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MC100LVEP34DTR2

Onsemi

MC100LVEP34DTR2 by Onsemi

MC100LVEP34DTR2 clock driver by Onsemi has 0.8 ns propagation delay, operates at -40 to 85 °C, and supports 3 true outputs. It is used in industrial applications requiring ECL technology for high-speed signal conditioning.

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Lifecycle Status

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7

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Vyrian

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PC Components Company LLC

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Extreme Components

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Cyclops Electronics Ltd

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AZTECH Wire

Italy . 417 parts In-Stock

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Component Stockers USA

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Problanco Electronics

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TANS Electronics

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SupplyDigital Components

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Kulean Microsystems

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Overview

Enhance your clock driver & buffer needs with the MC100LVEP34DTR2 by Onsemi. With a reputation for superior quality and reliability, Onsemi delivers cutting-edge solutions for demanding applications. Ideal for industries requiring precise timing and signal integrity, this product offers unmatched performance with a propagation delay of just 0.85 ns. Experience seamless integration, efficient power consumption, and enhanced signal conditioning with this top-of-the-line device. Upgrade to the MC100LVEP34DTR2 and elevate your system's capabilities today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is durable and reliable, making the product suitable for long-term use.

Propagation Delay At Nominal Supply: 0.85 ns

Low propagation delay ensures fast signal transmission, making the product efficient for time-sensitive applications.

Surface Mount: YES

Surface mount capability makes installation easier and more convenient.

Input Conditioning: DIFFERENTIAL

Differential input conditioning helps in reducing noise and improving signal integrity.

Nominal Supply Voltage / Vsup (V): 2.5

Operating at a standard supply voltage of 2.5V makes it compatible with various systems and circuits.

No. of Terminals: 16

Having 16 terminals allows for connectivity to multiple external components, enhancing versatility.

Minimum Operating Temperature: -40 °C

Wide operating temperature range (-40 °C to 85°C) ensures reliability in extreme conditions.

Maximum Seated Height: 1.2 mm

Slim profile with a maximum seated height of 1.2mm saves space in compact designs.

Minimum Supply Voltage (Vsup): 2.375 V

Support for a minimum supply voltage of 2.375V allows operation in low-power scenarios.

Technology: ECL

Employing Emitter-Coupled Logic technology offers high-speed performance suitable for demanding applications.

Technical Specifications

Clock Drivers & Buffers MC100LVEP34DTR2 attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC = 0V WITH VEE = -2.375V TO -3.8V

Family:

100LVE

Input Conditioning:

DIFFERENTIAL

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

5 mm

Logic IC Type:

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

16

No. of True Outputs:

3

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

+-2.375/+-3.8

Propagation Delay At Nominal Supply:

.85 ns

Propagation Delay (tpd):

.8 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.035 ns

Maximum Seated Height:

1.2 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

3.8 V

Minimum Supply Voltage (Vsup):

2.375 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

4.4 mm

Minimum fmax:

2800 MHz

Trade Compliance

MC100LVEP34DTR2 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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