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MC100LVEP210FARG

Onsemi

MC100LVEP210FARG by Onsemi

MC100LVEP210FARG clock driver by Onsemi has a propagation delay of 0.43 ns, operates at -40 to 85 °C, and supports differential input conditioning. Ideal for industrial applications requiring precise clock signal distribution in a compact flatpack package with low profile design.

Median Price

$14.635

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 2,490 parts In-Stock

1+ parts

$12.150

100+ parts

-

1k+ parts

-

10k+ parts

-

2,490

$12.150

-

-

-

Chip1Stop

Japan . 491 parts In-Stock

1+ parts

$14.635

100+ parts

$14.521

1k+ parts

$14.483

10k+ parts

-

491

$14.635

$14.521

$14.483

-

DigiKey

USA . 2,049 parts In-Stock

1+ parts

$20.240

100+ parts

$15.178

1k+ parts

$14.265

10k+ parts

$13.749

2,049

$20.240

$15.178

$14.265

$13.749

Rochester

USA . 13,506 parts In-Stock

1+ parts

-

100+ parts

$12.980

1k+ parts

$11.610

10k+ parts

$10.930

13,506

-

$12.980

$11.610

$10.930

Verical

USA . 4,444 parts In-Stock

1+ parts

-

100+ parts

$16.225

1k+ parts

$14.512

10k+ parts

-

4,444

-

$16.225

$14.512

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,450 parts In-Stock

1+ parts

$13.699

100+ parts

-

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1,450

$13.699

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-

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Vyrian

USA . 540 parts In-Stock

1+ parts

$14.420

100+ parts

-

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540

$14.420

-

-

-

Flip Electronics

USA . 6,000 parts In-Stock

1+ parts

-

100+ parts

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6,000

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 882 parts In-Stock

1+ parts

$12.978

100+ parts

-

1k+ parts

-

10k+ parts

-

882

$12.978

-

-

-

Corohmni

South Africa . 282 parts In-Stock

1+ parts

$13.214

100+ parts

-

1k+ parts

-

10k+ parts

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282

$13.214

-

-

-

Microchip USA

USA . 4,925 parts In-Stock

1+ parts

$38.830

100+ parts

$38.280

1k+ parts

$38.000

10k+ parts

$37.720

4,925

$38.830

$38.280

$38.000

$37.720

Continental Prestige Electronics

USA . 11,506 parts In-Stock

1+ parts

-

100+ parts

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11,506

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-

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SupplyDigital Components

Austria . 8,293 parts In-Stock

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8,293

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Perfect Parts

USA . 5,116 parts In-Stock

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5,116

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TANS Electronics

Latvia . 4,084 parts In-Stock

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4,084

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Problanco Electronics

Mexico . 3,917 parts In-Stock

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3,917

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Kulean Microsystems

USA . 2,846 parts In-Stock

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2,846

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Kepictronics

USA . 2,000 parts In-Stock

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2,000

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UHIMA Technologies

Türkiye . 784 parts In-Stock

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784

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Authorized Procurement Solutions

USA . 767 parts In-Stock

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767

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GreenTree Electronics

Israel . 767 parts In-Stock

1+ parts

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767

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Overview

Elevate your clock driver & buffer needs with the MC100LVEP210FARG by Onsemi. Crafted with precision and reliability, this product offers unparalleled performance in a wide range of applications. Whether you're looking to enhance your data communication systems or streamline your networking devices, this clock driver delivers seamless synchronization and efficient signal processing. Trust in Onsemi's expertise and innovative technology to elevate your projects to new heights. Experience the quality and value that the MC100LVEP210FARG brings to your designs today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides durability and makes the product lightweight, ideal for portable applications.

Propagation Delay At Nominal Supply: 0.75 ns

With a fast propagation delay, this clock driver/buffer ensures efficient and timely signal processing, critical for high-speed applications.

Surface Mount: YES

Being surface mountable makes installation and soldering easier, saving space on the PCB and enabling a more compact design.

Input Conditioning: DIFFERENTIAL

Differential input conditioning allows for noise rejection and improved signal integrity, ensuring accurate data transmission.

Nominal Supply Voltage / Vsup (V): 2.5

Operates at a standard 2.5V supply voltage, compatible with many systems and reducing the need for additional voltage regulators.

Maximum Operating Temperature: 85 °C

Capable of operating at high temperatures, making it suitable for industrial environments where temperature fluctuations are common.

Terminal Finish: MATTE TIN

Matte tin finish provides excellent solderability and corrosion resistance, ensuring reliable connections and longevity of the product.

Technology: ECL

ECL technology offers high-speed operation and low power consumption, making it an efficient choice for demanding clock distribution applications.

Moisture Sensitivity Level (MSL): 2

MSL 2 indicates a moderate sensitivity to moisture, allowing for safe storage and handling without immediate concerns for moisture-related damage.

Technical Specifications

Clock Drivers & Buffers MC100LVEP210FARG attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC = 0V WITH VEE = -2.375V TO -3.8V

Family:

100LVE

Input Conditioning:

DIFFERENTIAL

JESD-30 Code:

S-PQFP-G32

JESD-609 Code:

e3

Length:

7 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

2

No. of Functions:

2

No. of Inverted Outputs:

0

No. of Terminals:

32

No. of True Outputs:

5

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP32,.35SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

+-2.375/+-3.8

Propagation Delay At Nominal Supply:

.75 ns

Propagation Delay (tpd):

.43 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.025 ns

Maximum Seated Height:

1.6 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

3.8 V

Minimum Supply Voltage (Vsup):

2.375 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Trade Compliance

MC100LVEP210FARG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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