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MC100LVE111FNR2G

Onsemi

MC100LVE111FNR2G by Onsemi

MC100LVE111FNR2G clock driver by Onsemi features 0.65 ns propagation delay, 3.3V nominal voltage, and 9 true outputs. Ideal for industrial applications requiring high-speed signal conditioning with differential inputs in a compact chip carrier package.

Median Price

$8.660

Lifecycle Status

EOL

Suppliers In-Stock

7

In-Stock Inventory

1k+

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Mouser Electronics

USA . 62 parts In-Stock

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Vyrian

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Digiode

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Flip Electronics

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ACDS - Activité Composants Distribution Service

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ComSIT Distribution GmbH

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Bristol Electronics

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Corohmni

South Africa . 56 parts In-Stock

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Advanced Electronics

New Zealand . 3,000 parts In-Stock

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$23.343

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Microchip USA

USA . 3,008 parts In-Stock

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$28.100

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$27.700

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$27.500

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$27.300

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Lixinc

USA . 8,651 parts In-Stock

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Problanco Electronics

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Perfect Parts

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TANS Electronics

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UHIMA Technologies

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Kulean Microsystems

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Authorized Procurement Solutions

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GreenTree Electronics

Israel . 640 parts In-Stock

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Kepictronics

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SupplyDigital Components

Austria . 249 parts In-Stock

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Cyclops Electronics Ltd (Excess)

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ChipstoGo Electronic ltd

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Overview

Transform your clock signal with the MC100LVE111FNR2G by Onsemi. This Clock Driver & Buffer offers unparalleled quality and reliability, thanks to Onsemi's reputation as a top manufacturer in the industry. With applications in high-speed data communication systems and networking equipment, this product provides fast propagation delay and differential input conditioning for optimal performance. Experience the value and benefits of this innovative solution, designed to meet your needs and exceed your expectations. Elevate your projects with the MC100LVE111FNR2G today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and suitable for a wide range of operating temperatures, making the product reliable in various environments.

Nominal Supply Voltage / Vsup (V): 3.3

The nominal supply voltage of 3.3V ensures efficient power consumption and compatibility with a variety of systems.

Propagation Delay At Nominal Supply: 0.65 ns

The low propagation delay ensures fast signal transmission and reduces latency in the system.

Surface Mount: YES

Being surface mountable makes it easy to integrate into circuit boards, saving space and simplifying assembly.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures reliable performance in harsh environments with temperature variations.

No. of True Outputs: 9

Having 9 true outputs allows for multiple signals to be generated simultaneously, increasing versatility in signal processing.

Technical Specifications

Clock Drivers & Buffers MC100LVE111FNR2G attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC = 0V WITH VEE = -3V TO -3.8V

Family:

100LVE

Input Conditioning:

DIFFERENTIAL

JESD-30 Code:

S-PQCC-J28

JESD-609 Code:

e3

Length:

11.505 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

28

No. of True Outputs:

9

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC28,.5SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Power Supplies (V):

+-3/+-3.8

Propagation Delay At Nominal Supply:

.65 ns

Propagation Delay (tpd):

.68 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.05 ns

Maximum Seated Height:

4.57 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

3.8 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

11.505 mm

Trade Compliance

MC100LVE111FNR2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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