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MBT3904DW1T2

Onsemi

MBT3904DW1T2 by Onsemi

MBT3904DW1T2 by Onsemi is a NPN BJT transistor with 2 elements, suitable for amplifier applications. It has a min hFE of 30 and max VCE of 40V. With a fT of 300MHz, it offers fast ton of 70ns and toff of 250ns in a small outline package.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 1,814 parts In-Stock

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Vyrian

USA . 1,675 parts In-Stock

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TANS Electronics

Latvia . 7,311 parts In-Stock

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Problanco Electronics

Mexico . 7,148 parts In-Stock

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SupplyDigital Components

Austria . 6,069 parts In-Stock

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Kulean Microsystems

USA . 1,664 parts In-Stock

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Corphita

USA . 1,510 parts In-Stock

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UHIMA Technologies

Türkiye . 135 parts In-Stock

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Corohmni

South Africa . 116 parts In-Stock

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Overview

Unleash the power of innovation with the MBT3904DW1T2 by Onsemi, a top-tier manufacturer renowned for cutting-edge technology. As a high-quality Small Signal Bipolar Junction Transistor (BJT), this NPN transistor offers unparalleled performance in amplifier applications. With its sleek rectangular package design and Gull Wing terminals, this transistor provides seamless integration in any project. Experience the benefits of a 300 MHz nominal transition frequency, maximum collector-emitter voltage of 40V, and a minimum DC current gain of 30. Elevate your designs with the MBT3904DW1T2 and unlock a world of possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the transistor, making it suitable for various environments.

Polarity or Channel Type: NPN

NPN transistors are commonly used in amplification circuits, making this transistor suitable for amplifier applications.

Configuration: SEPARATE, 2 ELEMENTS

Having 2 separate elements allows for versatile circuit design and functionality.

Transistor Application: AMPLIFIER

Designed specifically for amplifier applications, ensuring optimal performance in such circuits.

Surface Mount: YES

Allows for easy and convenient installation on PCBs, saving space and simplifying assembly.

Minimum DC Current Gain (hFE): 30

Ensures stable and reliable amplification of signals in various circuit configurations.

Maximum Collector-Emitter Voltage: 40 V

Can handle relatively high voltage levels, making it versatile for different voltage requirements.

Maximum Turn On Time (ton): 70 ns

Fast turn-on time ensures quick response in switching applications.

Maximum Collector Current (IC): 0.2 A

Can handle up to 0.2 A of collector current, suitable for many low-power applications.

Nominal Transition Frequency (fT): 300 MHz

High transition frequency allows for high-frequency amplification applications with low distortion.

Technical Specifications

Small Signal Bipolar Junction Transistors (BJT) MBT3904DW1T2 attributes and parameters. Explore more Small Signal Bipolar Junction Transistors (BJT) devices from Onsemi

Specs

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

40 V

Configuration:

Minimum DC Current Gain (hFE):

30

JESD-30 Code:

R-PDSO-G6

No. of Elements:

2

No. of Terminals:

6

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

NPN

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Nominal Transition Frequency (fT):

Maximum Turn Off Time (toff):

250 ns

Maximum Turn On Time (ton):

70 ns

Trade Compliance

MBT3904DW1T2 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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