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MC100H643FNG

Onsemi

MC100H643FNG by Onsemi

MC100H643FNG clock driver by Onsemi features 5.9ns propagation delay, 5V nominal voltage, and 8 true outputs. Ideal for applications requiring differential latched input conditioning in commercial extended temperature environments. Package style is chip carrier with 28 terminals and J bend terminal form.

Median Price

$10.834

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,361 parts In-Stock

1+ parts

-

100+ parts

$9.630

1k+ parts

$8.620

10k+ parts

$8.110

1,361

-

$9.630

$8.620

$8.110

Verical

USA . 917 parts In-Stock

1+ parts

-

100+ parts

$12.037

1k+ parts

$10.775

10k+ parts

$10.137

917

-

$12.037

$10.775

$10.137

Distributors (In-Stock)

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Digiode

USA . 1,937 parts In-Stock

1+ parts

$10.165

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$10.165

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Vyrian

USA . 7,081 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 1,833 parts In-Stock

1+ parts

$9.630

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1,833

$9.630

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Corohmni

South Africa . 343 parts In-Stock

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$10.700

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343

$10.700

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AZTECH Wire

Italy . 325 parts In-Stock

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$21.350

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325

$21.350

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TANS Electronics

Latvia . 7,258 parts In-Stock

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Problanco Electronics

Mexico . 4,510 parts In-Stock

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Kulean Microsystems

USA . 2,588 parts In-Stock

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SupplyDigital Components

Austria . 1,422 parts In-Stock

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Continental Prestige Electronics

USA . 1,361 parts In-Stock

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UHIMA Technologies

Türkiye . 477 parts In-Stock

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477

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Microchip USA

USA . 265 parts In-Stock

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Overview

Enhance your electronic designs with the MC100H643FNG clock driver by Onsemi. With a focus on quality and reliability, Onsemi is a trusted manufacturer in the industry. This clock driver offers fast propagation delay, differential latched input conditioning, and easy surface mounting. Perfect for applications requiring precision timing, the MC100H643FNG provides customers with dependable performance and value. Upgrade your projects today with this innovative product from Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the clock driver, ensuring long-lasting performance.

Propagation Delay At Nominal Supply: 5.9 ns

Offers fast signal propagation, making this clock driver suitable for high-speed applications.

Surface Mount: YES

Enables easy and efficient installation on circuit boards, reducing assembly time and costs.

Input Conditioning: DIFFERENTIAL LATCHED

Ensures reliable and accurate signal processing, enhancing the overall performance of the clock driver.

Nominal Supply Voltage / Vsup (V): 5

Compatible with common power supply voltages, making it easy to integrate this clock driver into various systems.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, allowing for reliable operation in demanding environments.

Width: 11.505 mm

Compact size enables space-saving installation in tight layouts or designs.

Temperature Grade: COMMERCIAL EXTENDED

Suitable for use in commercial applications with extended temperature requirements, ensuring versatility and reliability.

Technology: ECL

Utilizes Emitter-Coupled Logic technology, known for high-speed operation and low power consumption, making it ideal for clock driver applications.

Technical Specifications

Clock Drivers & Buffers MC100H643FNG attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Family:

100H

Input Conditioning:

DIFFERENTIAL LATCHED

JESD-30 Code:

S-PQCC-J28

JESD-609 Code:

e3

Length:

11.505 mm

Logic IC Type:

Maximum I (ol):

48 Amp

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

28

No. of True Outputs:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC28,.5SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Power Supplies (V):

5,-4.5

Propagation Delay At Nominal Supply:

5.9 ns

Propagation Delay (tpd):

5.5 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.5 ns

Maximum Seated Height:

4.57 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

11.505 mm

Trade Compliance

MC100H643FNG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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