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MC100LVEL11MNR4G

Onsemi

MC100LVEL11MNR4G by Onsemi

MC100LVEL11MNR4G clock driver by Onsemi has a propagation delay of 0.405 ns at 3.3V, suitable for industrial applications. It offers differential input conditioning, operates at -40 to 85 °C, and supports a max frequency of 1000 MHz. The package is small outline with a very thin profile and surface mountable.

Median Price

$2.712

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 368 parts In-Stock

1+ parts

$4.960

100+ parts

$3.149

1k+ parts

$2.714

10k+ parts

$2.653

368

$4.960

$3.149

$2.714

$2.653

Rochester

USA . 11,000 parts In-Stock

1+ parts

-

100+ parts

$2.420

1k+ parts

$2.170

10k+ parts

$2.040

11,000

-

$2.420

$2.170

$2.040

Verical

USA . 11,000 parts In-Stock

1+ parts

-

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-

1k+ parts

$2.712

10k+ parts

$2.550

11,000

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-

$2.712

$2.550

Flip Electronics (Authorized)

USA . 5,000 parts In-Stock

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5,000

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Distributors (In-Stock)

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Digiode

USA . 130 parts In-Stock

1+ parts

$2.565

100+ parts

-

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130

$2.565

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Vyrian

USA . 8,392 parts In-Stock

1+ parts

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8,392

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Flip Electronics

USA . 5,000 parts In-Stock

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,632 parts In-Stock

1+ parts

$2.430

100+ parts

-

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1,632

$2.430

-

-

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Corohmni

South Africa . 380 parts In-Stock

1+ parts

$2.700

100+ parts

-

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380

$2.700

-

-

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Microchip USA

USA . 3,099 parts In-Stock

1+ parts

$18.730

100+ parts

$18.610

1k+ parts

$18.560

10k+ parts

$18.500

3,099

$18.730

$18.610

$18.560

$18.500

Kulean Microsystems

USA . 7,165 parts In-Stock

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7,165

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Problanco Electronics

Mexico . 4,682 parts In-Stock

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4,682

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TANS Electronics

Latvia . 1,034 parts In-Stock

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1,034

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UHIMA Technologies

Türkiye . 405 parts In-Stock

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405

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SupplyDigital Components

Austria . 378 parts In-Stock

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378

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Overview

Enhance your clock distribution system with the MC100LVEL11MNR4G by Onsemi, a top-quality Clock Driver & Buffer that guarantees superior performance and reliability. Crafted by the trusted manufacturer Onsemi, this product is designed to meet the highest industry standards, ensuring precision and efficiency in all applications. Ideal for differential input conditioning, this Clock Driver offers a fast propagation delay of 0.405 ns at a nominal supply voltage of 3.3V, making it perfect for industrial-grade operations. Upgrade your systems today and experience the seamless functionality and remarkable value that the MC100LVEL11MNR4G brings to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan of the product.

Propagation Delay At Nominal Supply: 0.435 ns

Fast propagation delay ensures efficient signal processing and transmission within the circuit.

Input Conditioning: DIFFERENTIAL

Differential input conditioning helps in noise reduction and improves signal integrity, making it suitable for high-frequency applications.

Nominal Supply Voltage / Vsup (V): 3.3

Operates at a standard supply voltage, compatible with common power sources.

Maximum Operating Temperature: 85 °C

Can function effectively in high-temperature environments, suitable for industrial applications.

Technology: ECL

ECL technology offers high-speed operation and low power consumption, making the product efficient and reliable.

Technical Specifications

Clock Drivers & Buffers MC100LVEL11MNR4G attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Additional Features:

NECL MODE: 0V VCC WITH VEE = -3V TO -3.8V

Family:

100LVEL

Input Conditioning:

DIFFERENTIAL

JESD-30 Code:

S-PDSO-N8

Length:

2 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

8

No. of True Outputs:

2

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC8,.08,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

-3.3

Propagation Delay At Nominal Supply:

.435 ns

Propagation Delay (tpd):

.405 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.02 ns

Maximum Seated Height:

1 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

3.8 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

NICKEL GOLD PALLADIUM

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

2 mm

Minimum fmax:

1000 MHz

Trade Compliance

MC100LVEL11MNR4G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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