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MC100LVEL34DG

Onsemi

MC100LVEL34DG by Onsemi

MC100LVEL34DG clock driver by Onsemi features 1ns propagation delay, operates at -40 to 85 °C, and supports up to 1500MHz fmax. Ideal for industrial applications requiring differential input conditioning and a small outline package style.

Median Price

$5.063

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 14,355 parts In-Stock

1+ parts

-

100+ parts

$4.050

1k+ parts

$3.620

10k+ parts

$3.410

14,355

-

$4.050

$3.620

$3.410

DigiKey

USA . 14,355 parts In-Stock

1+ parts

-

100+ parts

$5.320

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14,355

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$5.320

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Verical

USA . 3,962 parts In-Stock

1+ parts

-

100+ parts

$5.063

1k+ parts

$4.525

10k+ parts

$4.263

3,962

-

$5.063

$4.525

$4.263

Distributors (In-Stock)

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Digiode

USA . 1,878 parts In-Stock

1+ parts

$4.294

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1,878

$4.294

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Vyrian

USA . 7,829 parts In-Stock

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7,829

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Semi Source

USA . 81 parts In-Stock

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81

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Distributors (Availability)

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Corphita

USA . 991 parts In-Stock

1+ parts

$4.068

100+ parts

-

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991

$4.068

-

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Corohmni

South Africa . 246 parts In-Stock

1+ parts

$4.080

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246

$4.080

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Component Stockers USA

USA . 16,966 parts In-Stock

1+ parts

$4.690

100+ parts

$4.410

1k+ parts

$3.990

10k+ parts

$3.990

16,966

$4.690

$4.410

$3.990

$3.990

AZTECH Wire

Italy . 1,059 parts In-Stock

1+ parts

$14.430

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1,059

$14.430

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QUARKTWIN TECHNOLOGY LTD

USA . 16,746 parts In-Stock

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Continental Prestige Electronics

USA . 14,379 parts In-Stock

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Problanco Electronics

Mexico . 7,569 parts In-Stock

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TANS Electronics

Latvia . 5,270 parts In-Stock

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Kulean Microsystems

USA . 5,123 parts In-Stock

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SupplyDigital Components

Austria . 4,299 parts In-Stock

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Microchip USA

USA . 4,251 parts In-Stock

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UHIMA Technologies

Türkiye . 547 parts In-Stock

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547

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Perfect Parts

USA . 90 parts In-Stock

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90

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Overview

Enhance your electronic designs with the MC100LVEL34DG clock driver by Onsemi, a trusted manufacturer known for delivering top-quality components. Ideal for clock distribution applications, this versatile product offers superior performance and reliability. With a fast propagation delay of just 1 ns and differential input conditioning, this clock driver ensures precise timing control. Its compact package design makes it easy to integrate into any project. Trust Onsemi to provide cutting-edge solutions that meet your needs. Choose the MC100LVEL34DG for unmatched value and exceptional results in your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and cost-effective.

Propagation Delay At Nominal Supply: 1 ns

Low propagation delay ensures high-speed performance and accurate timing.

Surface Mount: YES

Surface mount capability allows for easy and fast installation on PCBs.

Input Conditioning: DIFFERENTIAL

Differential input conditioning provides noise immunity and improves signal integrity.

Nominal Supply Voltage / Vsup (V): 3.3

Operates at a commonly used supply voltage, making it compatible with a wide range of systems.

No. of True Outputs: 3

Multiple true outputs provide flexibility in driving multiple clock signals.

Minimum fmax: 1500 MHz

High maximum frequency allows for fast data processing and signal transmission.

Technical Specifications

Clock Drivers & Buffers MC100LVEL34DG attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Additional Features:

NECL MODE: 0V VCC WITH VEE = -3V TO -3.8V

Family:

100LVEL

Input Conditioning:

DIFFERENTIAL

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e3

Length:

9.9 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

16

No. of True Outputs:

3

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

+-3.3

Propagation Delay At Nominal Supply:

1 ns

Propagation Delay (tpd):

1 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

3.8 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Minimum fmax:

1500 MHz

Trade Compliance

MC100LVEL34DG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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