

$10.175

5,257

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$12.088

$10.813

$10.175

Distributors (In-Stock)

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Digiode

USA . 2,461 parts In-Stock

1+ parts

$6.488

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2,461

$6.488

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Vyrian

USA . 2,358 parts In-Stock

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2,358

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ACDS - Activité Composants Distribution Service

France . 30 parts In-Stock

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Bristol Electronics

USA . 30 parts In-Stock

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Dan-Mar Components

USA . 30 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 6,630 parts In-Stock

1+ parts

$6.030

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-

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6,630

$6.030

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Corphita

USA . 280 parts In-Stock

1+ parts

$6.147

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280

$6.147

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Corohmni

South Africa . 81 parts In-Stock

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$7.150

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81

$7.150

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AZTECH Wire

Italy . 747 parts In-Stock

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$17.280

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747

$17.280

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Continental Prestige Electronics

USA . 10,479 parts In-Stock

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10,479

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SupplyDigital Components

Austria . 6,358 parts In-Stock

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Microchip USA

USA . 5,701 parts In-Stock

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TANS Electronics

Latvia . 5,649 parts In-Stock

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Kulean Microsystems

USA . 4,266 parts In-Stock

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Problanco Electronics

Mexico . 4,223 parts In-Stock

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UHIMA Technologies

Türkiye . 285 parts In-Stock

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285

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Perfect Parts

USA . 175 parts In-Stock

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175

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GreenTree Electronics

Israel . 50 parts In-Stock

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Authorized Procurement Solutions

USA . 26 parts In-Stock

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Overview

Experience unmatched performance and reliability with the MC10EP139DWG clock driver by Onsemi. As a leader in clock drivers & buffers, Onsemi delivers cutting-edge technology that ensures precise timing in your applications. From industrial automation to telecommunications, this product offers unparalleled value with its fast propagation delay and differential input conditioning. Trust Onsemi to provide you with the quality and innovation you need to drive your projects forward.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides a durable and cost-effective housing for the clock driver, ensuring longevity and affordability.

Propagation Delay At Nominal Supply: 1.1 ns

Low propagation delay ensures fast and efficient signal transmission, making this clock driver suitable for high-speed applications.

Surface Mount: YES

Allows for easy and convenient installation on PCBs, saving space and simplifying the manufacturing process.

Input Conditioning: DIFFERENTIAL

Differential input conditioning allows for better noise rejection and improved signal integrity, making this clock driver suitable for demanding environments.

Nominal Supply Voltage / Vsup (V): 3.3

Operates at a commonly used supply voltage, ensuring compatibility with a wide range of systems.

No. of True Outputs: 4

Provides multiple true outputs, allowing for flexibility in driving multiple signals with precision and accuracy.

Technical Specifications

Clock Drivers & Buffers MC10EP139DWG attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC = 0V WITH VEE = -3V TO -5.5V

Family:

10E

Input Conditioning:

DIFFERENTIAL

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e3

Length:

12.8 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

20

No. of True Outputs:

4

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

-3.0/-5.5/3.3/5.0

Propagation Delay At Nominal Supply:

1.1 ns

Propagation Delay (tpd):

.9 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.1 ns

Maximum Seated Height:

2.65 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

MC10EP139DWG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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