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MC100H646FNG

Onsemi

MC100H646FNG by Onsemi

MC100H646FNG clock driver by Onsemi features 7ns propagation delay, 6.4ns tpd, and 24A max I (ol). Ideal for applications requiring differential mux input conditioning in a square chip carrier package with 28 terminals.

Median Price

$6.312

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,221 parts In-Stock

1+ parts

-

100+ parts

$5.610

1k+ parts

$5.020

10k+ parts

$4.720

1,221

-

$5.610

$5.020

$4.720

Verical

USA . 814 parts In-Stock

1+ parts

-

100+ parts

$7.013

1k+ parts

$6.275

10k+ parts

$5.900

814

-

$7.013

$6.275

$5.900

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 960 parts In-Stock

1+ parts

$5.938

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-

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960

$5.938

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Vyrian

USA . 6,713 parts In-Stock

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6,713

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Distributors (Availability)

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Corphita

USA . 191 parts In-Stock

1+ parts

$5.625

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-

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191

$5.625

-

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Corohmni

South Africa . 131 parts In-Stock

1+ parts

$5.650

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131

$5.650

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Component Stockers USA

USA . 970 parts In-Stock

1+ parts

$6.330

100+ parts

$5.960

1k+ parts

$5.390

10k+ parts

-

970

$6.330

$5.960

$5.390

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AZTECH Wire

Italy . 103 parts In-Stock

1+ parts

$17.590

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103

$17.590

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Kulean Microsystems

USA . 8,237 parts In-Stock

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8,237

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TANS Electronics

Latvia . 8,234 parts In-Stock

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Problanco Electronics

Mexico . 5,899 parts In-Stock

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5,899

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Microchip USA

USA . 5,175 parts In-Stock

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Kepictronics

USA . 2,000 parts In-Stock

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SupplyDigital Components

Austria . 1,393 parts In-Stock

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Continental Prestige Electronics

USA . 1,221 parts In-Stock

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UHIMA Technologies

Türkiye . 128 parts In-Stock

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128

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Overview

Discover the cutting-edge MC100H646FNG clock driver and buffer by Onsemi, a top-tier manufacturer renowned for high-quality products. Ideal for applications requiring precise timing, this chip carrier device offers a nominal supply voltage of 5V and 3-STATE output characteristics. With a propagation delay of just 6.4ns, differential mux input conditioning, and 8 true outputs, this clock driver ensures optimal performance. Trust Onsemi to deliver reliable solutions that enhance your systems' efficiency and functionality. Experience superior technology with the MC100H646FNG today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLastic/Epoxy material provides durability and protection to the internals of the clock driver, ensuring long-term reliability.

Propagation Delay At Nominal Supply: 7 ns

Low propagation delay helps in maintaining accurate timing signals, making this clock driver suitable for high precision applications.

Surface Mount: YES

Surface mount allows for easy and efficient installation on PCBs, saving space and simplifying assembly process.

Input Conditioning: DIFFERENTIAL MUX

Differential MUX input conditioning ensures reliable data transmission and noise immunity, making this clock driver suitable for communication systems.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard voltage of 5V makes integration with existing systems convenient and reduces compatibility issues.

Maximum I (ol): 24 Amp

High output current capability allows for driving multiple loads or components without external amplification, increasing versatility of the clock driver.

Output Characteristics: 3-STATE

3-STATE output allows for tristate operation, enabling efficient bus sharing and reducing bus contention issues in multi-device systems.

Technology: ECL

ECL technology offers high speed and low power consumption, ideal for applications requiring fast signal propagation and minimal power usage.

Technical Specifications

Clock Drivers & Buffers MC100H646FNG attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Family:

100H

Input Conditioning:

DIFFERENTIAL MUX

JESD-30 Code:

S-PQCC-J28

JESD-609 Code:

e3

Length:

11.505 mm

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

28

No. of True Outputs:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC28,.5SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

7 ns

Propagation Delay (tpd):

6.4 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.5 ns

Maximum Seated Height:

4.57 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

11.505 mm

Trade Compliance

MC100H646FNG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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